Patents by Inventor Hideo Andrew Koyanagi

Hideo Andrew Koyanagi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Methods of co-bonding a first thermoset composite and a second thermoset composite to define a cured composite part
    Patent number: 11247409
    Abstract: Methods of co-bonding a first thermoset composite (TSC) and a second TSC to define a cured composite part are disclosed herein. The methods include partially curing the first TSC to a target state of cure (SOC) to define a first partially cured TSC. The partially curing is based, at least in part, on a maximum temperature of the first TSC during the partially curing and on an elapsed time that an actual temperature of the first TSC is greater than a threshold temperature. The methods further include combining the first partially cured TSC with the second TSC to define a partially cured TSC assembly and heating the partially cured TSC assembly to bond the first partially cured TSC to the second TSC, cure the partially cured TSC assembly, and produce a cured composite part.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: February 15, 2022
    Assignees: The Boeing Company, Toray Industries, Inc.
    Inventors: Karl M. Nelson, Travis James Sherwood, Hardik Dalal, Felix N. Nguyen, Dongyeon Lee, Kenichi Yoshioka, Hideo Andrew Koyanagi
  • METHODS OF CO-BONDING A FIRST THERMOSET COMPOSITE AND A SECOND THERMOSET COMPOSITE TO DEFINE A CURED COMPOSITE PART
    Publication number: 20200055261
    Abstract: Methods of co-bonding a first thermoset composite (TSC) and a second TSC to define a cured composite part are disclosed herein. The methods include partially curing the first TSC to a target state of cure (SOC) to define a first partially cured TSC. The partially curing is based, at least in part, on a maximum temperature of the first TSC during the partially curing and on an elapsed time that an actual temperature of the first TSC is greater than a threshold temperature. The methods further include combining the first partially cured TSC with the second TSC to define a partially cured TSC assembly and heating the partially cured TSC assembly to bond the first partially cured TSC to the second TSC, cure the partially cured TSC assembly, and produce a cured composite part.
    Type: Application
    Filed: March 15, 2018
    Publication date: February 20, 2020
    Inventors: Karl M. Nelson, Travis James Sherwood, Hardik Dalal, Felix N. Nguyen, Dongyeon Lee, Kenichi Yoshioka, Hideo Andrew Koyanagi