Patents by Inventor Hideo Arihara

Hideo Arihara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20140287218
    Abstract: A single-layered thermally adhesive polyimide film; a method for producing the thermally adhesive polyimide film; and a method for producing a polyimide metal laminate produced using the thermally adhesive polyimide film. The single-layer thermally adhesive polyimide film is produced by polymerizing a tetracarboxylic acid dianhydride component and a diamine component, wherein the tetracarboxylic acid dianhydride component includes 2,3,3?,4?-biphenyltetracarboxylic acid dianhydride and 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride and the diamine component includes an aromatic diamine compound represented by the following formula (I) as a main component wherein X is O, CO, C(CH3)2, CH2, SO2, S, or a direct bond, and in cases of two or more modes of bonding, each is the same or different; and n is an integer of 0 to 4.
    Type: Application
    Filed: August 17, 2012
    Publication date: September 25, 2014
    Applicant: UBE INDUSTRIES, LTD.
    Inventors: Takuro Kochiyama, Keigo Nagao, Takeshi Uekido, Hideo Arihara