Patents by Inventor Hideo Arikawa

Hideo Arikawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Aqueous dispersion composition for imparting chipping resistance
    Patent number: 6897252
    Abstract: Disclosed is a chipping resistance-imparting aqueous dispersion composition comprising a nonvolatile component (film-forming component) dispersed in water, said nonvolatile component containing an olefin thermoplastic elastomer or a styrene/conjugated diene block copolymer or its hydrogenation product. A coating film obtained by the use of the aqueous dispersion composition as an aqueous primer or an additive to a water paint is excellent in chipping resistance as well as in other properties such as film appearance, adhesion properties, heat resistance, moisture resistance and gasoline resistance.
    Type: Grant
    Filed: July 27, 2001
    Date of Patent: May 24, 2005
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hideo Arikawa, Suguru Tokita
  • Aqueous dispersion composition for imparting chipping resistance
    Publication number: 20020198298
    Abstract: Disclosed is a chipping resistance-imparting aqueous dispersion composition comprising a nonvolatile component (film-forming component) dispersed in water, said nonvolatile component containing an olefin thermoplastic elastomer or a styrene/conjugated diene block copolymer or its hydrogenation product. A coating film obtained by the use of the aqueous dispersion composition as an aqueous primer or an additive to a water paint is excellent in chipping resistance as well as in other properties such as film appearance, adhesion properties, heat resistance, moisture resistance and gasoline resistance.
    Type: Application
    Filed: March 26, 2002
    Publication date: December 26, 2002
    Inventors: Hideo Arikawa, Suguru Tokita