Patents by Inventor Hideo Hagiwara
Hideo Hagiwara has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7270365Abstract: A spare tire storage structure for a vehicle, in which a spare tire is placed horizontally on a rear floor of the vehicle with a part thereof projected upward from a main surface of the rear floor. The structure includes: a guide stopper provided adjacent to and in front of the spare tire, which deforms to be bent upon contact with a front portion of the spare tire that is moved forward in a vehicle collision, and lifts and guides the front portion of the spare tire upward. A portion of the guide stopper that deforms to be bent is configured to absorb a kinetic energy generated by the forward movement of the spare tire.Type: GrantFiled: October 26, 2006Date of Patent: September 18, 2007Assignee: Nissan Motor Co., Ltd.Inventors: Shinya Suzuki, Hideo Hagiwara, Toshiharu Suzuki
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Publication number: 20070096488Abstract: A spare tire storage structure for a vehicle, in which a spare tire is placed horizontally on a rear floor of the vehicle with a part thereof projected upward from a main surface of the rear floor. The structure includes: a guide stopper provided adjacent to and in front of the spare tire, which deforms to be bent upon contact with a front portion of the spare tire that is moved forward in a vehicle collision, and lifts and guides the front portion of the spare tire upward. A portion of the guide stopper that deforms to be bent is configured to absorb a kinetic energy generated by the forward movement of the spare tire.Type: ApplicationFiled: October 26, 2006Publication date: May 3, 2007Inventors: Shinya Suzuki, Hideo Hagiwara, Toshiharu Suzuki
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Patent number: 7153631Abstract: There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): ?wherein R1 represents and R2 represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.Type: GrantFiled: November 17, 2003Date of Patent: December 26, 2006Assignee: Hitachi Chemical Co., Ltd.Inventors: Hideo Hagiwara, Makoto Kaji, Masataka Nunomura
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Patent number: 6991210Abstract: The purpose of this invention is to provide an actuator for valve driving without enlarging its size, without increasing the cost, and without reducing the pressure receiving area of the pistons.Type: GrantFiled: May 23, 2003Date of Patent: January 31, 2006Assignee: Tomoe Technical Research Company Ltd.Inventor: Hideo Hagiwara
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Publication number: 20050127312Abstract: The purpose of this invention is to provide an actuator for valve driving without enlarging its size, without increasing the cost, and without reducing the pressure receiving area of the pistons.Type: ApplicationFiled: May 23, 2003Publication date: June 16, 2005Inventor: Hideo Hagiwara
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Publication number: 20040106066Abstract: There are disclosed a photosensitive resin composition which comprisesType: ApplicationFiled: November 17, 2003Publication date: June 3, 2004Inventors: Hideo Hagiwara, Makoto Kaji, Masataka Nunomura
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Publication number: 20020004177Abstract: There are disclosed a photosensitive resin composition which comprisesType: ApplicationFiled: January 14, 2000Publication date: January 10, 2002Inventors: Hideo Hagiwara, Makoto Kaji, Masataka Nunomura
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Patent number: 6309791Abstract: A polyimide precursor having repeating units of the formula: wherein R1 is a tetravalent organic group; and R2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.Type: GrantFiled: August 8, 2000Date of Patent: October 30, 2001Assignee: Hitachi Chemical Co.Inventors: Hideo Hagiwara, Yasunori Kojima, Makoto Kaji, Mitsumasa Kojima, Haruhiko Kikkawa
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Patent number: 6197475Abstract: There is disclosed a positive type photosensitive resin composition which comprises an alkali-soluble polymer (A) having a carboxyl group and/or a phenolic hydroxyl group, and a compound (B) which forms an amine compound with irradiation of light.Type: GrantFiled: April 28, 1994Date of Patent: March 6, 2001Assignee: Hitachi Chemical Co., Ltd.Inventors: Hideo Hagiwara, Makoto Kaji, Yasunori Kojima
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Patent number: 6194126Abstract: There are disclosed a photosensitive resin composition which comprises (A) a polyamic acid having recurring units represented by the formula (I): wherein R1 represents and R2 represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.Type: GrantFiled: August 20, 1998Date of Patent: February 27, 2001Assignee: Hitachi Chemical Co., Ltd.Inventors: Hideo Hagiwara, Makoto Kaji, Masataka Nunomura
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Patent number: 6143475Abstract: A polyimide precursor having repeating units of the formula: ##STR1## wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.Type: GrantFiled: May 22, 1998Date of Patent: November 7, 2000Assignee: Hitachi Chemical Co.Inventors: Hideo Hagiwara, Yasunori Kojima, Makoto Kaji, Mitsumasa Kojima, Haruhiko Kikkawa
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Patent number: 6071667Abstract: A polyimide precursor having repeating units of the formula: wherein R.sup.1 is a tetravalent organic group; and R.sup.2 is a divalent diphenyl group, is excellent in image formation and particularly suitable for forming a pattern using an i-line stepper, and gives a photosensitive resin composition by imparting photosensitivity to the polyimide precursor, said photosensitive resin composition being suitable for forming surface protective films for semiconductor devices or interlaminar insulating films for multilayer wiring boards.Type: GrantFiled: April 10, 1996Date of Patent: June 6, 2000Assignee: Hitachi Chemical Co., Ltd.Inventors: Hideo Hagiwara, Yasunori Kojima, Makoto Kaji, Mitsumasa Kojima, Haruhiko Kikkawa
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Patent number: 6012477Abstract: A sewage by-pass discharging apparatus for sewage pipe works comprises an upstream side stop cock disposed at an upstream side of a sewage pipe laid in a working area, a downstream side stop cock disposed at a downstream side of the sewage pipe laid in the working area, a member for discharging the sewage accumulated at an upstream side from the upstream side stop cock to a downstream side from the downstream sides stop cock by bypassing the sewage pipe, a drain pipe connected to the sewage pipe laid in the working area, a drain pit connected to the drain pipe, a stop cock for preventing the sewage from flowing from the drain pit into the drain pipe, and a unit discharging the sewage reserved in the drain pit to downstream side from the downstream side stop cock. According to this structure, the working to the sewage pipe can be performed while the sewage system is maintained in a state of being utilized as usual by the residents of the respective homes.Type: GrantFiled: March 11, 1998Date of Patent: January 11, 2000Assignee: Komatsu Ltd.Inventors: Hideo Hagiwara, Sadamasa Kodaira
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Patent number: 5996621Abstract: A sewage by-pass drainage system for sewage pipe works comprises a submerge pump provided in a first manhole, a sewage pipe between a second manhole and a third manhole located at a downstream side of the first manhole being taken as a working zone, an upstream side stop plug being provided at an outflow side of a sewage pipe between the first manhole and the second manhole, and a downstream side stop plug being provided at an inflow side of a sewage pipe opening to the third manhole, a suction pipe of a suction drainage apparatus provided on the ground being projected into an upstream side of the upstream side stop plug, a discharge pipe of the suction drainage apparatus being projected into a downstream side of the downstream side stop plug, and a discharge pipe of the submerge pump being arranged to the downstream side of the downstream side stop plug. By this, a sewage or the like can be drained even from the deeply buried sewage pipe so that an odor may not leak above the ground.Type: GrantFiled: March 26, 1998Date of Patent: December 7, 1999Assignee: Komatsu Ltd.Inventors: Hideo Hagiwara, Sadamasa Kodaira
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Patent number: 5856059Abstract: There are disclosed a photosensitive resin composition which comprises(A) a polyamic acid having recurring units represented by the formula (I): ##STR1## represents a divalent organic group, and (B) an acryl compound having an amino group, and also a photosensitive resin composition for an i-line stepper which further comprises a photoinitiator in addition to the photosensitive resin composition.Type: GrantFiled: June 17, 1996Date of Patent: January 5, 1999Assignee: Hitachi Chemical Co., Ltd.Inventors: Hideo Hagiwara, Makoto Kaji, Masataka Nunomura
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Patent number: 5847071Abstract: A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.Type: GrantFiled: April 17, 1997Date of Patent: December 8, 1998Assignee: Hitachi, Chemical Co., Ltd.Inventors: Hideo Hagiwara, Makoto Kaji, Hiroshi Nishizawa, Kenji Suzuki, Yasunori Kojima
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Patent number: 5811218Abstract: An N-aryl-.alpha.-amino acid (I), which is a novel compound, is effective as a photoinitiator. The photoinitiator composition including this photoinitiator is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation. Further, a photoinitiator composition (A) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and/or an azabenzalcyclohexanone (III), or a photoinitiator composition (B) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and a titanocene (IV), or a photoinitiator composition (C) comprising a 3-substituted coumarin (II), a titanocene (IV) and an oxime ester (V), is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation.Type: GrantFiled: July 17, 1995Date of Patent: September 22, 1998Assignee: Hitachi Chemical Company, Ltd.Inventors: Makoto Kaji, Yasunori Kojima, Shigeki Katogi, Masataka Nunomura, Hideo Hagiwara, Dai Kawasaki, Mitsumasa Kojima, Hiroshi Suzuki, Hidetaka Satou
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Patent number: 5668248Abstract: A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.Type: GrantFiled: August 22, 1995Date of Patent: September 16, 1997Assignee: Hitachi Chemical Co., Ltd.Inventors: Hideo Hagiwara, Makoto Kaji, Hiroshi Nishizawa, Kenji Suzuki, Yasunori Kojima
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Patent number: 5484685Abstract: A naphthalocyanine derivative of the formula: ##STR1## wherein M, Y, R.sup.1, k, l, m, n are as defined in the specification, is an effective substance for forming a recording layer on a substrate of an optical recording medium having high sensitivity with good properties.Type: GrantFiled: May 30, 1991Date of Patent: January 16, 1996Assignees: Hitachi, Ltd., Hitachi Chemical Co., Ltd.Inventors: Seiji Tai, Nobuyuki Hayashi, Koichi Kamijima, Mitsuo Katayose, Takayuki Akimoto, Shigeru Hayashida, Hideo Hagiwara, Susumu Era, Setsuo Kobayashi, Akio Mukoh
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Patent number: 5472823Abstract: A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: ##STR1## and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion.Type: GrantFiled: January 15, 1993Date of Patent: December 5, 1995Assignee: Hitachi Chemical Co., Ltd.Inventors: Hideo Hagiwara, Makoto Kaji, Hiroshi Nishizawa, Kenji Suzuki, Yasunori Kojima