Patents by Inventor Hideo Hatanaka
Hideo Hatanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7059039Abstract: A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.Type: GrantFiled: January 21, 2004Date of Patent: June 13, 2006Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masahide Tsukamoto, Masanaru Hasegawa, Hideo Hatanaka
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Patent number: 6780493Abstract: In a wiring board, predetermined wiring patterns which are formed on both sides of an insulation substrate are electrically connected by an electrically conductive material provided in through holes formed through the insulation substrate. The insulation substrate is composed of a resin impregnated fibrous sheet and a heat resistant film. The present invention solves the problems of the wiring board which are caused by irregularities on the surface of the resin impregnated fibrous sheet. The problems include insufficient adhesion strength between the wiring pattern and the insulation substrate or the limitation of fineness of the wiring pattern due to the irregularities on the surface of the printed wiring board which are formed upon the thermocompression bonding process.Type: GrantFiled: October 25, 2001Date of Patent: August 24, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Osamu Noda, Hideo Hatanaka, Kazunori Sakamoto, Masanaru Hasegawa
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Publication number: 20040148770Abstract: A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.Type: ApplicationFiled: January 21, 2004Publication date: August 5, 2004Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.Inventors: Masahide Tsukamoto, Masanaru Hasegawa, Hideo Hatanaka
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Patent number: 6703565Abstract: A printed wiring board includes at least one insulator sheet having through holes filled with conductive material and a conductive wiring pattern. The wiring pattern is embedded in the insulator sheet so that an upper surface of the wiring pattern and surrounding portions of the insulator sheet form a flat surface. The insulator sheet may be made from a glass-epoxy prepreg or of a polyester or polyimide sheet coated with an adhesive or glue. The wiring pattern can be transferred to the insulator sheet from a surface of a releasable supporting sheet.Type: GrantFiled: October 11, 2000Date of Patent: March 9, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masahide Tsukamoto, Masanaru Hasegawa, Hideo Hatanaka
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Patent number: 6687985Abstract: A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board (11) is formed in the manner that a plurality of resin-impregnated-fiber-sheets having mother wiring layers (13) and first inner-via-hole conductors (14) for connecting the wiring layers (13) each other are laminated. The mother wiring board (11) comprises a base board (11a) and container board (11b) having an opening for forming a cavity (15). The carrier wiring board (16) has lands (17) for mounting LSI bare chips, wirings (18), a plurality of carrier-board-wiring-layers (19) and second inner-via-hole conductors (20) for connecting the wiring layers (19) each other.Type: GrantFiled: July 12, 2001Date of Patent: February 10, 2004Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazunori Sakamoto, Hideo Hatanaka, Yukihiro Ishimaru, Tosaku Nishiyama
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Patent number: 6465082Abstract: A stress relaxation type electronic component which is to be mounted on a circuit board, wherein a stress relaxation mechanism member is disposed on a surface of said electronic component, said surface being on a side of a connection portion where said electronic component is to be connected to said circuit board, and said stress relaxation mechanism member is electrically conductive.Type: GrantFiled: May 16, 2000Date of Patent: October 15, 2002Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hiroaki Takezawa, Masahide Tsukamoto, Minehiro Itagaki, Yoshihiro Bessho, Hideo Hatanaka, Yasushi Fukumura, Kazuo Eda, Toru Ishida
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Publication number: 20020045394Abstract: In a wiring board, predetermined wiring patterns which are formed on both sides of an insulation substrate are electrically connected by an electrically conductive material provided in through holes formed through the insulation substrate. The insulation substrate is composed of a resin impregnated fibrous sheet and a heat resistant film. The present invention solves the problems of the wiring board which are caused by irregularities on the surface of the resin impregnated fibrous sheet. The problems include insufficient adhesion strength between the wiring pattern and the insulation substrate or the limitation of fineness of the wiring pattern due to the irregularities on the surface of the printed wiring board which are formed upon the thermocompression bonding process.Type: ApplicationFiled: October 25, 2001Publication date: April 18, 2002Inventors: Osamu Noda, Hideo Hatanaka, Kazunori Sakamoto, Masanaru Hasegawa
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Publication number: 20020020554Abstract: A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board (11) is formed in the manner that a plurality of resin-impregnated-fiber-sheets having mother wiring layers (13) and first inner-via-hole conductors (14) for connecting the wiring layers (13) each other are laminated. The mother wiring board (11) comprises a base board (11a) and container board (11b) having an opening for forming a cavity (15). The carrier wiring board (16) has lands (17) for mounting LSI bare chips, wirings (18), a plurality of carrier-board-wiring-layers (19) and second inner-via-hole conductors (20) for connecting the wiring layers. (19) each other.Type: ApplicationFiled: July 12, 2001Publication date: February 21, 2002Inventors: Kazunori Sakamoto, Hideo Hatanaka, Yukihiro Ishimaru, Tosaku Nishiyama
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Patent number: 6281446Abstract: A multilayer wiring board comprising a mother wiring board and a carrier wiring board, in which all of the composing layers have IVH structure. The mother wiring board (11) is formed in the manner that a plurality of resin-impregnated-fiber-sheets having mother wiring layers (13) and first inner-via-hole conductors (14) for connecting the wiring layers (13) each other are laminated. The mother wiring board (11) comprises a base board (11a) and container board (11b) having an opening for forming a cavity (15). The carrier wiring board (16) has lands (17) for mounting LSI bare chips, wirings (18), a plurality of carrier-board-wiring-layers (19) and second inner-via-hole conductors (20) for connecting the wiring layers (19) each other.Type: GrantFiled: February 16, 1999Date of Patent: August 28, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazunori Sakamoto, Hideo Hatanaka, Yukihiro Ishimaru, Tosaku Nishiyama
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Patent number: 6195882Abstract: A method for producing printed wiring boards comprises the steps of perforating through holes at predetermined positions in an adhesive insulator sheet, filling the through holes with a conductive material such as a conductive paste or metal balls, transferring conductive wiring patterns that have been formed on surfaces of releasable supporting sheets onto the surfaces of the adhesive insulator sheet by heat and pressure. Simultaneously, interlayer via-connections are performed by means of the conductive material filled into the through holes.Type: GrantFiled: September 5, 1997Date of Patent: March 6, 2001Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masahide Tsukamoto, Masanaru Hasegawa, Hideo Hatanaka
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Patent number: 6045897Abstract: A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan .delta.) peak value at 30-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.Type: GrantFiled: October 26, 1998Date of Patent: April 4, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masayuki Sakai, Hideo Hatanaka, Masahide Tsukamoto, Seiichi Nakatani, Masayuki Okano, Tamao Kojima
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Patent number: 6015872Abstract: To address the problem of difficulty of making compatible flame retarding property and electrical and mechanical characteristics in conventional printed interconnection substrates, the present invention employs, in a substrate for printed circuit board of which the insulating material comprises a thermosetting resin composition comprising an epoxy resin main component and a curing agent, an epoxy resin containing a brominated phenol novolac type epoxy resin having a biphenyl skeleton as the main component or a curing agent containing a brominated phenol novolac type curing resin. It provides a substrate for printed circuit board which has an extremely high flame retarding property and a superior heat resistance and humidity resistance, as well as a high insulating reliability and a superior high frequency characteristic.Type: GrantFiled: May 20, 1998Date of Patent: January 18, 2000Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yoshihiro Kawakita, Masanaru Hasegawa, Kazunori Sakamoto, Hideo Hatanaka
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Patent number: 5858884Abstract: A nonwoven fabric cloth substrate for printed wiring boards containing aromatic polyamide fibers and having a 0.7-1.0 dynamic elastic modulus ratio (E' (250.degree. C.)/E' (30.degree. C.)) and a 0.05 or less loss tangent (Tan.delta.) peak value at 30.degree.-250.degree. C., and a prepreg and a printed wiring board using the nonwoven fabric cloth substrate.Type: GrantFiled: May 15, 1997Date of Patent: January 12, 1999Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Masayuki Sakai, Hideo Hatanaka, Masahide Tsukamoto, Seiichi Nakatani, Masayuki Okano, Tamao Kojima
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Patent number: 5811179Abstract: A magnetic recording medium including a non-magnetic polymeric support and a magnetic layer on the non-magnetic polymeric support. The magnetic layer is positioned to be in contact with a record/playback head and includes ferromagnetic powder, abrasive material and binder resin, with at least 40 parts by weight of the abrasive material per 100 parts by weight of the ferromagnetic powder. The ferromagnetic powder has a saturation magnetization .sigma.s of 80 emu/g or more and long axis length of 0.25 .mu.m or less.Type: GrantFiled: November 6, 1995Date of Patent: September 22, 1998Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Kazunori Sakamoto, Hideo Hatanaka, Yasuhiro Ueyama, Kiyoshi Kobata, Kazunori Kubota, Hideki Okumura
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Patent number: 5541008Abstract: In the magnetic recording medium, the non-magnetic substrate has at least one under-coat layer including the flake powder of non-magnetic material on its surface, thereby splendid property of running durability and electromagnetic transducing characteristics is achieved in spite of thinning the total thickness of the magnetic recording medium.Type: GrantFiled: November 18, 1994Date of Patent: July 30, 1996Assignee: Matsushita Electric Industrial Co., LtdInventors: Hideo Hatanaka, Masaru Higashionji, Hideaki Mukae
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Patent number: 5525404Abstract: Tape-shaped magnetic medium has a magnetic layer composed of compound powders of hexagonal and spinel ferrites and is designed so that the magnetic layer and the nonmagnetic base film, that is either a PEN film or an aromatic polyamide film, have specified ratios of their thicknesses and their Young's module for the longitudinal directions as well as for the transverse directions.Type: GrantFiled: February 14, 1995Date of Patent: June 11, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideo Hatanaka, Nobuyuki Aoki, Koji Inoue
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Patent number: 5501896Abstract: In the magnetic recording medium, the non-magnetic substrate has an under-coat layer including the first flake powder of non-magnetic material on its surface and further has a back-coat film including the second flake powder of non-magnetic material on the opposite face on the non-magnetic substrate to the one face coated by the magnetic film; thereby splendid property of running durability and electromagnetic transducing characteristics is achieved in spite of thinning the total thickness of the magnetic recording medium.Type: GrantFiled: September 20, 1994Date of Patent: March 26, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Yasuhiro Ueyama, Keiichi Ochiai, Tetsuo Satake, Hideaki Komoda, Hideo Hatanaka
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Patent number: 5480732Abstract: A magnetic recording medium comprising a non-magnetic support, a magnetic layer on one surface of said non-magnetic support, a back coating layer on the other surface of said non-magnetic support and a primer layer containing acicular hexagonal ferrite magnetic powder between said non-magnetic support and at least one of said magnetic layer and said back coating layer, which is used with a video recorder fitted for high density recording and in particular, which copes with prolongation of a recording time.Type: GrantFiled: December 22, 1992Date of Patent: January 2, 1996Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Nobuyuki Aoki, Hideo Hatanaka, Kouji Inoue, Yasuhiro Ueyama
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Patent number: 5399407Abstract: Of disk-shaped or tape-shaped magnetic recording media composed of non-magnetic supports and magnetic layers which, formed on the supports, contain a magnetic powder and a binder for it, the magnetic recording medium having superior electro-magnetic conversion characteristics, high durability, and high reliability has been obtained as a result of improving the abrasion resistance of the magnetic layer without impairing the surface smoothness thereof, by incorporating a non-magnetic inorganic powder of at least 5 Mohs hardness which has a dendrite or chain structure.Type: GrantFiled: March 26, 1993Date of Patent: March 21, 1995Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Hideo Hatanaka, Fumio Echigo, Yoshio Enoki
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Patent number: 5342668Abstract: A magnetic recording medium which comprises a support and a magnetic layer formed on opposite sides of the support and comprised of a ferromagnetic fine powder and an non-magnetic powder of an abrasive both dispersed in a resin binder. The non-magnetic powder consists essentially of a first non-magnetic inorganic powder having an average particle size of from 0.01 to 1.0 .mu.m and a second non-magnetic inorganic powder having an arborescent or chain-like structure and an average particle size of from 0.03 to 2.0 .mu.m. The first and second powders is present at a mixing ratio by weight of 8:2 to 2:8.Type: GrantFiled: April 24, 1991Date of Patent: August 30, 1994Assignee: Matsushita Electric Industrial Co., Ltd.Inventors: Fumio Echigo, Masahiro Saida, Naoko N. F. Mizuno, Hideo Hatanaka, Yoshio Enoki