Abstract: There is provided a technique of a power generation system for performing power generation by introducing a cooling medium for cooling a plurality of semiconductor manufacturing apparatuses into a power generation part, wherein the system comprises a plurality of cooling medium passages, through which the cooling medium for cooling the semiconductor manufacturing apparatuses flows and connected to the power generation part. The system is configured to control an opening/closing part installed in each of the plurality of cooling medium passages based on a temperature of the cooling medium and to control inflow of the cooling medium from the plurality of cooling medium passages to the power generation part such that a temperature of the cooling medium flowing into the power generation part is equal to or higher than a predetermined temperature.

Abstract: There is provided a technique of a power generation system for performing power generation by introducing a cooling medium for cooling a plurality of semiconductor manufacturing apparatuses into a power generation part, wherein the system comprises a plurality of cooling medium passages, through which the cooling medium for cooling the semiconductor manufacturing apparatuses flows and connected to the power generation part. The system is configured to control an opening/closing part installed in each of the plurality of cooling medium passages based on a temperature of the cooling medium and to control inflow of the cooling medium from the plurality of cooling medium passages to the power generation part such that a temperature of the cooling medium flowing into the power generation part is equal to or higher than a predetermined temperature.

Abstract: There is provided a substrate processing apparatus 101, comprising: a substrate holder 217 that holds a plurality of substrates (wafers) 200 in a state of being arranged in a lateral direction (approximately in a horizontal direction) approximately in a vertical posture; a processing tube 205 that houses the substrate holder 217; a throat side sealing part (throat side mechanical flange part) 2190 that air-tightly closes an opening part of the processing tube 205; a rotation part 255 that rotates the substrate holder 217 in a peripheral direction of the substrates, with an arrangement direction (a direction in which the substrates 200 are held) of the plurality of substrates 200 as a rotation axis, wherein the substrate holder 217 includes a fixing part (movable holding part 217c) and a fixture holding part 217a for fixing the substrates 200 approximately in a vertical posture.

Abstract: There is provided a substrate processing apparatus, including: a substrate holder that holds a plurality of substrates (wafers) in a state of being arranged in a lateral direction (approximately in a horizontal direction) approximately in a vertical posture; a processing tube that houses the substrate holder; a throat side sealing part (throat side mechanical flange part) that air-tightly closes an opening part of the processing tube; a rotation part that rotates the substrate holder in a peripheral direction of the substrates, with an arrangement direction (a direction in which the substrates are held) of the plurality of substrates as a rotation axis, wherein the substrate holder includes a fixing part (movable holding part) and a fixture holding part for fixing the substrates approximately in a vertical posture.

Abstract: A supplying power adjusting apparatus has excellent temperature response and excellent stabilities to power supply change and load change. The apparatus is provided with a semiconductor inverter for high-speed switching power control, which converts a direct current rectified by a rectifying circuit (10) into alternating current power in response to a control signal and supplies a heater (7) with the power; a temperature change detecting circuit (24) for detecting the temperature change of the heater (7); a power supply change detecting circuit (22) for detecting the power change of the rectifying circuit (10); a load change detecting circuit (23) for detecting the change of the alternating current power supplied to the heater (7); and a power control signal generating circuit (15) which calculates a power quantity to be supplied to the heater (7) and controls the frequency or duty ratio of a control signal to be added to the power controlling semiconductor inverter in response to the calculated results.

Abstract: A communication circuit is provided with: a transmission and reception unit that transmits and receives communication signals through a telephone line; a connection unit that connects the transmission and reception unit to the telephone line; a detection unit that detects a line voltage value supplied from the telephone line; and a determination unit that determines a type of the telephone line, based on the line voltage value detected by the detection unit.

Abstract: A communication apparatus is provided with: plural transmission units that respectively transmit communication signals through a telephone line; a detection unit that detects a value of a line voltage supplied from the telephone line to each of the plural transmission units; and a controller that controls transmission from each of the plural transmission units, according to a relation between a predetermined reference voltage value and the value of the line voltage of each of the plural transmission units detected by the detection unit.

Abstract: A supplying power adjusting apparatus has excellent temperature response and excellent stabilities to power supply change and load change. The apparatus is provided with a semiconductor inverter for high-speed switching power control, which converts a direct current rectified by a rectifying circuit (10) into alternating current power in response to a control signal and supplies a heater (7) with the power; a temperature change detecting circuit (24) for detecting the temperature change of the heater (7); a power supply change detecting circuit (22) for detecting the power change of the rectifying circuit (10); a load change detecting circuit (23) for detecting the change of the alternating current power supplied to the heater (7); and a power control signal generating circuit (15) which calculates a power quantity to be supplied to the heater (7) and controls the frequency or duty ratio of a control signal to be added to the power controlling semiconductor inverter in response to the calculated results.

Abstract: A heater inspection apparatus including an applying unit, a current detector, a voltage detector, a temperature detector, a memory, a first calculating unit, a second calculating unit and a finding unit is provided. The applying unit applies an electrical power to a heater based on an AC power source. The current detector detects a current flowing through the heater. The voltage detector detects a voltage applied to the heater. The temperature detector detects a temperature of the heater. A temperature coefficient of resistance is stored in advance on the memory. The first calculating unit and the second calculating unit respectively calculate a resistance of the heater at an inspection time and a reference time. The finding unit finds a deterioration degree of the heater based on results of the first and second calculating units.

Abstract: To find the deterioration degree of a heater that heats a furnace.