Patents by Inventor Hideo Kameda

Hideo Kameda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device
    Patent number: 6130484
    Abstract: A semiconductor device includes a buffer region having buffers and disposed along a side of a semiconductor chip; a pad region having pads corresponding to the buffers and disposed outside the buffer region on the semiconductor chip; signal lines connecting the buffers to corresponding pads; and power supply lines and ground lines connected to extra pads, either of the power supply lines or the ground lines being partially superimposed on part of and separated from the signal lines by insulating layers.
    Type: Grant
    Filed: December 12, 1997
    Date of Patent: October 10, 2000
    Assignee: Mitsubishi Denki Kabushiki Kaisha
    Inventors: Hideo Kameda, Naoto Ueda, Yoichi Goi, Hideki Taniguchi