Patents by Inventor Hideo Matsubayashi

Hideo Matsubayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240119425
    Abstract: At least one of a discharging tendency of waste based on a discharge history of discharge of the waste by a user of a service and a discharge prediction about the waste based on the purchase history of a product by the user is calculated. A need prediction about the service is calculated by using a prediction model which uses, as a parameter, at least one of the discharging tendency of the waste and the discharge prediction about the waste. A level of the service is estimated by a simulation which uses, as parameters, the need prediction and a resource employed for the service. A notification is transmitted to the user suggesting a modification of behavior of at least one of discharge of the waste and purchase of a product by the user based on a comparison result between an estimated level and a stipulated level of the service.
    Type: Application
    Filed: August 10, 2023
    Publication date: April 11, 2024
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventors: Yuki ICHIOKA, Tomoyuki KAGA, Hideo HASEGAWA, Hiroya MATSUBAYASHI, Nobuhisa OTSUKI
  • Patent number: 8091767
    Abstract: A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: January 10, 2012
    Assignee: Hioki Denki Kabushiki Kaisha
    Inventors: Kazuhiko Seki, Hideo Matsubayashi, Makoto Shimizu
  • Publication number: 20100200284
    Abstract: A substrate manufacturing apparatus manufactures a ball-mounted substrate and has a ball mounting apparatus which includes a ball vacuum chucking apparatus including a vacuum chucking head that carries out a vacuum chucking process to chuck balls at edges of inlets formed in a vacuum chucking surface and which mounts the balls vacuum-chucked by the vacuum chucking head on a substrate, the ball vacuum chucking apparatus further including: a holding vessel that holds the balls; and a vacuum chucking/holding unit that vacuum chucks and holds the balls held in the holding vessel on a front end thereof, and carrying out a supplying process that brings the vacuum chucking/holding unit that holds the balls on the front end thereof and the vacuum chucking surface of the vacuum chucking head relatively close to supply the balls to the vacuum chucking head while air is being drawn through the inlets.
    Type: Application
    Filed: February 9, 2010
    Publication date: August 12, 2010
    Applicant: Hioki Denki Kabushiki Kaisha
    Inventors: Kazuhiko SEKI, Hideo MATSUBAYASHI, Makoto SHIMIZU