Abstract: To enable compatibility with smaller, thinner, and multi-polarized cards, to enable miniaturization, flattening, and multi-polarization and increase reliability.

Abstract: A waveguide includes a tubular resin portion formed of resin, a conductor layer formed on an inner surface of the resin portion, and a fitting held by the resin portion. The fitting includes an inner exposed portion having an exposed surface that is not covered with a resin that is a material for the resin portion. The conductor layer covers the exposed surface of the inner exposed portion and is in contact with the inner exposed portion.

Abstract: A memory card socket interconnector is disclosed including a pair of cavities configured to receive a pair of memory cards. The cavities include patterns of memory card interconnect pads. A second surface of the socket interconnector includes socket interconnect pads, distributed across the second surface of the socket interconnector, which are electrically coupled to the memory card interconnect pads. The memory card socket interconnector may further include an anisotropic elastomeric sheet provided between the memory card pads and the memory card interconnect pads in each cavity to enable good electrical contact between the memory card pads and the memory card interconnect pads.

Abstract: A waveguide includes a tubular resin portion formed of resin, a conductor layer formed on an inner surface of the resin portion, and a fitting held by the resin portion. The fitting includes an inner exposed portion having an exposed surface that is not covered with a resin that is a material for the resin portion. The conductor layer covers the exposed surface of the inner exposed portion and is in contact with the inner exposed portion.

Abstract: A memory card socket interconnector is disclosed including a pair of cavities configured to receive a pair of memory cards. The cavities include patterns of memory card interconnect pads. A second surface of the socket interconnector includes socket interconnect pads, distributed across the second surface of the socket interconnector, which are electrically coupled to the memory card interconnect pads. The memory card socket interconnector may further include an anisotropic elastomeric sheet provided between the memory card pads and the memory card interconnect pads in each cavity to enable good electrical contact between the memory card pads and the memory card interconnect pads.

Abstract: A card connector includes a housing that houses a card provided with a terminal member, a connecting terminal and a cover member. The connecting member is attached to the housing that connects with the terminal member of the card. The cover member is connected to the housing and forms a card housing space between the housing, and is attached to a substrate.

Abstract: The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.

Abstract: A connector, the connector comprises a tabulate main body and a plurality of tabulate conductors provided on the main body, nested with a pairing connector. Each conductor includes a tabulate terminal located in the main body and engaged with a pairing terminal of the pairing connector, and a rear end outwardly extended to the main body and connected to a terminal connecting part provided on the surface of a mounting part. A face of the rear end on the side of the mounting part is more distant to the surface of the mounting part than a face of the main body on the side of the mounting part. The rear end is connected to the terminal connecting part through an anisotropic conductive film provided between its face on the side of the mounting part and the terminal connecting part.

Abstract: The cooling device comprises a base with a recessed part in a first surface, a plurality of heat radiating fins standing erect on a second surface on the reverse side of the first surface, and a flat, plate-like thermal diffusion part housed inside the recessed part. The upper surface of the thermal diffusion part makes thermal contact with the upper surface of the recessed part, the side surface of the thermal diffusion part makes thermal contact with the side surface of the recessed part, and the thermal diffusion part diffuses in the planar and orthogonal directions heat from the heat generating element arranged on the bottom surface of the thermal diffusion part by vaporizing and condensing coolant sealed inside.

Abstract: A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape. A front surface of the thermal diffusion unit thermally contacts a first circuit mounting surface of the electronic substrate. A rear face of the thermal diffusion unit thermally contacts a second circuit mounting surface of the electronic substrate. And, the thermal diffusion unit diffuses heat from the heating element according to vaporization and condensation principles of a refrigerant sealed therein.

Abstract: To provide electronic equipment having a heat discharging function capable of achieving the maximum in the signal processing capability of a portable terminal by preventing the functional restriction of the portable terminal by effectively discharging exothermic heat from the portable terminal at the time of coupling the portable terminal whose function is restricted by heat generation to an external device, as well as a heat discharging system and a heat discharging method.

Abstract: The Present Disclosure is a module socket for mounting a module on a mounting member, in which the module socket has a first connector including a flat housing, a first conductive pattern arranged on the mating side surface of the housing, and a male terminal protruding from a surface of the first conductive pattern, and a flat second connector formed from plate-shaped metal and including a female terminal elastically interposing the male terminal, and in which either the first conductor or the second conductor is attached to the module and the other is attached to the mounting member.

Abstract: A card connector includes a housing that houses a card provided with a terminal member, a connecting terminal and a cover member. The connecting member is attached to the housing that connects with the terminal member of the card. The cover member is connected to the housing and forms a card housing space between the housing, and is attached to a substrate.

Abstract: A connector, the connector comprises a tabulate main body and a plurality of tabulate conductors provided on the main body, nested with a pairing connector. Each conductor includes a tabulate terminal located in the main body and engaged with a pairing terminal of the pairing connector, and a rear end outwardly extended to the main body and connected to a terminal connecting part provided on the surface of a mounting part. A face of the rear end on the side of the mounting part is more distant to the surface of the mounting part than a face of the main body on the side of the mounting part. The rear end is connected to the terminal connecting part through an anisotropic conductive film provided between its face on the side of the mounting part and the terminal connecting part.

Abstract: The electronic device according to the Present Disclosure is an electronic device provided with a heat-dissipating portion and an electronic component socket that can accommodate, therein, an installable electronic component, wherein the electronic component socket has a thermal connecting portion for connecting thermally to the electronic component, and, when the electronic component is operating, the electronic component and the heat-dissipating portion are connected thermally through the thermal connecting portion.

Abstract: A FPC connector has an insulative housing with a general U-shape that defines an opening that receives a free end of a length of FPC. The housing has a base and two leg portions and the leg portions have engagement arms that hold engage the FPC free end when inserted into the connector housing opening. A cover of the connector housing has press members that press the FPC and dielectric barriers thereon into contact with contacts on a circuit board.

Abstract: The cooling device comprises a base with a recessed part in a first surface, a plurality of heat radiating fins standing erect on a second surface on the reverse side of the first surface, and a flat, plate-like thermal diffusion part housed inside the recessed part. The upper surface of the thermal diffusion part makes thermal contact with the upper surface of the recessed part, the side surface of the thermal diffusion part makes thermal contact with the side surface of the recessed part, and the thermal diffusion part diffuses in the planar and orthogonal directions heat from the heat generating element arranged on the bottom surface of the thermal diffusion part by vaporizing and condensing coolant sealed inside.

Abstract: The Present Disclosure is a module socket for mounting a module on a mounting member, in which the module socket has a first connector including a flat housing, a first conductive pattern arranged on the mating side surface of the housing, and a male terminal protruding from a surface of the first conductive pattern, and a flat second connector formed from plate-shaped metal and including a female terminal elastically interposing the male terminal, and in which either the first conductor or the second conductor is attached to the module and the other is attached to the mounting member.

Abstract: To provide electronic equipment having a heat discharging function capable of achieving the maximum in the signal processing capability of a portable terminal by preventing the functional restriction of the portable terminal by effectively discharging exothermic heat from the portable terminal at the time of coupling the portable terminal whose function is restricted by heat generation to an external device, as well as a heat discharging system and a heat discharging method.

Abstract: A cooling device is provided. The cooling device is equipped with an electronic substrate on which a heating element has been mounted, and comprises a thermal diffusion unit of a plate-like shape. A front surface of the thermal diffusion unit thermally contacts a first circuit mounting surface of the electronic substrate. A rear face of the thermal diffusion unit thermally contacts a second circuit mounting surface of the electronic substrate. And, the thermal diffusion unit diffuses heat from the heating element according to vaporization and condensation principles of a refrigerant sealed therein.