Patents by Inventor Hideo Otaki

Hideo Otaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5324454
    Abstract: A thermoplastic resin composition comprising (a) 100 parts by weight of thermoplastic copolycarbonate comprising 0.1 to 50% by weight of structural unit of the following general formula (1) and 99.9 to 50% by weight of structural unit of the following general formula (2): ##STR1## and (b) 0.1 to 30 parts by weight of electroconductive carbon black can produce a molding product having good mechanical properties and surface smoothness with good moldability and (c) a polyester or styrenic resin.
    Type: Grant
    Filed: September 29, 1993
    Date of Patent: June 28, 1994
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Toshiaki Takata, Tadami Kinugawa, Hideo Otaki
  • Patent number: 5273685
    Abstract: A thermoplastic resin composition comprising (a) 100 parts by weight of thermoplastic copolycarbonate comprising 0.1 to 50% by weight of structural unit of the following general formula (1) and 99.9 to 50% by weight of structural unit of the following general formula (2): ##STR1## and (b) 0.1 to 30 parts by weight of electroconductive carbon black can produce a molding product having good mechanical properties and surface smoothness with good moldability.
    Type: Grant
    Filed: February 21, 1992
    Date of Patent: December 28, 1993
    Assignee: Mitsubishi Gas Chemical Co., Inc.
    Inventors: Toshiaki Takata, Tadami Kinugawa, Hideo Otaki