Abstract: A vehicle lamp includes a plurality of light source modules that includes light sources including a plurality of light emitting elements that emit different colors of light and lens bodies disposed in front of the light sources, and the plurality of light source modules are disposed in a matrix manner in a plane to constitute at least one light emitting area.

Abstract: A vehicle lamp includes a plurality of light source modules that includes light sources including a plurality of light emitting elements that emit different colors of light and lens bodies disposed in front of the light sources, and the plurality of light source modules are disposed in a matrix manner in a plane to constitute at least one light emitting area.

Abstract: A near infrared illuminator can facilitate the adjustment of an optical axis thereof with favorable accuracy. The near infrared illuminator can include: a light source configured to emit near infrared rays; and a projector lens configured to project the near infrared rays emitted from the light source forward to form a predetermined light distribution pattern in front thereof. The projector lens can include a light distribution control section configured to project part of the near infrared rays emitted from the light source forward to form the predetermined light distribution pattern, and a marker forming section configured to project part of the near infrared rays emitted from the light source forward to form an alignment marker for positioning the light distribution pattern at a predetermined position beside the light distribution pattern.

Abstract: A near infrared illuminator can facilitate the adjustment of an optical axis thereof with favorable accuracy. The near infrared illuminator can include: a light source configured to emit near infrared rays; and a projector lens configured to project the near infrared rays emitted from the light source forward to form a predetermined light distribution pattern in front thereof. The projector lens can include a light distribution control section configured to project part of the near infrared rays emitted from the light source forward to form the predetermined light distribution pattern, and a marker forming section configured to project part of the near infrared rays emitted from the light source forward to form an alignment marker for positioning the light distribution pattern at a predetermined position beside the light distribution pattern.

Abstract: A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.

Abstract: A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

Abstract: A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having deposited on it fine roughening particles of Cu or alloy particles of Cu and Mo or alloy particles comprising Cu and at least one element selected among a group of Ni, Co, Fe, and Cr or a mixture of this alloy particles and oxide of at least one element selected among a group of V, Mo, and W.

Abstract: A conductive substrate with a resistance layer comprising a substantially flat high conductivity substrate roughening treated on its surface by a resistance component and provided with a resistance layer by the resistance component so as to enable the interface between the high conductivity substrate and resistance component layer to be substantially flattened, enable acquisition of a thin film resistance layer with a stable resistance after dissolving away the high conductivity substrate, and able to maintain the peel strength with the insulating support, and a resistance board using the same.

Abstract: A plating bath, able to form a resistance layer with a uniform thickness distribution on the roughened surface of a conductive base, including nickel ions and sulfamic acid or its salt as essential components and at least one of phosphoric acid, phosphorous acid, hypophosphorous acid, and salts of the same; a conductive base having a thin resistance layer with a stable resistance, and a resistance circuit board material using the same.

Abstract: A copper foil for chip-on-film use, a plasma display panel, or a high-frequency printed circuit board obtained by rolling copper foil to smooth the surface to give a surface area of not more than 1.30 times an ideal smooth surface, the smoothed copper foil having deposited on it fine roughening particles of Cu or alloy particles of Cu and Mo or alloy particles comprising Cu and at least one element selected among a group of Ni, Co, Fe, and Cr or a mixture of this alloy particles and oxide of at least one element selected among a group of V, Mo, and W.

Abstract: An electrodeposited copper foil having an extremely smooth surface roughness at the deposition surface, having an extremely fine crystal structure, and yet not having too high an ordinary temperature tensile strength, superior in elongation, maintaining a stable strength without softening by heat even after heat treatment, and having a high elongation rate even in a high temperature atmosphere. The electrodeposited copper foil has a surface roughness Rz at a deposition surface at ordinary temperature smaller than 2.5 &mgr;m in terms of 10-point average roughness Rz, has a minimum distance between peaks of a base foil peak of at least 5 &mgr;m, has an ordinary temperature tensile strength of not more than 40 kg/mm2, and has a drop in ordinary temperature tensile strength after heat treatment at 130° C. for 15 hours of less than 15%. Also, copper foil for a secondary battery collector using that foil.

Abstract: The present invention is an electrodeposited copper foil characterised in that roughening treatment is performed on a matte side of an untreated copper foil wherein the surface roughness R.sub.z of the matte side of the untreated copper foil is the same as or less than the surface roughness R.sub.z of the shiny side of this untreated copper foil. The electrodeposited copper foil is made by electrodepositing copper onto a drum from an electrolyte which contains 0.05 to 5 ppm 3-mercapto 1-propanesulfonate; at least one organic compound selected from 0.1 to 15 ppm of a polysaccharide which is a carbohydrate such as starches, celluloses and vegetable rubbers, and 0.3 to 35 ppm of a low molecular weight glue having a weight average molecular weight of 10,000 or less; and 10 to 60 ppm of a chloride ion. The copper foil may be used in making a printed circuit board or as a component of a secondary battery cell.

Abstract: An easily openable can lid wherein buckling parts are provided nearby a peripheral groove formed on the can lid in a range of 25 to 65 degrees from the center of the top plate from a line between the tip end of the openable member and the center of the top plate in all sector segments formed when the can lid is divided into four sector segments by a line between an extreme end of the openable member and the center of the top plate and a line which passes through the center of the top plate and orthogonally intersects the above described line. A reinforcing part with a reinforcing effect smaller than a buckling effect is provided at a coupling part between the top plate and the peripheral groove or near said coupling part except for the buckling part at an opposite side of the openable member and its neighborhood to provide a difference of strength between the buckling part at the openable member side and the buckling part at an opposite side of the openable member.

Abstract: A spline-coupling structure in which at least one of male and female members has a press-fit guide face provided at its end opposed to the other member before press-fitting of the members. The press-fit guide face includes a plurality of guide face portions smoothly interconnecting the end and bottom lands of the spline teeth of the one member to form axially outwardly expanded arcs, a plurality of second guide face portions smoothly interconnecting tooth addendums of the spline teeth and the end to form axially outwardly expanded arcs, and a plurality of third guide face portions smoothly interconnecting tooth flanks of the spline teeth and the second guide face portion to form axially outwardly expanded arcs. The first, second and third guide face portions are connected smoothly to one another.

Abstract: A process for producing a semiconductor device having high quality and self-gettering action. First, oxygen ion is implanted to the surface of a silicon monocrystalline substrate. Then, it is heat treated to precipitate the oxygen ion and to thereby produce micro defects in the layer to which oxygen ion is implanted. Subsequently, an epitaxial layer is grown on the micro defect layer. The two steps after the oxygen ion implantation may be conducted in reverse order to one another.