Abstract: In a wafer chuck for flatly vacuum-chucking a semiconductor wafer (11) supported by support pins (15) such that a pressure in a suction chamber (13) surrounded by an external wall (12), the upper surface of the external wall (12) is formed to be lower than the upper surfaces of the support pins, and the upper surface of the external wall (12) does not pressure the semiconductor wafer (11), a distance (L1) between the external wall (12) and closest support pins (15a) is up to 1.8 mm, and an alignment pitch. (L2) of the support pins (15) aligned inside the closest support pins (15a) to the external wall (12) is not more than 1.5 times of the distance (L1) between the external wall (12) and the closest support pins (15a).

Abstract: In a wafer chuck for flatly vacuum-chucking a semiconductor wafer (11) supported by support pins (15) such that a pressure in a suction chamber (13) surrounded by an external wall (12), the upper surface of the external wall (12) is formed to be lower than the upper surfaces of the support pins, and the upper surface of the external wall (12) does not pressure the semiconductor wafer (11), a distance (L1) between the external wall (12) and closest support pins (15a) is up to 1.8 mm, and an alignment pitch (L2) of the support pins (15) aligned inside the closest support pins (15a) to the external wall (12) is not more than 1.5 times of the distance (L1) between the external wall (12) and the closest support pins (15a).

Abstract: A photoresist of sufficient thickness to fill a scribe line is applied to an entire substrate. The photoresist is exposed through a photomask having a pattern corresponding to the scribe line and then developed. A photosensitized gelatin is applied by spincoating on the flat substrate obtained in this process, pattern and then dyed, to obtain a color filter array.

Abstract: A photoresist of sufficient thickness to fill a scribe line is applied on an entire substrate. Then, the photoresist is exposed through a photomask having a pattern corresponding to the scribe line and is thereafter developed. A photosensitized gelatin is applied by spin-coating on the flat substrate obtained in this process, patterned, and then dyed, to obtain a color filter array.

Abstract: A method for manufacturing an organic semiconductor thin film (24) having an improved characteristic as a semiconductor is provided. A phthalocyanine compound having amino groups is mixed with stearic acid to form a bonded substance capable of being dissolved in an organic solvent. Then, an organic solution is made by dissolving this bonded substance in the organic solvent. By developing this organic solution on a water (20) surface, the thin layer (23) of this bonded substance is formed on the water (20) surface. Thereafter, this thin layer is moved onto a substrate (30) and accumulated to be deposited on the substrate (30). Next, the stearic acid is volatilized and removed from the above described thin film (23) deposited on the substrate (30) by baking the whole substrate. The thus structured organic semiconductor thin film (24) is used as a semiconductor material such as a photoelectric transfer device, a gas sensor, a transistor and the like.

Abstract: A color filter dyeing apparatus for dyeing a color filter formed on a substrate comprises a chuck for holding the substrate on which the color filter is mounted, a dyeing solution receptacle in intimate engagement, by means of a sealing member, with the chuck or the substrate, and forming a container for containing the color filter therein, an inlet for supplying the dyeing solution into the container, and means for discharging the dyeing solution from the container.

Abstract: A color separation filter which is formed through use of dyestuffs provided with monomolecular film forming properties in which molecules can be absorbed by air-water interfaces and patterning properties capable of forming patterns through exposure by ionizing radiations. A method of manufacturing a color separation filter which comprises a step of forming monomolecular films of dyestuffs provided with monomolecular film forming properties and patterning properties, a step of piling a plurality of monomolecular films to form cumulative films and a step of patterning the cumulative films by radiating ionizing radiations to the cumulative films.

Abstract: A color filter dyeing apparatus for dyeing a color filter formed on a substrate comprises a chuck for holding the substrate on which the color filter is mounted, a dyeing solution receptacle in intimate engagement, by means of a sealing member, with the chuck or the substrate, and forming a container for containing the color filter therein, an inlet for supplying the dyeing solution into the container, and means for discharging the dyeing solution from the container.

Abstract: A color separation filter is formed through use of dyestuffs provided with monomolecular film forming properties in which molecules can be adsorbed by air-water interfaces and with patterning properties capable of forming patterns through exposure by ionizing radiations. A method of manufacturing a color separation filter comprises a step of forming monomolecular films of dyestuffs provided with monomolecular film forming properties and patterning properties, a step of piling a plurality of monomolecular films to form cumulative films and a step of patterning the cumulative films by radiating ionizing radiations to the cumulative films.

Abstract: A radiation-sensitive positive resist which is prepared from a homogeneous polymer of any one of the various forms of halogenated alkyl .alpha.-halogenated acrylate expressed by the general structural formula: ##STR1## where: X = fluorine, chlorine or bromineR = alkyl group in which one or more hydrogen atoms are substituted by the corresponding number of fluorine atoms, or aryl group in which said substitution takes place, or alkoxy group in which said substitution takes place, or a copolymer of two or more of the monomers expressed by said general structural formula or a copolymer of any one of said monomers and any one of the different forms of vinyl monomer from those expressed by said general structural formula.

Abstract: A process for soldering a metal substrate coated with an electrodeposited non-peelable coating comprising 35-65 wt parts of methacryl ester, 10-40 wt parts of acrylonitrile, 2-15 wt parts of methacrylic acid, 3-10 wt parts of acrylamide and/or vinyl acetate, in 100 parts of resin.