Abstract: The present invention provides a lens unit having a cover member which does not cause deviation in precision and capable of being manufactured efficiently at low cost. In a lens unit 10A, side surfaces of a cover member 14a continuing from a front end surface 29 to a rear end surface located at a lens side are formed in a regular quadrangular prism, at least two of corners of the regular quadrangular prism are in contact with an inner peripheral surface 27 of a housing space 17 of a holder 11a for housing the cover member 14a, a gap 34 is formed between each of the side surfaces of the cover member 14a and the inner peripheral surface 27 of the holder 11a, and an effective area of a light beam is located inside a light receiving area having a regular quadrangular shape surrounded by an outer peripheral edge of the front end surface 29 of the cover member 14a.

Abstract: An imaging module includes: an electrical cable; an imaging device; and a flexible wiring board with wirings electrically connecting the imaging device with the electrical cable. The flexible wiring board includes: a device mounting portion on which the imaging device is mounted, and one end of the device mounting portion in a longitudinal direction has a bent portion; and a rear portion that bends and extends from the bent portion to a side opposite the imaging device. The device mounting portion has a mounting surface intersecting an axial direction of a distal end of the electrical cable, and the imaging device is mounted on the mounting surface, and the wirings extend from the mounting surface, pass through the bent portion, and connect with the electrical cable at the rear portion.

Abstract: An imaging unit includes: a solid-state imager including an imaging surface disposed on a front surface of the solid-state imager and electrode pads disposed separately from each other on a rear surface of the solid-state imager that is opposite to the front surface; and a coaxial cable electrically connected to the electrode pads on the rear surface of the solid-state imager. The coaxial cable includes: an inner coated wire including an internal conductor that includes a plurality of element wires and an inner insulating layer that coats a surrounding circumference of the internal conductor; an external conductor including a plurality of element wires that surround the inner coated wire; and an outer insulating layer that coats the external conductor.

Abstract: The present invention provides a lens unit having a cover member which does not cause deviation in precision and capable of being manufactured efficiently at low cost. In a lens unit 10A, side surfaces of a cover member 14a continuing from a front end surface 29 to a rear end surface located at a lens side are formed in a regular quadrangular prism, at least two of corners of the regular quadrangular prism are in contact with an inner peripheral surface 27 of a housing space 17 of a holder 11a for housing the cover member 14a, a gap 34 is formed between each of the side surfaces of the cover member 14a and the inner peripheral surface 27 of the holder 11a, and an effective area of a light beam is located inside a light receiving area having a regular quadrangular shape surrounded by an outer peripheral edge of the front end surface 29 of the cover member 14a.

Abstract: An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with adhesive resin in which a glass-transition temperature is 135° C. or less.

Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.

Abstract: An imaging unit includes: a solid-state imager including an imaging surface disposed on a front surface of the solid-state imager and electrode pads disposed separately from each other on a rear surface of the solid-state imager that is opposite to the front surface; and a coaxial cable electrically connected to the electrode pads on the rear surface of the solid-state imager. The coaxial cable includes: an inner coated wire including an internal conductor that includes a plurality of element wires and an inner insulating layer that coats a surrounding circumference of the internal conductor; an external conductor including a plurality of element wires that surround the inner coated wire; and an outer insulating layer that coats the external conductor.

Abstract: An imaging module includes: an electrical cable; an imaging device; and a flexible wiring board with wirings electrically connecting the imaging device with the electrical cable. The flexible wiring board includes: a device mounting portion on which the imaging device is mounted, and one end of the device mounting portion in a longitudinal direction has a bent portion; and a rear portion that bends and extends from the bent portion to a side opposite the imaging device. The device mounting portion has a mounting surface intersecting an axial direction of a distal end of the electrical cable, and the imaging device is mounted on the mounting surface, and the wirings extend from the mounting surface, pass through the bent portion, and connect with the electrical cable at the rear portion.

Abstract: An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction moving away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with an adhesive resin in which the rate of volumetric shrinkage in curing is 3% or more.

Abstract: An optical fiber structure according to the present application includes a cylindrical resin body, and a plurality of circumferential arrays of optical fiber bare wires disposed within the resin body and extending along a longitudinal direction of the resin body. The resin body includes a linear slit provided at a location intermediate the length of the resin body. The linear slit extends from an outer surface to an inner bore of the resin body and extending substantially parallel to the bare wires.

Abstract: An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element, and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with adhesive resin in which a glass-transition temperature is 135° C. or less.

Abstract: An imaging module includes an electrical cable; a solid-state imaging element having an imaging unit orthogonal to an axis direction of a tip of the electrical cable; and a flexible wiring substrate in which the solid-state imaging element and the electrical cables are electrically connected together. The flexible wiring substrate includes an element mounting portion mounting the solid-state imaging element and two rear pieces that are bent at both end portions of the element mounting portion and extend in a direction moving away from the element mounting portion. An internal space of the flexible wiring substrate surrounded by the element mounting portion and the two rear pieces is filled with an adhesive resin in which the rate of volumetric shrinkage in curing is 3% or more.

Abstract: An endoscope includes: an imaging device chip having a chip connection portion; a tubular housing tube used to a scope tip portion of an endoscope; a substrate to which the imaging device chip is fixed, the substrate having a substrate connection portion, the substrate being capable of bending at near the substrate connection portion when the substrate is inserted into the housing tube; a lead wire connecting the substrate connection portion and the chip connection portion; flexible and non-conductive resin covering an entirety of the lead wire; and an imaging module including the substrate provided with the imaging device chip thereon, the imaging module inserted into the housing tube.

Abstract: An optical fiber structure according to the present application includes a cylindrical resin body, and a plurality of circumferential arrays of optical fiber bare wires disposed within the resin body and extending along a longitudinal direction of the resin body. The resin body includes a linear slit provided at a location intermediate the length of the resin body. The linear slit extends from an outer surface to an inner bore of the resin body and extending substantially parallel to the bare wires.