Abstract: A device includes a chemical solution flow path in which a chemical solution containing polymers flows; a laser beam irradiator configured to irradiate a laser beam to the chemical solution flow path such that an optical path is intersected with a flow direction of the chemical solution in the chemical solution flow path; a light receiving element provided in the optical path passing through the chemical solution flow path; a detector configured to detect, based on a signal output from the light receiving element, an abnormality in a state of polymers corresponding to a majority of the polymers contained in the chemical solution or configured to detect a ratio between a chemical solution containing the polymers and another chemical solution in the chemical solution flow path.

Abstract: A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.

Abstract: A liquid processing device includes: a nozzle configured to discharge, onto a substrate, a processing liquid supplied from a processing liquid source, the processing liquid being configured to process the substrate; a main flow path which connects the processing liquid source and the nozzle; a filter provided in the main flow path; a branch path branched from the main flow path; a pump provided at an end of the branch path; and a controller configured to output a control signal to perform a first process of sucking the processing liquid supplied from the processing liquid source by the pump to flow the processing liquid into the branch path and then a second process of discharging the processing liquid of a smaller amount than a capacity of the branch path from the pump to the branch path to discharge the processing liquid from the nozzle.

Abstract: A solution supply apparatus is for supplying a treatment solution to a treatment solution discharger which discharges the treatment solution to a treatment object. The solution supply apparatus includes: a supply pipe line connected to the treatment solution discharger; a filter provided on the supply pipe line which filters the treatment solution to remove foreign substances; and a controller. The controller performs a determination of a state of the treatment solution to be supplied to a primary side of the filter and, when the state of the treatment solution is determined to be bad, outputs a control signal for restricting supply of the treatment solution to the primary side of the filter.

Abstract: A device includes a chemical solution flow path in which a chemical solution containing polymers flows; a laser beam irradiator configured to irradiate a laser beam to the chemical solution flow path such that an optical path is intersected with a flow direction of the chemical solution in the chemical solution flow path; a light receiving element provided in the optical path passing through the chemical solution flow path; a detector configured to detect, based on a signal output from the light receiving element, an abnormality in a state of polymers corresponding to a majority of the polymers contained in the chemical solution or configured to detect a ratio between a chemical solution containing the polymers and another chemical solution in the chemical solution flow path.

Abstract: A liquid processing device includes: a nozzle configured to discharge, onto a substrate, a processing liquid supplied from a processing liquid source, the processing liquid being configured to process the substrate; a main flow path which connects the processing liquid source and the nozzle; a filter provided in the main flow path; a branch path branched from the main flow path; a pump provided at an end of the branch path; and a controller configured to output a control signal to perform a first process of sucking the processing liquid supplied from the processing liquid source by the pump to flow the processing liquid into the branch path and then a second process of discharging the processing liquid of a smaller amount than a capacity of the branch path from the pump to the branch path to discharge the processing liquid from the nozzle.

Abstract: A solution supply apparatus for supplying a treatment solution to a treatment solution discharger configured to discharge the treatment solution to a treatment object, the solution supply apparatus includes: a supply pipe line connected to the treatment solution discharger; a filter provided on the supply pipe line and configured to filter the treatment solution to remove foreign substances; and a controller configured to perform a determination of a state of the treatment solution to be supplied to a primary side of the filter and, when the state of the treatment solution is determined to be bad, to output a control signal for restricting supply of the treatment solution to the primary side of the filter.

Abstract: A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.

Abstract: A treatment solution supply apparatus for supplying a treatment solution to a treatment solution discharge unit that discharges the treatment solution to a treatment body, includes: a temporary storage apparatus that temporarily stores the treatment solution supplied from a treatment solution supply source that stores the treatment solution; a filter that removes a foreign substance in the treatment solution from the temporary storage apparatus; and a pump that sends the treatment solution from which the foreign substance has been removed by the filter to the treatment solution discharge unit, wherein the temporary storage apparatus has a pressure-feeding function of pressure-feeding the treatment solution stored in the temporary storage apparatus.

Abstract: A treatment solution supply method includes: a degassed treatment solution generating step of degassing a treatment solution by a degassing mechanism to generate a degassed treatment solution; a treatment solution storing step of storing the degassed treatment solution in a container; a filter solution-passing step of bringing a downstream side from a filter connected to a downstream side from the container via a treatment solution supply pipe to a negative pressure with respect to a pressure in the container to pass the treatment solution in the container through the filter; and a negative pressure maintaining step of maintaining a state in which the downstream side from the filter is brought to the negative pressure, for a predetermined period, after stopping supply of the treatment solution from the container to the filter.

Abstract: A treatment solution supply apparatus for supplying a treatment solution to a treatment solution discharge unit that discharges the treatment solution to a treatment body, includes: a temporary storage apparatus that temporarily stores the treatment solution supplied from a treatment solution supply source that stores the treatment solution; a filter that removes a foreign substance in the treatment solution from the temporary storage apparatus; and a pump that sends the treatment solution from which the foreign substance has been removed by the filter to the treatment solution discharge unit, wherein the temporary storage apparatus has a pressure-feeding function of pressure-feeding the treatment solution stored in the temporary storage apparatus.

Abstract: A substrate processing apparatus includes a nozzle for discharging a processing solution, a processing solution supply part for supplying the processing solution to the nozzle and a controller. The processing solution supply part includes a tank, a first conduit for guiding the processing solution from the tank to the nozzle, a pump installed in the first conduit, and a filter having first and second spaces, and a filtering member for separating between the first space and the second space. The controller performs a first control process of controlling the processing solution supply part to flow the processing solution from the first space to the second space through the filtering member by the pump, and after the first control process, a second control process of controlling the processing solution supply part to flow the processing solution from the second space to the first space through the filtering member by the pump.

Abstract: A treatment solution supply method includes: a degassed treatment solution generating step of degassing a treatment solution by a degassing mechanism to generate a degassed treatment solution; a treatment solution storing step of storing the degassed treatment solution in a container; a filter solution-passing step of bringing a downstream side from a filter connected to a downstream side from the container via a treatment solution supply pipe to a negative pressure with respect to a pressure in the container to pass the treatment solution in the container through the filter; and a negative pressure maintaining step of maintaining a state in which the downstream side from the filter is brought to the negative pressure, for a predetermined period, after stopping supply of the treatment solution from the container to the filter.

Abstract: The resist coating unit (COT) has a spin chuck (41) which holds the wafer to be supplied with a resist liquid, and a process cup (50) which accommodates the spin chuck (41) and exhaustes an atmosphere around the wafer W from a bottom thereof. The process cup (50) comprises a first cup (51) with an outer circumferential wall (61a), and an airflow control member (52) laid out close to the wafer W in the first cup (51) in such a manner as to surround the wafer W. The airflow control member (52) has a vertical cross section of an approximately rectangular shape defined by the upper ring portion (62a) having a cross section of an approximately triangular shape and protruding upward, and a lower ring portion (62b) having a cross section of an approximately triangular shape and protruding downward. An exhaust passage (55) for substantially exhausting the atmosphere around the wafer W is formed between the outer circumferential wall (61a) and the airflow control member (52).

Abstract: The resist coating unit (COT) has a spin chuck (41) which holds the wafer to be supplied with a resist liquid, and a process cup (50) which accommodates the spin chuck (41) and exhaustes an atmosphere around the wafer W from a bottom thereof. The process cup (50) comprises a first cup (51) with an outer circumferential wall (61a), and an airflow control member (52) laid out close to the wafer W in the first cup (51) in such a manner as to surround the wafer W. The airflow control member (52) has a vertical cross section of an approximately rectangular shape defined by the upper ring portion (62a) having a cross section of an approximately triangular shape and protruding upward, and a lower ring portion (62b) having a cross section of an approximately triangular shape and protruding downward. An exhaust passage (55) for substantially exhausting the atmosphere around the wafer W is formed between the outer circumferential wall (61a) and the airflow control member (52).

Abstract: The resist coating unit (COT) has a spin chuck (41) which holds the wafer to be supplied with a resist liquid, and a process cup (50) which accommodates the spin chuck (41) and exhaustes an atmosphere around the wafer W from a bottom thereof. The process cup (50) comprises a first cup (51) with an outer circumferential wall (61a), and an airflow control member (52) laid out close to the wafer W in the first cup (51) in such a manner as to surround the wafer W. The airflow control member (52) has a vertical cross section of an approximately rectangular shape defined by the upper ring portion (62a) having a cross section of an approximately triangular shape and protruding upward, and a lower ring portion (62b) having a cross section of an approximately triangular shape and protruding downward. An exhaust passage (55) for substantially exhausting the atmosphere around the wafer W is formed between the outer circumferential wall (61a) and the airflow control member (52).

Abstract: A heat-treating apparatus comprises a table having a heating element buried therein, a plate-like target object to be processed being disposed on the table so as to be heated to a prescribed temperature, a support member for supporting the target object and movable in the vertical direction relative to the table such that the support member is moved to permit the target object supported by the support member to be disposed on the table or is moved away from the table, a cover surrounding the upper portion of the table, and a casing surrounding the lower portion of the table and combined with the cover so as to form a process chamber. When the process chamber is opened, the support member permits the target object to be housed inside the cover.

Abstract: The resist coating unit (COT) has a spin chuck (41) which holds the wafer to be supplied with a resist liquid, and a process cup (50) which accommodates the spin chuck (41) and exhaustes an atmosphere around the wafer W from a bottom thereof. The process cup (50) comprises a first cup (51) with an outer circumferential wall (61a), and an airflow control member (52) laid out close to the wafer W in the first cup (51) in such a manner as to surround the wafer W. The airflow control member (52) has a vertical cross section of an approximately rectangular shape defined by the upper ring portion (62a) having a cross section of an approximately triangular shape and protruding upward, and a lower ring portion (62b) having a cross section of an approximately triangular shape and protruding downward. An exhaust passage (55) for substantially exhausting the atmosphere around the wafer W is formed between the outer circumferential wall (61a) and the airflow control member (52).

Abstract: A heat-treating apparatus comprises a table having a heating element buried therein, a plate-like target object to be processed being disposed on the table so as to be heated to a prescribed temperature, a support member for supporting the target object and movable in the vertical direction relative to the table such that the support member is moved to permit the target object supported by the support member to be disposed on the table or is moved away from the table, a cover surrounding the upper portion of the table, and a casing surrounding the lower portion of the table and combined with the cover so as to form a process chamber. When the process chamber is opened, the support member permits the target object to be housed inside the cover.