Patents by Inventor Hideo Sonohara, Sr.

Hideo Sonohara, Sr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit
    Patent number: 8174123
    Abstract: A semiconductor integrated circuit according to an exemplary embodiment of the present invention includes an I/O buffer provided in a semiconductor chip, single-layer pads, and multilayer pads. The single-layer pads are formed above the I/O buffer. The multilayer pads are formed above the I/O buffer separately from the single-layer pads. The single-layer pads are pads dedicated to bonding, and the multilayer pads are pads on which both probing and bonding are performed.
    Type: Grant
    Filed: December 24, 2009
    Date of Patent: May 8, 2012
    Assignee: Renesas Electronics Corporation
    Inventor: Hideo Sonohara, Sr.