Patents by Inventor Hideo Sotokawa
Hideo Sotokawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7613080Abstract: To provide an optical pickup device in which an optical parts module is fixedly adhered in a high positional precision to an optical pickup case, such that the adhesion strength can be sufficiently enhanced against a stress to be applied to the adhering faces from a flexible printed circuit board connected to the optical parts module, the present invention forms the adhering faces on at least two portions across the optical axis of the optical parts module, and also forms groove portions on the individual surfaces of the optical parts module and the optical pickup case for the adhering faces.Type: GrantFiled: December 7, 2005Date of Patent: November 3, 2009Assignee: Hitachi Media Electronics Co., Ltd.Inventors: Yoshio Oozeki, Hiroaki Furuichi, Satoshi Arai, Hideo Sotokawa
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Patent number: 7475412Abstract: In order to improve reliability of an optical disk drive apparatus at low cost, a flexible substrate for making connection between an optical pick-up device incorporated in the optical disk drive apparatus and a drive side is divided into a first flexible substrate fixed to the optical pick-up body (for example, upper surface), and a second flexible substrate connected to the first flexible substrate and extending to the drive, wiring conductors formed on a connection end portion of the first flexible substrate and wiring conductors formed on a connection end portion of the second flexible substrate are superposed at a region adjacent an end of the case of the optical pick-up device body, and connected to each other by joining material, and a connection section between the wiring conductors is held down by a cover for protecting the optical pick-up device body.Type: GrantFiled: January 18, 2006Date of Patent: January 6, 2009Assignee: Hitachi Media Electronics Co., Ltd.Inventors: Satoshi Arai, Hiroaki Furuichi, Yoshio Oozeki, Hideo Sotokawa, Mitsuo Satake, Kazuhiko Ito, Masayoshi Watanabe
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Publication number: 20080128839Abstract: An electronic apparatus suppressing damages to a device not having high durability to a high voltage of a structure including a first member having a first electrode and a device, and a second member having a second electrode in which the first electrode and the second electrode, are formed in a region not overlapping the device, the first member and the second member are anodically bonded by the application of a voltage between the first electrode and the second electrode and the device is encapsulated between the first member and the second member.Type: ApplicationFiled: August 30, 2005Publication date: June 5, 2008Inventors: Hideo Sotokawa, Hiroaki Huruichi
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Patent number: 7153758Abstract: In anodic bonding between a conductor or semiconductor and glass, in order to attain good adhesion at a lower bonding temperature than usual and improve the toughness at its boundary to obtain higher reliability for a bonded portion even in a case where bonded members are warped or dust is present at the bonding boundary, a soft metal film is formed on the surface of a conductor or semiconductor on which an active metal film having high reactivity with oxygen is formed, whereby a warp or dust, if any, can be absorbed by the deformation of the soft metal film, thereby to improve the adhesion at the boundary. Adhesion at the bonding boundary is improved even at a low bonding temperature of, e.g., about 200° C. Further, the toughness at the bonding boundary can be improved to increase reliability by roughening the bonded surface on the side of the glass.Type: GrantFiled: February 26, 2004Date of Patent: December 26, 2006Assignee: Hitachi, Ltd.Inventors: Shohei Hata, Hideo Sotokawa, Hiroaki Furuichi
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Publication number: 20060161940Abstract: In order to improve reliability of an optical disk drive apparatus at low cost, a flexible substrate for making connection between an optical pick-up device incorporated in the optical disk drive apparatus and a drive side is divided into a first flexible substrate fixed to the optical pick-up body (for example, upper surface), and a second flexible substrate connected to the first flexible substrate and extending to the drive, wiring conductors formed on a connection end portion of the first flexible substrate and wiring conductors formed on a connection end portion of the second flexible substrate are superposed at a region adjacent an end of the case of the optical pick-up device body, and connected to each other by joining material, and a connection section between the wiring conductors is held down by a cover for protecting the optical pick-up device body.Type: ApplicationFiled: January 18, 2006Publication date: July 20, 2006Inventors: Satoshi Arai, Hiroaki Furuichi, Yoshio Oozeki, Hideo Sotokawa, Mitsuo Satake, Kazuhiko Ito, Masayoshi Watanabe
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Publication number: 20060062139Abstract: To provide an optical pickup device in which an optical parts module is fixedly adhered in a high positional precision to an optical pickup case, such that the adhesion strength can be sufficiently enhanced against a stress to be applied to the adhering faces from a flexible printed circuit board connected to the optical parts module, the present invention forms the adhering faces on at least two portions across the optical axis of the optical parts module, and also forms groove portions on the individual surfaces of the optical parts module and the optical pickup case for the adhering faces.Type: ApplicationFiled: December 7, 2005Publication date: March 23, 2006Inventors: Yoshio Oozeki, Hiroaki Furuichi, Satoshi Arai, Hideo Sotokawa
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Patent number: 6937406Abstract: The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.Type: GrantFiled: August 22, 2003Date of Patent: August 30, 2005Assignee: OpNext Japan, Inc.Inventors: Naoki Matsushima, Hideo Sotokawa, Hideyuki Kuwano, Yoshiaki Niwa, Keiichi Yamada, Masahiro Hirai, Kazumi Kawamoto, Shohei Hata, Toshiaki Takai
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Publication number: 20040240087Abstract: The present invention provides an optical module and a method for manufacturing the optical module, in which a V-shaped or trapezoidal groove having a first slope and a second slope facing to the first slope is formed at the surface of a silicon substrate by anisotropic etching, an adhesive is applied to a portion of at least the second slope in a region except the first slope of the groove, and lens is fixedly put in the groove.Type: ApplicationFiled: August 22, 2003Publication date: December 2, 2004Applicant: OpNext Japan, Inc.Inventors: Naoki Matsushima, Hideo Sotokawa, Hideyuki Kuwano, Yoshiaki Niwa, Keiichi Yamada, Masahiro Hirai, Kazumi Kawamoto, Shohei Hata, Toshiaki Takai
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Patent number: 6813419Abstract: An optical transmission module includes a beam spot size expanding waveguide and a beam spot size reducing waveguide adjoining in the light propagating direction, or includes a beam spot size expanding waveguide, a beam spot size retaining waveguide and a beam spot size reducing waveguide aligning in the light propagating direction. Each waveguide has laminated core layers which are formed of materials of different refractive indexes.Type: GrantFiled: February 28, 2001Date of Patent: November 2, 2004Assignee: Hitachi, Ltd.Inventors: Naoki Matsushima, Kazumi Kawamoto, Hideo Sotokawa
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Publication number: 20040197949Abstract: In anodic bonding between a conductor or semiconductor and glass, in order to attain good adhesion at a lower bonding temperature than usual and improve the toughness at its boundary to obtain higher reliability for a bonded portion even in a case where bonded members are warped or dust is present at the bonding boundary, a soft metal film is formed on the surface of a conductor or semiconductor on which an active metal film having high reactivity with oxygen is formed, whereby a warp or dust, if any, can be absorbed by the deformation of the soft metal film, thereby to improve the adhesion at the boundary. Adhesion at the bonding boundary is improved even at a low bonding temperature of, e.g., about 200° C. Further, the toughness at the bonding boundary can be improved to increase reliability by roughening the bonded surface on the side of the glass.Type: ApplicationFiled: February 26, 2004Publication date: October 7, 2004Inventors: Shohei Hata, Hideo Sotokawa, Hiroaki Furuichi
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Patent number: 6635971Abstract: An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.Type: GrantFiled: January 11, 2002Date of Patent: October 21, 2003Assignee: Hitachi, Ltd.Inventors: Toyoki Asada, Yuji Fujita, Hideo Sotokawa, Kazumi Kawamoto, Kunio Matsumoto, Shinya Hamagishi, Mari Matsuyoshi
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Patent number: 6554491Abstract: The present invention provides an optical module and apparatus and forming method that can reduce problems in the setting of a silicone-based resin. In one embodiment of the present invention an optical module is provided. The optical module includes: an optical waveguide formed from a first resin, the first resin having fluorine; an intermediary layer above the optical waveguide; and a silicone-based resin layer above the intermediary layer. The intermediary layer may include: a metal, a dielectric, an inorganic compound, or a second resin having a fluorine content of less than 10 percent.Type: GrantFiled: December 18, 2000Date of Patent: April 29, 2003Assignee: Hitachi, Ltd.Inventors: Hideo Sotokawa, Toshimasa Miura
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Publication number: 20020090162Abstract: An electronic device, in which terminals of a semiconductor integrated circuit chip and terminals of a circuit substrate are mounted with solder so as to face one another. The electronic device includes a first resin, which is disposed between the circuit substrate and a terminal formation face of the semiconductor integrated circuit chip and a second resin, which is disposed at the outer perimeter of the semiconductor integrated circuit chip or is disposed laterally thereon. The modulus of elasticity of the second resin is smaller than the modulus of elasticity of the first resin, the modulus of elasticity of the second resin is at least 0.5 GPa but not more than 28 GPa at room temperature.Type: ApplicationFiled: January 11, 2002Publication date: July 11, 2002Inventors: Toyoki Asada, Yuji Fujita, Hideo Sotokawa, Kazumi Kawamoto, Kunio Matsumoto, Shinya Hamagishi, Mari Matsuyoshi
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Publication number: 20020054738Abstract: An optical transmission module includes a beam spot size expanding waveguide and a beam spot size reducing waveguide adjoining in the light propagating direction, or includes a beam spot size expanding waveguide, a beam spot size retaining waveguide and a beam spot size reducing waveguide aligning in the light propagating direction. Each waveguide has laminated core layers which are formed of materials of different refractive indexes.Type: ApplicationFiled: February 28, 2001Publication date: May 9, 2002Inventors: Naoki Matsushima, Kazumi Kawamoto, Hideo Sotokawa
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Publication number: 20010043783Abstract: The present invention provides an optical module and apparatus and forming method that can reduce problems in the setting of a silicone-based resin. In one embodiment of the present invention an optical module is provided. The optical module includes: an optical waveguide formed from a first resin, the first resin having fluorine; an intermediary layer above the optical waveguide; and a silicone-based resin layer above the intermediary layer. The intermediary layer may include: a metal, a dielectric, an inorganic compound, or a second resin having a fluorine content of less than 10 percent.Type: ApplicationFiled: December 18, 2000Publication date: November 22, 2001Applicant: Hitachi, Ltd.Inventors: Hideo Sotokawa, Toshimasa Miura
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Patent number: 5958600Abstract: Disclosed are a highly reliable circuit board and a method of stably manufacturing the circuit board, wherein an insulator made from a specific organic insulating material is provided under a highly stressed conductor for preventing occurrence of cracks in the insulator. In addition, a method of correcting a wiring of a ceramic board is additionally adopted. The circuit board includes a thick film wiring board 1 having a first conductor pattern 2 and a thin film layer laminated on the first conductor pattern 2.Type: GrantFiled: January 9, 1998Date of Patent: September 28, 1999Assignee: Hitachi, Ltd.Inventors: Hideo Sotokawa, Akira Yabushita, Takashi Inoue, Hidetaka Shigi, Mamoru Ogihara, Haruhiko Matsuyama, Minoru Tanaka, Yasunori Narizuka
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Patent number: 5939789Abstract: A multilayer substrate which is fabricated by laminating a plurality of substrates, each comprising an insulation film, a plurality of via holes which pass through the upper surface to the lower surface of the insulation film, a wiring which is provided on the upper surface of the insulation film and the upper surface of the via holes and electrically connected with the via holes, a bonding member which is provided on the lower surfaces of the via holes and electrically connected with the via holes, and a bonding layer which is provided on the upper surface of the insulation film where the wiring is formed and the method of fabrication thereof whereby large costs reduction and high density effect can be obtained.Type: GrantFiled: July 16, 1997Date of Patent: August 17, 1999Assignee: Hitachi, Ltd.Inventors: Michifumi Kawai, Ryohei Satoh, Osamu Yamada, Eiji Matsuda, Masakazu Ishino, Takashi Inoue, Hideo Sotokawa, Masayuki Kyoui
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Patent number: 5868949Abstract: A metalization structure having a first conductor layer on the surface of an underlying layer and, further, a second conductor layer connected conductively with the first conductor layer in which a polyimide insulative film of low thermal expansion coefficient is present between at least an end of a pattern of the second conductor layer and the first conductor layer, for stably obtaining a metalization structure of high reliability and free from the worry of peeling of the conductor portion from a substrate or occurrence of cracking to the underlying layer.Type: GrantFiled: November 14, 1995Date of Patent: February 9, 1999Assignee: Hitachi, Ltd.Inventors: Hideo Sotokawa, Masashi Nishiki, Eiji Matsuzaki, Hidetaka Shigi, Toshio Terouchi, Mamoru Ogihara, Haruhiko Matsuyama, Minoru Tanaka
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Patent number: 5753372Abstract: The present invention provides the wiring structure having a wiring layer and insulation layer and the method of manufacturing the same, wherein at least a part of the wiring of said wiring layer comprises copper, and said insulation layer comprises the polyimide obtained by heating the polyimide precursor composition containing the polyimide precursor having the repeating unit which can be represented by the following general formula (Chemical formula 15). ##STR1## (In this formula, R.sup.1 is at least one type of quadrivalent organic group selected from among the Chemical formulae 16, while R.sup.2 is a bivalent organic group containing aromatic ring).Type: GrantFiled: July 10, 1995Date of Patent: May 19, 1998Assignee: Hitachi, Ltd.Inventors: Hideo Sotokawa, Miharu Otani, Fumio Kataoka, Fusaji Shoji, Haruhiko Matsuyama, Eiji Matsuzaki, Shogi Ikeda, Hidetaka Shigi, Tetsuya Yamazaki, Naoki Matsushima, Shirou Akamatsu
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Patent number: 5536584Abstract: A metalization structure uses a surface protective film formed of a polyimide that is produced by heating and dehydrating polyimide precursor has its molecular chain composed of recurring units represented by the following general formula (1) and recurring units represented by the following general formula (2): ##STR1## (where R.sup.1 is at least one tetravalent organic group selected from among ##STR2## R.sup.2 is at least one divalent organic group of a linear structure as selected from among ##STR3## and R.sup.3 is a divalent organic group of a crooked structure that has at least two aromatic rings).Type: GrantFiled: January 29, 1993Date of Patent: July 16, 1996Assignee: Hitachi, Ltd.Inventors: Hideo Sotokawa, Fusaji Shoji, Fumio Kataoka