Abstract: A card connector 1 comprising a card member 3 having card-side terminals 9 on the leading edge thereof, a card holding member 5 which has mother-apparatus-side terminals on the leading edge thereof and which the card member 3 can be inserted in and extracted from, and a slider 7 which slides inside the card holding member 5 along with the insertion and extraction of the card member 3. An oscillating member 27 which can oscillate freely is provided in the slider 7, an engaging protrusion 29 which engages with the engaging indention on the card member 3 is formed in the mid section of the oscillating member 27, and a cam protrusion 31 is provided at the tip of the oscillating member 27. A cam groove 19 is provided on the inside side wall of the card holding member 5 in opposition to the tip of the cam protrusion 31.

Abstract: 3-dimensional observation on the atomic arrangement and atomic species in a thin-film specimen as well as conventional electron microscope observations is carried out at high speed and accuracy by an electron microscope which measures electrons emitted at high angle from the specimen. For that purpose, the present invention provides a scanning transmission electron microscope having an electron detection device comprising a scintillator converting electrons detected thereby to photons, a photoconductive-film converting photons from the scintillator detected thereby to c.a. 1000 times as many electron-hole pairs as these photons (i.d. avalanche multiplication), an electron gun emitting an electron beam toward the photoconductive-film to detect the holes generated therein, and electron deflector electrodes deflecting the electron beam on the photoconductive-film.

Abstract: A semiconductor wafer is held on a first rotating element in a manner having a first portion of one surface of the wafer stuck on the first rotating element. The first rotating element is rotated together with the wafer thus held thereon to remove moisture from surface portions of the wafer other than the first portion. Then, the wafer is held on a second rotating element in a manner having a second portion of the one surface of the wafer stuck on the second rotating element. The second rotating element is rotated together with the wafer thus held thereon to remove moisture from the surfaces of the wafer including at least the first portion thereof, thereby completely drying the wafer.