Abstract: An electrolytic cell capable of simply electrolyzing carbon dioxide into carbon monoxide and oxygen with low activation energy, and an electrolytic device. The carbon dioxide electrolytic cell includes a cathode, an anode, and a solid electrolyte having oxide ion conductivity. The cathode is the following (A) or (B); (A) a metal and a first mayenite-type compound are included therein or (B) a metal and a second mayenite-type compound are included therein, said second mayenite type compound including a mayenite type compound having electron conductivity.

Abstract: In one embodiment, a semiconductor device has a substrate, a first semiconductor chip, an electrode, a first and second connection member, and a first and second sealing member. The electrode is disposed on the first semiconductor chip and contains Al. The first connection member electrically connects the electrode and the substrate and contains Au or Cu. The first sealing member seals the first semiconductor chip and the first connection member. One or more second semiconductor chips are stacked on the first sealing member. The second sealing member seals the first connection member, the one or more second semiconductor chips, and the one or more second connection members. A ratio of a total weight W1 of Cl ions and Br ions in the first sealing member to a weight W0 of resins of the substrate and the first sealing member is 7.5 ppm or lower.

Abstract: A semiconductor device includes a chip unit mounted on a wiring board. The chip unit includes of semiconductor chips having electrode pads and an interposer having test pads exposed and electrode pads wired from the test pads. The semiconductor chips and the interposer are stacked in a step-like shape so as to be positioned the interposer in an uppermost level. The electrode pads of the semiconductor chips and the interposer are electrically connected by first connecting members, and the electrode pads of the semiconductor chips or the interposer and the wiring board are electrically connected by second connecting members.

Abstract: A coupling structure of a watch band in which a coupling member such as a coupling pin or a hair pin does not sup from a coupling hole even if a user practices strenuous sports or a rotation and a twist are always applied to the coupling portion due to use for years, and a method of manufacturing a piece member for the band coupling structure. In a coupling structure of a band comprising a plurality of piece members, a projection protruded in a central direction of a coupling hole from an internal wall of the coupling hole is formed on an outer end of the coupling hole in the piece member positioned on an outside in a transverse direction, and a coupling member is inserted in the coupling hole provided in the transverse direction of the piece member and is engaged with the projection, thereby coupling the piece members to each other.

Abstract: In a laser module holding a semiconductor laser chip and a reflecting surface, to perform positioning on the semiconductor laser chip with high precision, and reduce the period of production, so as to realize downsizing and cost reduction, reflecting surfaces provided on a silicon substrate has a step portion, and the reflecting surfaces are used as reflecting surface for laser emission light and laser chip positioning surface, for high precision positioning. Further, in a laser module which requires a high level power for recording, slopes opposite to side surfaces of the semiconductor laser chip in a lengthwise direction have a step portion, and in wiring of lower electrodes of the laser chip from the bottom of the sink to an upper portion of the silicon substrate, a slope having an angle with respect to the laser chip lengthwise direction is formed as a gentle slope, then wiring is made via the slope, thus mitigating occurrence of migration.

Abstract: There is provided a supporting member connected to an end of the personal adornment band, a push button slidably mounted in the supporting member, and having a manipulating portion and a hook, a lock member provided in the buckle so as to be engaged with the hook of the push button, and a spring provided in the supporting member for urging the push button outward. An opening is formed by cutting a side wall of the supporting member from an upper plate of the supporting member, thereby leaving a remaining portion at a lower portion of the side wall, and the manipulating portion of the bush button is exposed in the opening.

Abstract: It is an object to provide a coupling structure of a band in which a coupling member such as a coupling pin or a hair pin does not slip from a coupling hole even if a user practices strenuous sports or a rotation and a twist are always applied to the coupling portion due to use for years, and a method of manufacturing a piece member for the band coupling structure. In a coupling structure of a band comprising a plurality of piece members, a projection protruded in a central direction of a coupling hole from an internal wall of the coupling hole is formed on an outer end of the coupling hole in the piece member positioned on an outside in a transverse direction, and a coupling member is inserted in the coupling hole provided in the transverse direction of the piece member and is engaged with the projection, thereby coupling the piece members to each other.

Abstract: An IC chip and overhang portions are stuck to tape by an adhesive agent layer having elasticity. A plurality of solder balls are attached to the tape. By soldering the solder balls to a printed board, a semiconductor device is mounted. In the case where a temperature cycle has been caused, thermal stress occurs between the IC chip and the printed board or between the hangover portion and the printed board because of a difference in coefficient of thermal expansion between the IC chip or the hangover portion and the printed board. However, this thermal stress is absorbed by the elasticity of the adhesive agent layer. As a result, little thermal stress is applied to solder balls. Even if the above described temperature cycle is repeated, therefore, the solder balls are electrically connected to the printed board stably over a long period of time. In addition, the area of the tape is widened by the area of the hangover portions.

Abstract: A fuel reformer suited for mounting on a vehicle is provided. A raw material gas containing methanol and water is vaporized at a vaporization section 30. The vaporized gas flows horizontally to a reforming section 60 with monolithic catalyst 70. The reforming section is divided into two sides, a front side 62 and a rear side 64, with an interconnecting pipe 66 bent at 180 degrees, for connecting the front and rear sides. By making the material gas flow horizontally, even when the reformer is mounted to a vehicle which has a larger space in its horizontal direction than in its vertical direction, especially a small passenger car, the contact time period between gas and catalyst can be extended. By bending the reforming section by 180 degrees, the size of the reformer can be reduced so that the reformer is suited for mounting on a vehicle having limited space.

Abstract: An operation assuring structure of an electronic circuit board in a connector for the electronic circuit board including an insert plate portion disposed on an end portion of an electronic circuit board and adapted to be inserted into a receiving port of a connector, a plurality of signal electronic pads arranged on a surface of the insert plate portion, and a plurality of signal contacts disposed within the receiving port of the connector and adapted to be contacted to the signal electrode pads, wherein a cut-off grounding contact, which is not conductive to the electronic circuit board, is interposed between the signal contacts within the receiving port, and the cut-off grounding contact has a length dimension enough to extend in parallel to the signal contacts and to interpose a distal end thereof between the signal electrode pads on the insert plate portion.

Abstract: The present invention provides a high strength titanium alloy useful as a material for products such as ornaments, products such as ornaments made of the titanium alloy, and a method for producing the products using the titanium alloy as a material. The high strength titanium alloy is capable of attaining high machinability, and the product made of the titanium alloy is excellent in beauty and decorativeness while being hard to made flawed or concaved. According to the present invention, the titanium alloy includes iron of 0.20 to 0.8 mass percent and oxygen of 0.20 to 0.6 mass percent, or iron of 0.2 to 1.0 mass percent, oxygen of 0.15 to 0.6 mass percent and silicon of 0.20 to 1.0 mass percent, with the balance of titanium and inevitable impurities. A method for producing a product using the titanium alloy as a material includes a steps of hot forging the titanium alloy at a temperature of (.beta.-transformation temperature -200.degree. C.

Abstract: A pair of push plates (11, 12) are slidably mounted in a housing (3) so as to be moved in a lateral direction with respect to a longitudinal direction of a personal adornment band (2), one of the push plates (11) has an upper arm (15) having a thickness of an upper half thickness of the push plate, the other push plate (12) has a lower arm (16) having a thickness of a lower half thickness of the push plate, upper and lower arms are overlapped with each other, and a pair of return springs (13) are provided between the push plates for urging each push plate in an outward direction. A cover (4) has a lock pin (21) secured to the underside thereof to be engaged with engaging hooks (20, 20c) of the push plates. In a coupling state of the buckle (1), an engaging rod (23a) provided on a connecting link (23) of an end of the personal adornment band is held by the cover and the housing which are locked each other.

Abstract: A buckle for watch bands has a cover (1), a guide housing (15) secured to an inside of the cover, the guide housing having a pair of push plates (19) each of which has an engaging projection (21) and springs. A middle plate (16) and a tongue (6) are rotatably connected to an end of the cover, and a bottom plate (18) having a band connecting portion and an engaging lug (23) is rotatably connected to the middle plate. A band is connected to the band connecting portion of the bottom plate. Another band having adjusting holes is inserted into a space between the cover (1) and the housing (15) and the tongue (6) is inserted into the adjusting hole so as to adjust the length of the band.

Abstract: The invention provides a nozzle tip for manufacturing a glass fiber having a deformed cross-section which is of a large deformation ratio in the cross-section. A plurality of projected edges are provided to extend downwardly from the distal end of a nozzle tip at its outer periphery. Molten glass coming out of an orifice is separated at an outlet of the orifice into a flow descending from the orifice center and flows descending along inner walls of the projected edges, and the flow descending from the orifice center is attracted toward the flows descending along the inner walls of the projected edges. As a result, a glass fiber having a deformed cross-section is produced which is protruding in its portions corresponding to the projected edges. The cross-section of the glass fiber produced by using the present nozzle tip has a deformation ratio not less than 2.3.

Abstract: In a transmitting and receiving optoelectronic device, a wave-separating filter (16) is disposed at a position deviated from 45.degree. with respect to the optical axis of transmission light (6), or the internal wall surface of a light passage hole (15A) of a support (15) is inclined with respect to the optical axis of the transmission light (5). In another arrangement, a light-transmitting optical unit (1) and a wave-separating optical unit (13) are provided as separate units, and optical-axis adjustment is performed with only the light-transmitting optical unit (1).

Abstract: A metal cover plate for covering a semiconductor chip mounted on a package base plate comprises an upper central portion, a flange extending outwardly from outer edges of the central portion, and a side wall portion extending perpendicularly from the flange along all sides thereof. The central portion has at least one portion in parallel with the package base plate. The central portion is formed with reinforcing portions in the form ridges of gable roofs and valleys in cross section, formed along diagonal lines of the central portion or in the form of a ridge or rib substantially semicircular in cross section extending upwardly or downwardly along each diagonal line. Deflection of the top wall portion of the package during pressure application is thus be minimized.

Abstract: A semiconductor device of a type having a pin grid array, comprises a printed circuit board and a planar metal stem with a plurality of through holes. The stem is made of metal having a coefficient of thermal expansion .alpha.s. The printed circuit board has a predetermined wiring pattern on its upper surface and is made of a material having a maximum coefficient .alpha.p in the widthwise direction. The printed circuit board is superposed over the upper surface of the metal stem. A plurality of lead pins have upper portions inserted into the through holes of the stem and board and are in alignment with each other when the board and the stem are superposed one upon another. Connecting members connect the upper portions of the lead pins with their corresponding wiring patterns. In the semiconductor device, the absolute value .DELTA..alpha. of the difference between the maximum coefficient .alpha.p of the board and the coefficient .alpha.s of the stem (.DELTA..alpha.=.alpha.p -.alpha.

Abstract: A nozzle plate for spinning glass fiber including a flat plate portion and a multiplicity of nozzles projecting from the flat plate portion. Each of the nozzles comprises a greater diameter portion located at its flat plate portion side and a smaller diameter portion located at its tip side. The smaller diameter portion has an inner diameter of 0.3 mm to 1.0 mm and a length of 0.5 mm to 2.0 mm, and the greater diameter portion has an inner diameter of 1.1 mm to 2.5 mm, and the length of the nozzle projecting from the flat plate portion is in range of 4.0 mm to 6.0 mm. By use of this nozzle plate for spining glass fiber, a fine glass fiber having a diameter smaller than 3 .mu.m can be manufactured in a stable manner.

Abstract: A glass composition comprising 54-60% by weight of SiO.sub.2, 13-16% by weight of ZrO.sub.2, 12-15% by weight of Na.sub.2 O, 5.5-14% by weight of MnO and 0-7% by weight of CaO, in which MnO+CaO is 11% by weight or more and MnO.gtoreq.CaO, can produce alkali resistant glass fibers which can be used for reinforcing cement products.