Abstract: Provided is an internal combustion engine component in which a satisfactory heat insulating property is combined with durability superior to that in the related art. The internal combustion engine component constitutes the inner wall surface of the combustion chamber of an internal combustion engine, wherein (1) in the component, a porous layer is formed at least on a surface exposed to the combustion chamber, and (2) the porous layer is a layer formed by three-dimensionally interconnected grains of a ferrite which is spinel type iron oxide.

Abstract: The present invention provides a heat insulated mold having a zirconia insulated layer, the deterioration of which is effectively limited or prevented. The present invention relates to a heat insulated mold having a heat insulating layer between a metal mold base material and a metal film forming a molding surface, wherein: (1) the insulating layer contains zirconia; and (2) a water-blocking layer for blocking entrance of water from the metal film to the heat insulating layer is provided between the heat insulating layer and the metal film.

Abstract: The present invention provides a heat insulated mold having a zirconia insulated layer, the deterioration of which is effectively limited or prevented. The present invention relates to a heat insulated mold having a heat insulating layer between a metal mold base material and a metal film forming a molding surface, wherein: (1) the insulating layer contains zirconia; and (2) a water-blocking layer for blocking entrance of water from the metal film to the heat insulating layer is provided between the heat insulating layer and the metal film.

Abstract: A method for mounting an electronic circuit-constituting member on a substrate. The method includes preparing a substrate having a surface comprising a liquid-attracting first region and a liquid-repelling second region that surrounds the first region. The method also includes bringing water into contact with the surface of the substrate so as to dispose said water only on the said first region. The method further includes subjecting said substrate to a member-containing liquid that includes an organic solvent where an electronic circuit-constituting member are dispersed in the organic solvent to move said electronic circuit-constituting member to said water disposed on the said first region. The surface of the member is chemically modified with a silane coupling agent including a group with a C—Cl bond. Also, the method includes removing the water and the organic solvent from the surface of the substrate to mount said electronic circuit-constituting member on said substrate.

Abstract: An ink jet head unit including a head (2) in which a plurality of nozzle arrays (2a, 2b, 2c, 2d) are formed. Each of the nozzle arrays has a number of nozzle holes, and ink can be ejected from the nozzle holes. The head (2) is mounted on the head base, and flat cables (4a, 4b) are connected at one end to mounting parts (7a, 7b), which are interposed between a first pair of the nozzle arrays (2a, 2b) and a second pair of the nozzle arrays (2c, 2d). The flat cables are flexibly formed by covering transmission wires with an insulation film. The flat cables are connected to the head to transmit ink ejection signals for driving the head.

Abstract: According to a method of the present invention for manufacturing a semiconductor piece, at least two semiconductor layers (12) are first formed on a substrate (10) by stacking a sacrificial layer (11) and the semiconductor layer (12) on the substrate (10) in this order and repeating this stacking. Next, the semiconductor layers (12) are divided into pieces by etching part of the sacrificial layers (11) and part of the semiconductor layers (12). Then, the pieces are separated from the substrate by removing the sacrificial layers (11).

Abstract: According to a method of the present invention for manufacturing a semiconductor piece, at least two semiconductor layers (12) are first formed on a substrate (10) by stacking a sacrificial layer (11) and the semiconductor layer (12) on the substrate (10) in this order and repeating this stacking. Next, the semiconductor layers (12) are divided into pieces by etching part of the sacrificial layers (11) and part of the semiconductor layers (12). Then, the pieces are separated from the substrate by removing the sacrificial layers (11).

Abstract: A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).

Abstract: A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).

Abstract: A mounting method comprising the steps of (A) disposing first liquid (2) on first region (11) provided on one principal surface of substrate (1); (B) bringing member-containing liquid (5) containing second liquid (3) and at least one member (4) into contact with the first liquid (2) disposed on the first region (11); and (C) removing the first liquid (2) and the second liquid (3) from the one principal surface to thereby dispose the member (4) on the first region (11). The first liquid (2) is substantially not dissolved in the second liquid (3). The wettability of the first liquid (2) with respect to the surface of the member (4) is higher than that of the second liquid (3).

Abstract: A piezoelectric element includes two electrode films and a layered piezoelectric film which is sandwiched between the electrode films and made of two thin piezoelectric films each having preferred orientation along the (111) plane. The two thin piezoelectric films are aggregates of columnar grains, respectively, which are continuously linked to each other. The columnar grains of the second thin piezoelectric film have a larger average cross-sectional diameter than the columnar grains of the first thin piezoelectric film. The ratio of the thickness of the layered piezoelectric film to the average cross-sectional diameter of the columnar grains of the second thin piezoelectric film is 20 to 60 inclusive.

Abstract: A mounting method of the present invention includes the steps of: (I) disposing a first liquid in a first region provided on one principal surface of a substrate; (II) bringing a pillar-like member as an anisotropically-shaped member, disposed on one principal surface of a transfer substrate in a predetermined orientation, into contact with the first liquid disposed in the first region, so as to move the pillar-like member to a region of the first liquid; and (III) removing the first liquid from the substrate.

Abstract: Plural nozzle arrays of which each comprises plural nozzle holes (247a) from which ink is ejected are arranged slantingly in a main scanning direction. A distance between a first arbitrary nozzle hole (247a-1) and a second nozzle hole (247a-2), in a nozzle array adjacent to the array to which this first nozzle hole (247a-1) belongs, which is adjacent to the first nozzle hole (247a-1), and a distance between the first nozzle hole (247a-1) and a third nozzle hole (247a-3), in the nozzle array to which the second nozzle hole (247a-2) belongs, which is further adjacent to the first nozzle hole (247a-1) are different from each other.

Abstract: In a piezoelectric element, an adhesive layer 12 is provided on a substrate 11, a first electrode layer 14 made of a noble metal containing titanium or titanium oxide is provided on the adhesive layer 12, and an orientation control layer 15 that is preferentially oriented along a (100) or (001) plane is provided on the first electrode layer 14. In the vicinity of a surface of the orientation control layer 15 that is closer to the first electrode layer 14, a (100)- or (001)-oriented region extends over titanium or titanium oxide located on one surface of the first electrode layer 14 that is closer to the orientation control layer 15, and the cross-sectional area of the region in the direction perpendicular to the thickness direction gradually increases in the direction away from the first electrode layer 14 toward the opposite side. Further, a piezoelectric layer 16 that is preferentially oriented along a (001) plane is provided on the orientation control layer 15.

Abstract: A piezoelectric element 1 includes a lower electrode 2, a piezoelectric film 3 and an upper electrode 4 stacked in this order. The surface of the upper electrode 4 of the piezoelectric element 1 is exposed to a zirconium compound 6.

Abstract: A mounting method of the present invention includes the steps of: (I) disposing a first liquid in a first region provided on one principal surface of a substrate; (II) bringing a pillar-like member as an anisotropically-shaped member, disposed on one principal surface of a transfer substrate in a predetermined orientation, into contact with the first liquid disposed in the first region, so as to move the pillar-like member to a region of the first liquid; and (III) removing the first liquid from the substrate.

Abstract: A lead content in a piezoelectric thin film (3) of a piezoelectric element (20) is made smaller as compared to stoichiometric composition. More specifically, the piezoelectric thin film (3) is made of lead zirconate titanate expressed as Pb(1-x)(Zr(1-s)Tis)O3(0<s<1) or lead-zirconate-titanate-based oxide expressed as (Pb(1-x-y)Ay)(Zr(1-s-t)TisBt)O3(0<s<1, 0<t<1-s) where A is a substitutive metal ion in an A-site in the perovskite crystalline structure and B is a substitutive metal ion in a B-site in the perovskite crystalline structure. The value of x, which indicates a deficiency in Pb content in each composition, is more than 0 but not more than 0.15.

Abstract: The first object of the present invention is to provide a PDP with improved panel brightness which is achieved by improving the efficiency in conversion from discharge energy to visible rays. The second object of the present invention is to provide a PDP with improved panel life which is achieved by improving the protecting layer protecting the dielectrics glass layer. To achieve the first object, the present invention sets the amount of xenon in the discharge gas to the range of 10% by volume to less than 100% by volume, and sets the charging pressure for the discharge gas to the range of 500 to 760 Torr which is higher than conventional charging pressures. With such construction, the panel brightness increases. Also, to achieve the second object, the present invention has, on the surface of the dielectric glass layer, a protecting layer consisting of an alkaline earth oxide with (100)-face or (110)-face orientation.

Abstract: The first object of the present invention is to provide a PDP with improved panel brightness which is achieved by improving the efficiency in conversion from discharge energy to visible rays. The second object of the present invention is to provide a PDP with improved panel life which is achieved by improving the protecting layer protecting the dielectrics glass layer. To achieve the first object, the present invention sets the amount of xenon in the discharge gas to the range of 10% by volume to less than 100% by volume, and sets the charging pressure for the discharge gas to the range of 500 to 760 Torr which is higher than conventional charging pressures. With such construction, the panel brightness increases. Also, to achieve the second object, the present invention has, on the surface of the dielectric glass layer, a protecting layer consisting of an alkaline earth oxide with (100)-face or (110)-face orientation.

Abstract: The first object of the present invention is to provide a PDP with improved panel brightness which is achieved by improving the efficiency in conversion from discharge energy to visible rays. The second object of the present invention is to provide a PDP with improved panel life which is achieved by improving the protecting layer protecting the dielectrics glass layer. To achieve the first object, the present invention sets the amount of xenon in the discharge gas to the range of 10% by volume to less than 100% by volume, and sets the charging pressure for the discharge gas to the range of 500 to 760 Torr which is higher than conventional charging pressures. With such construction, the panel brightness increases. Also, to achieve the second object, the present invention has, on the surface of the dielectric glass layer, a protecting layer consisting of an alkaline earth oxide with (100)-face or (110)-face orientation.