Patents by Inventor Hideo Wantanabe

Hideo Wantanabe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • PROPYLENE RESIN COMPOSITION, BLOW MOLDED PANEL COMPRISED OF THE COMPOSITION, AND AUTOMOBILE DECK BOARD COMPRISED OF THE BLOW MOLDED PANEL
    Publication number: 20070203300
    Abstract: A resin composition for blow molding is provided, made by formulating 0 to 30 weight parts of an inorganic filler based on 100 weight parts of a resin composition having of: 20 to 95% by weight of polypropylene resin having a melting point evaluated by a differential scanning calorimeter (DSC) of 160° C. or higher, the polypropylene resin being formulated of a propylene-ethylene block copolymer having an ethylene content of 3 to 15% by weight; and 5 to 80% by weight of polyethylene resin having a melting point evaluated by a differential scanning calorimeter (DSC) of 130° C. or higher, and a tensile break strength is 250 Kg/cm3 or more at ambient temperature, and a tensile break elongation is 500% or more.
    Type: Application
    Filed: February 28, 2007
    Publication date: August 30, 2007
    Applicant: KYORAKU CO., LTD.
    Inventors: Takehiko Sumi, Hideo Wantanabe