Abstract: Disclosed is equipment for measuring a silicon concentration in a phosphoric acid solution under use as an etching solution during operation of a semiconductor substrate processing system. The equipment is provided with at least a reaction tank and a concentration-measuring tank. The reaction tank includes a reaction unit for adding hydrofluoric acid to a predetermined constant amount of the phosphoric acid solution drawn out of the semiconductor substrate processing system to form a silicon fluoride compound and then causing the silicon fluoride compound to evaporate. The concentration-measuring tank comprises a hydrolysis unit for bubbling the silicon fluoride compound, which has evaporated from the reaction tank, through deionized water to hydrolyze the silicon fluoride compound and a measurement unit for determining a change rate of silicon concentration in the deionized water subsequent to the bubbling.

Abstract: Disclosed is equipment for measuring a silicon concentration in a phosphoric acid solution under use as an etching solution during operation of a semiconductor substrate processing system. The equipment is provided with at least a reaction tank and a concentration-measuring tank. The reaction tank includes a reaction unit for adding hydrofluoric acid to a predetermined constant amount of the phosphoric acid solution drawn out of the semiconductor substrate processing system to form a silicon fluoride compound and then causing the silicon fluoride compound to evaporate. The concentration-measuring tank comprises a hydrolysis unit for bubbling the silicon fluoride compound, which has evaporated from the reaction tank, through deionized water to hydrolyze the silicon fluoride compound and a measurement unit for determining a change rate of silicon concentration in the deionized water subsequent to the bubbling.

Abstract: A method of measuring material in which the material is conveyed by a conveying unit and dropped from a discharge portion of the conveying unit to be supplied into a measuring unit arranged under the discharge portion, and is measured by the measuring unit, includes a first supplying step of supplying the material through the discharge portion into the measuring unit until a quantity of the material measured by the measuring unit reaches a preparatory target value which is small compared to a final measuring target value of the material, and a second supplying step of receiving a portion of the material to be supplied through the discharge portion into the measuring unit on the way to where the material is dropped for recovery, whereby the material is supplied through the discharge portion into the measuring unit at a supplying rate that is smaller than that in the first supplying step, wherein the material is stopped from being supplied through the discharge portion into the measuring unit at a time when the

Abstract: A method of measuring material in which the material is conveyed by a conveying unit and dropped from a discharge portion of the conveying unit to be supplied into a measuring unit arranged under the discharge portion, and is measured by the measuring unit, includes a first supplying step of supplying the material through the discharge portion into the measuring unit until a quantity of the material measured by the measuring unit reaches a preparatory target value which is small compared to a final measuring target value of the material, and a second supplying step of receiving a portion of the material to be supplied through the discharge portion into the measuring unit on the way to where the material is dropped for recovery, whereby the material is supplied through the discharge portion into the measuring unit at a supplying rate that is smaller than that in the first supplying step, wherein the material is stopped from being supplied through the discharge portion into the measuring unit at a time when the