Abstract: A method and apparatus for manufacturing electronic parts in which leads can be accurately bent and maintenance operations are easy. Each electronic part so manufactured includes a resin mold section 2 with a built-in electronic device and leads projecting therefrom, and the manufacturing method comprises bending a first portion of each of leads 3 to form a first bent portion 3d, bending a second portion of the lead 3 to form a second bent portion, and pressing the lead from obliquely above to bend the lead in such a manner that a tip portion of the lead 3 is located at a bottom portion of a resin mold. In the first bending step, a V-shaped groove 3c is formed near a root of the lead 3, and in the second bending step, the V-shaped groove 3c is bent to form a second bent portion 3e.

Abstract: In manufacturing an electronic component composed of a plastic molded part having a built-in electronic element, and leads projecting from the plastic molded part, a first partial lead section, between an intermediate section and a tip section, of each lead of the electronic component is bent downward. The first section of each lead is bent from the side toward a bottom of the plastic molded part after further bending a base of each lead.