Patents by Inventor Hidesato HISANAGA

Hidesato HISANAGA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11929353
    Abstract: A white light emitting device includes: first light-emitting units to which a first current is applied; and second light-emitting units to which a second current which is different from the first current is applied. When the first current is applied to the first light-emitting units and the second current is applied to the second light-emitting units, an average emission chromaticity of the first light-emitting units and an average emission chromaticity of the second light-emitting units are identical colors. When the same current is applied to both the first light-emitting units and the second light-emitting units, the average emission chromaticity of the first light-emitting units and the average emission chromaticity of the second light-emitting units are non-identical colors.
    Type: Grant
    Filed: December 16, 2020
    Date of Patent: March 12, 2024
    Assignee: NUVOTON TECHNOLOGY CORPORATION JAPAN
    Inventors: Hidesato Hisanaga, Tetsuya Kamada, Shigeo Hayashi, Takashi Kuwaharada
  • Patent number: 11239144
    Abstract: A semiconductor device includes a mounting substrate; a first wiring electrode and a second wiring electrode disposed on a main surface of a mounting substrate; an interposing member disposed between the first wiring electrode and the second wiring electrode; a semiconductor element flip-chip connected with the first wiring electrode and the second wiring electrode via a first electrical connection member and a second electrical connection member so as to at least partially overlap the interposing member in a top surface view; and a resin disposed in contact with the semiconductor element and the mounting substrate. The wettability of the interposing member to the resin is higher than that of the mounting substrate to the resin. The resin is disposed in contact with the semiconductor element and the interposing member.
    Type: Grant
    Filed: December 6, 2019
    Date of Patent: February 1, 2022
    Assignee: NUVOTON TECHNOLOGY CORPORATION JAPAN
    Inventors: Hidesato Hisanaga, Akira Sengoku
  • Publication number: 20210104501
    Abstract: A white light emitting device includes: first light-emitting units to which a first current is applied; and second light-emitting units to which a second current which is different from the first current is applied. When the first current is applied to the first light-emitting units and the second current is applied to the second light-emitting units, an average emission chromaticity of the first light-emitting units and an average emission chromaticity of the second light-emitting units are identical colors. When the same current is applied to both the first light-emitting units and the second light-emitting units, the average emission chromaticity of the first light-emitting units and the average emission chromaticity of the second light-emitting units are non-identical colors.
    Type: Application
    Filed: December 16, 2020
    Publication date: April 8, 2021
    Inventors: Hidesato HISANAGA, Tetsuya KAMADA, Shigeo HAYASHI, Takashi KUWAHARADA
  • Publication number: 20200185316
    Abstract: A semiconductor device includes a mounting substrate; a first wiring electrode and a second wiring electrode disposed on a main surface of a mounting substrate; an interposing member disposed between the first wiring electrode and the second wiring electrode; a semiconductor element flip-chip connected with the first wiring electrode and the second wiring electrode via a first electrical connection member and a second electrical connection member so as to at least partially overlap the interposing member in a top surface view; and a resin disposed in contact with the semiconductor element and the mounting substrate. The wettability of the interposing member to the resin is higher than that of the mounting substrate to the resin. The resin is disposed in contact with the semiconductor element and the interposing member.
    Type: Application
    Filed: December 6, 2019
    Publication date: June 11, 2020
    Inventors: Hidesato HISANAGA, Akira SENGOKU