Patents by Inventor Hideshi Hanada

Hideshi Hanada has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device
    Patent number: 6700186
    Abstract: A lead frame for a semiconductor device. The semiconductor device has a sheet with oppositely facing sides and a thickness between the oppositely facing sides. The sheet has first and second unit lead frames. Each unit lead frame has a support for a semiconductor chip and at least one lead space from the support. The sheet has a tie bar network which connects a) the support to the at least one lead on each of the first and second lead frames and b) the first and second lead frames, each to the other. The sheet has a dividing line along which the sheet can be cut to separate the first and second lead frames from each other. The tie bar network consists of at least one tie bar extending along a substantial length of the dividing line. The support has a first thickness between the oppositely facing sides of the sheet. The at least one tie bar has a second thickness between the oppositely facing sides of the sheet over a substantial length of the dividing line that is less than the first thickness.
    Type: Grant
    Filed: December 17, 2001
    Date of Patent: March 2, 2004
    Assignee: Mitsui High-tec, Inc.
    Inventors: Shoshi Yasunaga, Hideshi Hanada, Takahiro Ishibashi, Jun Sugimoto, Yuichi Dohki, Hitoshi Etoh
  • Semiconductor device and lead frame assembly/lead frame for making a semiconductor device
    Patent number: 6518657
    Abstract: A semiconductor device having oppositely facing first and second sides. The semiconductor device has a support exposed at the first side of the semiconductor device, a semiconductor device mounted on the support, and a plurality of leads connected to the semiconductor device. A lead identifier on the support is visible at the first side of the semiconductor device, and assists identification of a specific lead in the plurality of leads.
    Type: Grant
    Filed: June 11, 2001
    Date of Patent: February 11, 2003
    Assignee: Mitsui High-tec Inc.
    Inventors: Hideshi Hanada, Jun Sugimoto, Yuichi Douki
  • Lead frame for a semiconductor device, a semiconductor device made from the lead frame, and a method of making a semiconductor device
    Publication number: 20020079561
    Abstract: A lead frame for a semiconductor device. The semiconductor device has a sheet with oppositely facing sides and a thickness between the oppositely facing sides. The sheet has first and second unit lead frames. Each unit lead frame has a support for a semiconductor chip and at least one lead space from the support. The sheet has a tie bar network which connects a) the support to the at least one lead on each of the first and second lead frames and b) the first and second lead frames, each to the other. The sheet has a dividing line along which the sheet can be cut to separate the first and second lead frames from each other. The tie bar network consists of at least one tie bar extending along a substantial length of the dividing line. The support has a first thickness between the oppositely facing sides of the sheet. The at least one tie bar has a second thickness between the oppositely facing sides of the sheet over a substantial length of the dividing line that is less than the first thickness.
    Type: Application
    Filed: December 17, 2001
    Publication date: June 27, 2002
    Inventors: Shoshi Yasunaga, Hideshi Hanada, Takahiro Ishibashi, Jun Sugimoto, Yuichi Dohki, Hitoshi Etoh
  • Semiconductor device and lead frame assembly/lead frame for making a semiconductor device
    Publication number: 20020047194
    Abstract: A semiconductor device having oppositely facing first and second sides. The semiconductor device has a support exposed at the first side of the semiconductor device, a semiconductor device mounted on the support, and a plurality of leads connected to the semiconductor device. A lead identifier on the support is visible at the first side of the semiconductor device, and assists identification of a specific lead in the plurality of leads.
    Type: Application
    Filed: June 11, 2001
    Publication date: April 25, 2002
    Inventors: Hideshi Hanada, Jun Sugimoto, Yuichi Douki