Abstract: A cooling method and cooling apparatus which can reduce thermal deformation of a mobile body of a machine tool is provided. On the front of a column (1), a pair of upper and lower guides (3) is formed, and saddle (7) is suspended on guides (3), saddle (7) being movable left and right. Guiding surface (5) of guide (3) and sliding surface (9) of saddle (7) are slip surface and are in contact with each other. Sliding surfaces (9a, 9b, 9d, 9e) which generate a large amount of heat and need to be cooled are identified in advance by simulation. Fluid pipelines (25) for cooling the identified portions generating higher heat are formed, and a coolant liquid is circulated by being passed from portion (9a) generating less heat toward portion (9e) generating higher heat.

Abstract: A tape adhering device including: a drawing roller for drawing out a tape; a tape fixing means for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered under the condition that fixing operation of the tape by the tape fixing means is released.

Abstract: A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.

Abstract: A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3); a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.

Abstract: A cooling method and cooling apparatus which can reduce thermal deformation of a mobile body of a machine tool is provided. On the front of a column (1), a pair of upper and lower guides (3) is formed, and saddle (7) is suspended on guides (3), saddle (7) being movable left and right. Guiding surface (5) of guide (3) and sliding surface (9) of saddle (7) are slip surface and are in contact with each other. Sliding surfaces (9a, 9b, 9d, 9e) which generate a large amount of heat and need to be cooled are identified in advance by simulation. Fluid pipelines (25) for cooling the identified portions generating higher heat are formed, and a coolant liquid is circulated by being passed from portion (9a) generating less heat toward portion (9e) generating higher heat.

Abstract: A production system capable of further improving production efficiency and quality. The ring management system includes size measurement unit for measuring size of the ring, first convey unit for moving the ring w whose size has been measured, a first stocker having a plurality of storage positions for storing rings conveyed by the first convey unit, a second convey unit for conveying out the rings from the first stocker means for stacking, and a control unit. The control unit includes memory means for storing the rings size measured by the size measurement means in association with the storage position in the first stocker, first selection means for selecting a ring constituting a stacked ring according to the ring size stored in the memory means, and first instruction means to instruct the second convey unit to convey out the ring selected by the first selection means from the storage position pj in the first stocker.

Abstract: A production system capable of further improving production efficiency and quality. The ring management system includes size measurement unit for measuring size of the ring, first convey unit for moving the ring w whose size has been measured, a first stocker having a plurality of storage positions for storing rings conveyed by the first convey unit, a second convey unit for conveying out the rings from the first stocker means for stacking, and a control unit. The control unit includes memory means for storing the rings size measured by the size measurement means in association with the storage position in the first stocker, first selection means for selecting a ring constituting a stacked ring according to the ring size stored in the memory means, and first instruction means to instruct the second convey unit to convey out the ring selected by the first selection means from the storage position pj in the first stocker.

Abstract: A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.

Abstract: A peeling tap adhering method for adhering a peeling tape (4) to a surface protection film (11) adhered to the front surface of a wafer (20), comprises the steps of: supporting the wafer on a table (31) under the condition that the surface protection film is directed upward; adhering the peeling tape onto the surface protection film by pressing the peeling tape onto the surface protection film when a peeling tape adhering means (46) is lowered; detecting the pressure between the surface protection film of the wafer and the peeling tape adhering means; and stopping the peeling tape adhering means from lowering in the case where a pressure detection value (P) is not less than a predetermined value (P0). Due to the foregoing, it is possible to prevent the wafer from being cracked. Further, it is possible to prevent the peeling tape and the dicing tape from adhering to each other.

Abstract: A workpiece processing device (10) for processing a workpiece (60; 20, 36) comprises: a surface protection film peeling means (50) for peeling a surface protection film (110), which is adhered to a front surface (21) of a workpiece, with a peeling tape (4); a bar code adhering means (11) for adhering a bar code (65) corresponding to the workpiece to the workpiece; and a movable support table (72) for supporting the workpiece. A peeling operation for peeling the surface protection film conducted by the surface protection film peeling means and a adhering operation for adhering a bar code conducted by the bar code adhering means are given to the workpiece while the workpiece is being supported by the support table. Due to the foregoing, it is possible to avoid failures when adhering the bar code to the workpiece, such as a wafer. The bar code adhering means may adhere the bar code, which corresponds to character information of the workpiece read out by an optical reading means, to the workpiece.

Abstract: A tape adhering device (10) comprises: a drawing roller (42) for drawing out a tape (3); a tape fixing means (47) for fixing one portion of the tape drawn out from the drawing roller; a tape drawing means (62) for drawing out a predetermined amount of tape, which is fixed by the tape fixing means, from the drawing roller between the tape fixing means and the drawing roller; and a tape adhering means (49, 31, 37) for adhering the tape, which is located in the downstream of the tape fixing means, onto an object to be adhered (20, 36) under the condition that fixing operation of the tape by the tape fixing means is released. It is preferable that the length of the tape drawn out by the tape drawing means is not less than the diameter of the object to be adhered. Due to the foregoing, it is possible to prevent wrinkles from being form on the tape at the time of adhering the tape.

Abstract: A film peeling device for peeling a film (11) adhered to a front surface of a wafer (20), on the back surface of which a dicing tape (3) is adhered, the wafer is integrated with a mount frame (36) into one body, comprises: a movable table (31), which can be moved horizontally to support the wafer and the mount frame while the surface protection film is being directed upward; a covering means (80) for covering an adhesive face (3a) of the dicing tape, which is exposed between the mount frame and the wafer at one end (28) of the wafer; and a adhering means (46) for adhering a peeling tape (4) to the film at the end of the wafer. The film is peeled from the front surface of the wafer by moving the movable table from the other end (29) of the wafer to one end after the peeling tape has adhered. Due to the foregoing, while the peeling tape is being prevented from adhering to the dicing tape, the film can be peeled from the front surface of the wafer in a shorter period of time.

Abstract: A production system capable of further improving production efficiency and quality. The ring management system includes size measurement unit for measuring size of the ring, first convey unit for moving the ring w whose size has been measured, a first stocker having a plurality of storage positions for storing rings conveyed by the first convey unit, a second convey unit for conveying out the rings from the first stocker means for stacking, and a control unit. The control unit includes memory means for storing the rings size measured by the size measurement means in association with the storage position in the first stocker, first selection means for selecting a ring constituting a stacked ring according to the ring size stored in the memory means, and first instruction means to instruct the second convey unit to convey out the ring selected by the first selection means from the storage position pj in the first stocker.

Abstract: A cassette conveyance apparatus (10) includes: a first conveyance means (20) for conveying a first cassette (40) in a horizontal and vertical direction; and a second conveyance means (30) for conveying a second cassette (50) in a horizontal and vertical direction. In the cassette conveyance apparatus (10), the first and second cassettes are circulated between a predetermined wafer accommodation position (P1), at which a wafer (2) is accommodated in the cassette, and a predetermined cassette replacement position (P0) at which a cassette accommodating a plurality of wafers is replaced with an empty cassette. Due to the foregoing, the wafers are continuously accommodated in the cassette without stopping an operation of a pretreatment step.

Abstract: A production system capable of further improving production efficiency and quality. The ring management system includes size measurement unit for measuring size of the ring, first convey unit for moving the ring w whose size has been measured, a first stocker having a plurality of storage positions for storing rings conveyed by the first convey unit, a second convey unit for conveying out the rings from the first stocker means for stacking, and a control unit. The control unit includes memory means for storing the rings size measured by the size measurement means in association with the storage position in the first stocker, first selection means for selecting a ring constituting a stacked ring according to the ring size stored in the memory means, and first instruction means to instruct the second convey unit to convey out the ring selected by the first selection means from the storage position pj in the first stocker.

Abstract: The present invention provides a production system capable of further improving production efficiency and quality. The ring management system comprises size measurement unit 300 for measuring size (l, t) of the ring w, first convey unit 400 for moving the ring w whose size has been measured, a first stocker 500 having a plurality of storage positions for storing rings conveyed in by the first convey unit 400, a second convey unit 700 for conveying out the rings from the first stocker 500 means for stacking, and a control unit 900.

Abstract: A shaft 17 defines a front end portion 17a having a larger diameter and an opposite tail end portion 17b having a smaller diameter, the shaft 17 being rotatably supported by the housing 13 through a radial bearing 19 and a pair of angular ball bearings 21 at the front side large diameter portion 17a and the small diameter portion 17b, respectively.

Abstract: A metal ring loading and unloading apparatus is capable of loading and unloading a metal ring quickly and highly accurately for increased efficiency. The metal ring loading and unloading apparatus has a moving unit 41 slidably movable along a rail 48 which extends from a loaded ring placement unit 8 to an unloaded ring placement unit 11. On the moving unit 41, there are mounted a loaded ring delivering unit 9 for holding and delivering a metal ring W on the loaded ring placement unit 8 and an unloaded ring delivering unit 10 for removing the metal ring W from support rollers 3, 4 and delivering the metal ring W to the unloaded ring placement unit 11. The loaded ring placement unit 8 has a pressing unit for radially pressing the metal ring W to deform the metal ring W into a substantially elliptical shape. The loaded ring delivering unit 9 has a loaded ring gripping unit 26 for gripping the metal ring W deformed by the pressing unit.

Abstract: A centrifugal casting apparatus has a workpiece withdrawal mechanism, a cleaning mechanism, and a facing material applying mechanism which are disposed parallel to each other on an axial side of a centrifugal casting mold, a unit drive mechanism for moving the workpiece withdrawal mechanism, the cleaning mechanism, and the facing material applying mechanism in unison with each other in the direction indicated by the arrow B across the axial direction indicated by the arrow A, and a pouring mechanism disposed in an opposite axial side of the centrifugal casting mold.

Abstract: A rolling apparatus is capable of rolling a metal ring to an accurate circumferential length and preventing the metal ring from dropping off. The rolling apparatus includes a metal ring support assembly having tension rollers 2a, 2b for supporting a metal ring W, a rolling roller 5 for rolling the metal ring W, a rolling assembly for pressing the rolling roller 5 against the metal ring W, a tension applying assembly having a tension cylinder 23 engaging tension roller support members 8, 10, 25, on which one of the tension rollers 2b is rotatably supported, for displacing the tension roller 2b to apply tension to the metal ring W, and a rolling processing completing assembly 27 for detecting a completion of rolling of the metal ring W and inactivating the rolling assembly and the tension applying assembly. The rolling assembly has a first resilient member 18 interposed between the rolling cylinder 14 and its piston rod 15.