Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.

Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer on the surface of the copper foil is suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is suppressed. The surface of the roughening treatment layer satisfies one or more of the following: a roughness Ra is 0.08 to 0.20 ?m, a roughness Rz is 1.00 to 2.00 ?m, a roughness Sq is 0.16 to 0.30 ?m, a roughness Ssk is ?0.6 to ?0.35, a roughness Sa is 0.12 to 0.23 ?m, a roughness Sz is 2.20 to 3.50 ?m, a roughness Sku is 3.75 to 4.50, and a roughness Spk is 0.13 to 0.27 ?m, a glossiness of a TD of the surface of the side of the roughening treatment layer of the surface treated copper foil is 70% or less.

Abstract: Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180° C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable.

Abstract: Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer provided on the surface of the copper foil is favorably suppressed. Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treatment layer on one surface, and/or another roughening treatment layer the other surface of the copper foil, wherein a height of roughening particles of the roughening treatment layer is 5 to 1000 nm from the surface, a color difference ?E*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and a glossiness of the TD of the surface of the side of the roughening treatment layer is 70% or less.

Abstract: The invention provides a surface-treated copper foil for a battery cell that is capable of providing good adhesiveness to an active substance and undergoes less detachment of roughening particles. The surface-treated copper foil for a battery cell according to one or more embodiments of the present application contains a copper foil and a surface treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains a primary particle layer and a secondary particle layer, and the surface of the surface treatment layer has a ten-point average roughness Rz of 1.8 ?m or more measured with a laser microscope with a wavelength of 405 nm according to JIS B0601 1994.

Abstract: A copper foil for printed circuits is prepared by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on ternary alloy composed of copper, cobalt and nickel on the primary particle layer. The average particle size of the primary particle layer is 0.25 to 0.45 ?m, and the average particle size of the secondary particles layer based on ternary alloy composed of copper, cobalt and nickel is 0.05 to 0.25 ?m. Provided is a copper foil for printed circuits, in which powder fall from the copper foil can be reduced and the peeling strength and heat resistance can be improved by forming a primary particle layer of copper on a surface of a copper foil, and then forming a secondary particle layer based on copper-cobalt-nickel alloy plating on the primary particle layer.

Abstract: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 ?m or more.

Abstract: To provide a surface-treated copper foil that is excellent in adhesiveness to an insulating substrate at ordinary temperature, and is capable of suppressing the formation of blister on application of a thermal load of reflow soldering to a copper-clad laminate board constituted by the copper foil. A surface-treated copper foil having a surface-treated surface, the surface-treated copper foil satisfying one or more of the following conditions (1) to (3): by an XPS measurement at a depth after sputtering from the surface-treated surface for 0.5 min at a rate of 1.1 nm/min (SiO2 conversion), (1) the N concentration is from 1.5 to 7.5 atomic %; (2) the C concentration is from 12 to 30 atomic %; and (3) the Si concentration is 3.1 atomic % or more and the O concentration is from 40 to 48 atomic %.

Abstract: Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.

Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed. The surface treated copper foil, comprising a copper foil, and a roughening treatment layer on at least one surface of the copper foil, wherein a surface of the side of the roughening treatment layer of the surface treated copper foil satisfies one or more selected from the following items (1-1) to (1-8), and (1-1) a roughness Ra is 0.08 to 0.20 ?m, (1-2) a roughness Rz is 1.00 to 2.00 ?m, (1-3) a roughness Sq is 0.16 to 0.30 ?m, (1-4) a roughness Ssk is ?0.6 to ?0.35, (1-5) a roughness Sa is 0.12 to 0.23 ?m, (1-6) a roughness Sz is 2.20 to 3.50 ?m, (1-7) a roughness Sku is 3.75 to 4.50, (1-8) a roughness Spk is 0.13 to 0.

Abstract: The present invention provides a surface treated copper foil in which a dropping of the roughening particles from a roughening treatment layer provided on the surface of the copper foil is favorably suppressed and an occurrence of wrinkles or stripes when bonding with an insulating substrate is favorably suppressed.

Abstract: The invention provides a surface-treated copper foil for a battery cell that is capable of providing good adhesiveness to an active substance and undergoes less detachment of roughening particles. The surface-treated copper foil for a battery cell according to one or more embodiments of the present application contains a copper foil and a surface treatment layer on at least one surface of the copper foil, wherein the surface treatment layer contains a primary particle layer and a secondary particle layer, and the surface of the surface treatment layer has a ten-point average roughness Rz of 1.8 ?m or more measured with a laser microscope with a wavelength of 405 nm according to JIS B0601 1994.

Abstract: Disclosed is a surface treated copper foil, which is capable of favorably reducing the transmission loss even when used in a high frequency circuit substrate, and after laminating with a resin, heating at a predetermined temperature for a predetermined time (at 180° C. for 10 days), the peel strength of the surface treated copper foil and the resin is favorable.

Abstract: Disclosed is a surface treated copper foil in which the dropping of the roughening particles from the roughening treatment layer provided on the surface of the copper foil is favorably suppressed. Also disclosed is a surface treated copper foil, comprising a copper foil, a roughening treatment layer on one surface, and/or another roughening treatment layer the other surface of the copper foil, wherein a height of roughening particles of the roughening treatment layer is 5 to 1000 nm from the surface, a color difference ?E*ab according to JIS Z 8730 of a surface of a side of the roughening treatment layer is 65 or less, and a glossiness of the TD of the surface of the side of the roughening treatment layer is 70% or less.

Abstract: Provided herein is a printed wiring board that can desirably dissipate the heat of a heat-generating component. The printed wiring board includes one or more wires, and one or more heat-generating components. The one or more wires include a rolled copper foil, either partly or as a whole. The one or more heat-generating components and the one or more wires are directly or indirectly connected to each other.

Abstract: A structure having a metal material for heat radiation that is capable of favorably radiating heat from a heat generating component is provided. A structure having a metal material for heat radiation, containing a heat generating component and a heat radiating member for radiating heat from the heat generating component, wherein the heat radiating member has a layer structure containing a metal material for heat radiation and a graphite sheet.

Abstract: A structure having a metal material for heat radiation that is capable of favorably radiating heat from a heat generating component is provided. A structure having a metal material for heat radiation, comprising a heat generating component, a heat generating component protective member that is provided to cover a part or the entire of the heat generating component and to be spaced from the heat generating component, and a heat radiating member that is provided on a face of the heat generating component protective member on the side of the heat generating component to be spaced from a surface of the heat generating component on the side of the heat generating component protective member, wherein the heat radiating member contains a metal material for heat radiation at least on a surface of the heat radiating member on the side of the heat generating component.

Abstract: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 ?m or more.

Abstract: A surface treated copper foil which is well bonded to a resin and achieves excellent visibility when observed through the resin, and a laminate using the same are provided.

Abstract: A copper heat dissipation material having a satisfactory heat dissipation performance is provided. The copper heat dissipation material has an alloy layer containing at least one metal selected from Cu, Co, Ni, W, P, Zn, Cr, Fe, Sn and Mo on one or both surfaces, in which surface roughness Sz of the one or both surfaces, measured by a laser microscope using laser light of 405 nm in wavelength, is 5 ?m or more.