Abstract: In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, so as to cause a short-circuit. The inner conductor is printed such that the center of each via conductor is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability of a short-circuit is minimized.

Abstract: In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, so as to cause a short-circuit. The inner conductor is printed such that the center of each via conductor is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability of a short-circuit is minimized.

Abstract: In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, and cause a short-circuit. The inner conductor is printed in such a manner that the center of each of the via conductors is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability that the inner conductor contact the via conductor and cause a short-circuit is minimized.

Abstract: A multilayer capacitor includes a laminate of ceramic layers, and a capacitor unit provided in the laminate. In the multilayer capacitor, the relationships P?Ra and P?W are established, wherein P represents the average projection height of first and second via conductors from the upper surface, Ra represents the surface roughness of the upper surface, and W represents an amount of curvature of the laminate. Further, the projecting portions of the first and second via conductors projecting from the upper surface are buried in first and second external electrodes, respectively.

Abstract: In a method for manufacturing a monolithic ceramic electronic component, when an inner conductor is formed by printing an electrically conductive paste, a smear may be generated in an opening of the inner conductor at a side of the opening near to a position from which printing is started in a printing direction. The smear may cause an unwanted contact between the inner conductor and a via conductor, which is a conductor extending through the opening and having a potential different from that of the inner conductor, and cause a short-circuit. The inner conductor is printed in such a manner that the center of each of the via conductors is deviated from the center of the opening in the direction in which the electrically conductive paste is printed. With this structure, even if the smear is generated in the opening, the probability that the inner conductor contact the via conductor and cause a short-circuit is minimized.

Abstract: A monolithic capacitor includes a laminate of ceramic layers, the laminate having first and second surfaces, at least one pair of first and second internal electrodes, first and second external electrodes disposed on the first surface, third and fourth external electrodes disposed on the second surface, a first via conductor that electrically connects the first external electrode to the first internal electrode and to the third external electrode and that contains a metal oxide, and a second via conductor that electrically connects the second external electrode to the second internal electrode and to the fourth external electrode and that contains a metal oxide, wherein, in each of the first and second via conductors, the metal oxide content at an end on the second surface side is higher than the metal oxide content at a center or at an end on the first surface side.

Abstract: A monolithic capacitor includes a laminate of ceramic layers, the laminate having first and second surfaces, at least one pair of first and second internal electrodes, first and second external electrodes disposed on the first surface, third and fourth external electrodes disposed on the second surface, a first via conductor that electrically connects the first external electrode to the first internal electrode and to the third external electrode and that contains a metal oxide, and a second via conductor that electrically connects the second external electrode to the second internal electrode and to the fourth external electrode and that contains a metal oxide, wherein, in each of the first and second via conductors, the metal oxide content at an end on the second surface side is higher than the metal oxide content at a center or at an end on the first surface side.

Abstract: A multilayer capacitor includes a laminate of ceramic layers, and a capacitor unit provided in the laminate. In the multilayer capacitor, the relationships P?Ra and P?W are established, wherein P represents the average projection height of first and second via conductors from the upper surface, Ra represents the surface roughness of the upper surface, and W represents an amount of curvature of the laminate. Further, the projecting portions of the first and second via conductors projecting from the upper surface are buried in first and second external electrodes, respectively.

Abstract: A first laminate block including inner conductors is manufactured, and thin holes are formed in the first laminate block so as to extend between top and bottom surfaces of the first laminate block. The thin holes are filled with conductive paste to form via holes. Then, a ceramic sheet layer is laminated on the bottom surface of the first laminate block, and a second laminate block including inner conductors is laminated on the bottom surface of the ceramic sheet layer to obtain a laminate body. Then, thin holes are formed in the laminate body so as to extend between top and bottom surfaces of the laminate body, and are filled with conductive paste to obtain through via hole.