Patents by Inventor Hidetaka Hashimoto

Hidetaka Hashimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912225
    Abstract: A side airbag device capable of restricting an occupant from moving to the inner side in the vehicle width direction while restraining the head of the occupant is inflatable and deployable in a space beside an occupant seated in a vehicle seat. The side airbag device includes an inflator configured to generate a gas and a bag-shaped airbag inflatable and deployable in response to the gas upon activation of the inflator to protect a lateral portion of the occupant. The airbag includes a torso protection portion, and a head protection portion configured to be provided above the torso protection portion and inflatable and deployable between an upper portion of a shoulder of the occupant and a lateral portion of a head of the occupant. The head protection portion is bendable at an acute angle relative to the torso protection portion in an inflated and deployed state of the airbag.
    Type: Grant
    Filed: June 10, 2020
    Date of Patent: February 27, 2024
    Assignee: ASHIMORI INDUSTRY CO., LTD.
    Inventors: Hidetaka Azuma, Yuta Minami, Yoshitaka Okagami, Kazuya Hashimoto
  • Publication number: 20160183874
    Abstract: An attachment device for attaching an electronic device on a body of a subject includes an attachment member and a battery. The attachment member has a first surface to be in contact with the electronic device and a second surface that is opposite to the first surface and formed of an adhesive material configured to adhere to the body of the subject. The battery has a terminal to be electrically connected with the electronic device to supply power to the electronic device.
    Type: Application
    Filed: April 30, 2015
    Publication date: June 30, 2016
    Inventors: Minoru TAKIZAWA, Yasushi SASAKI, Hidetaka HASHIMOTO
  • Patent number: 5196370
    Abstract: This invention relates to a method of manufacturing an Arsenic-including compound semiconductor device comprising the steps of forming an ion implantation layer in a specified region of an As compound semiconductor wafer, forming an As layer on the surface of the wafer, and annealing the water. In this manner, As evaporation in the ion implantation layer by annealing heat may be prevented. Accordingly, sufficient substitution of the implanted ions and the ions other than As ions composing the As compound may be achieved, thereby preventing lowering of the electrical activation of the As compound semiconductor device. In addition, the electrical activation becomes uniform over the whole area of the water.
    Type: Grant
    Filed: November 8, 1991
    Date of Patent: March 23, 1993
    Assignee: Matsushita Electronics Corporation
    Inventors: Katsushi Tara, Toshiharu Tambo, Kaname Motoyoshi, Hidetaka Hashimoto, Shotaro Umebachi, Susumu Koike