Abstract: An attachment device for attaching an electronic device on a body of a subject includes an attachment member and a battery. The attachment member has a first surface to be in contact with the electronic device and a second surface that is opposite to the first surface and formed of an adhesive material configured to adhere to the body of the subject. The battery has a terminal to be electrically connected with the electronic device to supply power to the electronic device.

Abstract: This invention relates to a method of manufacturing an Arsenic-including compound semiconductor device comprising the steps of forming an ion implantation layer in a specified region of an As compound semiconductor wafer, forming an As layer on the surface of the wafer, and annealing the water. In this manner, As evaporation in the ion implantation layer by annealing heat may be prevented. Accordingly, sufficient substitution of the implanted ions and the ions other than As ions composing the As compound may be achieved, thereby preventing lowering of the electrical activation of the As compound semiconductor device. In addition, the electrical activation becomes uniform over the whole area of the water.