Patents by Inventor Hidetaka Hiagshino

Hidetaka Hiagshino has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7014522
    Abstract: Barrier ribs 18 formed on a back substrate PA2 are brought into contact with a bonding paste layer 40 having an even surface, applying a bonding agent Bd evenly to the tops of the barrier ribs. Furthermore, a gas discharge panel having a structure in which discharge mainly occurs at locations distanced from parts of the panel connected using the bonding agent Bd is realized.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: March 21, 2006
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junichi Hibino, Choujurou Yamamitsu, Hiroyuki Yonehara, Yoshiki Sasaki, Katuyoshi Yamashita, Nobuyuki Kirihara, Kazuo Ootani, Yuusuke Takada, Hideaki Yasui, Ryuichi Murai, Hidetaka Hiagshino, Nobuaki Nagao, Masafumi Ookawa, Hiroyosi Tanaka
  • Patent number: 6860781
    Abstract: Barrier ribs 18 formed on a back substrate PA2 are brought into contact with a bonding paste layer 40 having an even surface, applying a bonding agent Bd evenly to the tops of the barrier ribs. Furthermore, a gas discharge panel having a structure in which discharge mainly occurs at locations distanced from parts of the panel connected using the bonding agent Bd is realized.
    Type: Grant
    Filed: March 1, 2004
    Date of Patent: March 1, 2005
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junichi Hibino, Choujurou Yamamitsu, Hiroyuki Yonehara, Yoshiki Sasaki, Katuyoshi Yamashita, Nobuyuki Kirihara, Kazuo Ootani, Yuusuke Takada, Hideaki Yasui, Ryuichi Murai, Hidetaka Hiagshino, Nobuaki Nagao, Masafumi Ookawa, Hiroyosi Tanaka
  • Patent number: 6800010
    Abstract: Barrier ribs 18 formed on a back substrate PA2 are brought into contact with a bonding paste layer 40 having an even surface, applying a bonding agent Bd evenly to the tops of the barrier ribs. Furthermore, a gas discharge panel having a structure in which discharge mainly occurs at locations distanced from parts of the panel connected using the bonding agent Bd is realized.
    Type: Grant
    Filed: May 14, 2001
    Date of Patent: October 5, 2004
    Assignee: Matsushita Electric Industrial Co., Ltd.
    Inventors: Junichi Hibino, Choujurou Yamamitsu, Hiroyuki Yonehara, Yoshiki Sasaki, Katuyoshi Yamashita, Nobuyuki Kirihara, Kazuo Ootani, Yuusuke Takada, Hideaki Yasui, Ryuichi Murai, Hidetaka Hiagshino, Nobuaki Nagao, Masafumi Ookawa, Hiroyosi Tanaka
  • Publication number: 20040164678
    Abstract: Barrier ribs 18 formed on a back substrate PA2 are brought into contact with a bonding paste layer 40 having an even surface, applying a bonding agent Bd evenly to the tops of the barrier ribs.
    Type: Application
    Filed: March 1, 2004
    Publication date: August 26, 2004
    Inventors: Junichi Hibino, Choujurou Yamamitsu, Hiroyuki Yonehara, Yoshiki Sasaki, Katuyoshi Yamashita, Nobuyuki Kirihara, Kazuo Ootani, Yuusuke Takada, Hideaki Yasui, Ryuichi Murai, Hidetaka Hiagshino, Nobuaki Nagao, Masafumi Ookawa, Hiroyosi Tanaka
  • Publication number: 20040164679
    Abstract: Barrier ribs 18 formed on a back substrate PA2 are brought into contact with a bonding paste layer 40 having an even surface, applying a bonding agent Bd evenly to the tops of the barrier ribs.
    Type: Application
    Filed: March 1, 2004
    Publication date: August 26, 2004
    Inventors: Junichi Hibino, Choujurou Yamamitsu, Hiroyuki Yonehara, Yoshiki Sasaki, Katuyoshi Yamashita, Nobuyuki Kirihara, Kazuo Ootani, Yuusuke Takada, Hideaki Yasui, Ryuichi Murai, Hidetaka Hiagshino, Nobuaki Nagao, Masafumi Ookawa, Hiroyosi Tanaka