Abstract: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.

Abstract: An object of the present invention is to provide a radioactive ray detector for enabling to reduce the parasitic capacity lower than that of the conventional art, which is generated between the semiconductor elements of the radioactive ray detectors neighboring with, and a radioactive ray detecting apparatus applying that therein.

Abstract: A radioactive ray detector card comprises semiconductor elements on a substrate, each having a plurality of first electrodes, provided on one of main surfaces thereof, and a second electrode, provided on other of main surfaces thereof; the substrate having first electrode wirings electrically connected with the plurality of first electrodes, and card edge portions, which transmit signals from the plurality of semiconductor elements to an external electric circuit; the second electrode corresponding to a second electrode identifier, for identifying the semiconductor elements; the first electrodes corresponding to first electrode identifiers, for identifying the plurality of first electrodes, respectively; and the first electrode wirings electrically connect between the first electrodes, corresponding to one of the first electrode identifiers on one semiconductor element of the plurality of semiconductor elements, and the first electrodes, corresponding to one of the same first electrode identifiers on the othe

Abstract: Thermal connection between a plurality of communication modules and a heatsink placed on these communication modules is securely achieved and maintained. In a signal transmission device in which a common heatsink is arranged on a plurality of communication modules equipped on a board, the signal transmission device has a coil spring provided between the board and the communication modules, and the communication modules are biased toward the heatsink by the coil spring so that an upper surface of the communication module is pressed against a bottom surface of the heatsink.

Abstract: A height of a signal transmission device is decreased as low as possible as maintaining or improving a cooling performance for the communication module. Ina signal transmission device provided with a communication module provided on a substrate and a cooling mechanism for cooling the communication module, the cooling mechanism includes: a heat-transfer plate including a first region which overlaps with bottom surfaces of a plurality of the communication modules and is thermally connected to the bottom surfaces and a second region which does not overlap with the bottom surfaces of the communication modules; and a heat-release fin provided in the second region of the heat-transfer plate.

Abstract: An object of the present invention is to provide a radioactive ray detector for enabling to reduce the parasitic capacity lower than that of the conventional art, which is generated between the semiconductor elements of the radioactive ray detectors neighboring with, and a radioactive ray detecting apparatus applying that therein.

Abstract: A radioactive ray detector card comprises semiconductor elements on a substrate, each having a plurality of first electrodes, provided on one of main surfaces thereof, and a second electrode, provided on other of main surfaces thereof; the substrate having first electrode wirings electrically connected with the plurality of first electrodes, and card edge portions, which transmit signals from the plurality of semiconductor elements to an external electric circuit; the second electrode corresponding to a second electrode identifier, for identifying the semiconductor elements; the first electrodes corresponding to first electrode identifiers, for identifying the plurality of first electrodes, respectively; and the first electrode wirings electrically connect between the first electrodes, corresponding to one of the first electrode identifiers on one semiconductor element of the plurality of semiconductor elements, and the first electrodes, corresponding to one of the same first electrode identifiers on the othe

Abstract: A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.

Abstract: A radiation detector includes a semiconductor element capable of detecting a radiation, a substrate on which the semiconductor element is mounted, and a support member disposed adjacent to the semiconductor element for supporting the substrate. The substrate includes a first end portion on which the semiconductor element is mounted, and a second end portion opposite the first end portion for disposing the support member. The support member includes a first support and a second support, and the first support and the second support each includes a protrusion and an engagement hole for engaging with the protrusion. The protrusion of the first support engages with the engagement hole of the second support to fix the first support and the second support such that the substrate is compressed and supported by the first support and the second support.

Abstract: A radiation detector stand has a first support having a plurality of first trenches to which a plurality of radiation detectors for detecting a radiation are inserted, and a second support arranged in parallel to the first support. The first trenches are arranged at a predetermined interval corresponding to an interval of arranging the radiation detectors. The second support has a plurality of second trenches to which the radiation detectors are inserted, and the second trenches are arranged at the predetermined interval.

Abstract: A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.

Abstract: A radiation detector includes a semiconductor element capable of detecting a radiation, a substrate on which the semiconductor element is mounted, and a flexible substrate including a connection pattern connected to an element electrode on an opposite side to the substrate of the semiconductor element. The semiconductor element is disposed on one surface of the substrate, and the flexible substrate is disposed on the opposite side to the substrate of the semiconductor element.

Abstract: A transmission/reception optical module has an optical transmission subassembly 182, an optical reception subassembly 183, and a circuit board 1 wherein the circuit board 1 is formed into one member by a rigid/flexible substrate. Circuit board main bodies 2a, 2b, and an optical reception subassembly fixation region 4 are formed by rigid regions 5A, 5b, and 5P. An area provided between the circuit board main body 2a and the optical reception subassembly 4 is composed of a flexible region 6P. A part of the circuit board main body 2 is composed of a flexible region 6.

Abstract: A radiation detector includes a semiconductor element capable of detecting a radiation, a substrate on which the semiconductor element is mounted, and a flexible substrate including a connection pattern connected to an element electrode on an opposite side to the substrate of the semiconductor element. The semiconductor element is disposed on one surface of the substrate, and the flexible substrate is disposed on the opposite side to the substrate of the semiconductor element.

Abstract: A radiation detector stand has a first support having a plurality of first trenches to which a plurality of radiation detectors for detecting a radiation are inserted, and a second support arranged in parallel to the first support. The first trenches are arranged at a predetermined interval corresponding to an interval of arranging the radiation detectors. The second support has a plurality of second trenches to which the radiation detectors are inserted, and the second trenches are arranged at the predetermined interval.

Abstract: A radiation detector includes a semiconductor element capable of detecting a radiation, a substrate on which the semiconductor element is mounted, and a support member disposed adjacent to the semiconductor element for supporting the substrate. The substrate includes a first end portion on which the semiconductor element is mounted, and a second end portion opposite the first end portion for disposing the support member. The support member includes a first support and a second support, and the first support and the second support each includes a protrusion and an engagement hole for engaging with the protrusion. The protrusion of the first support engages with the engagement hole of the second support to fix the first support and the second support such that the substrate is compressed and supported by the first support and the second support.

Abstract: An optical fiber temperature sensing device has a sensor body; a light source housed in the sensor body; a temperature measuring optical fiber disposed outside the sensor body and extended to a temperature measurement site, wherein, when a light is emitted from the light source into the temperature measuring optical fiber, Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the temperature measuring optical fiber are detected to determine a temperature at the temperature measurement site; a reference temperature optical fiber disposed inside the sensor body; and a controller that is operable to control an output of the light source by monitoring Stokes light intensity and anti-Stokes light intensity of backscattered light generated in the reference temperature optical fiber.

Abstract: An optical fiber temperature sensor has a sensing part composed of an optical fiber arranged at a temperature measurement point; a light source for injecting a light to the sensing part; a wavelength filter module for branching the Raman scattered light from the back scattered light generated at the sensing part; photoelectric detectors for detecting the Raman scattered light and a signal processing circuit for processing the electric signals from the photoelectric detectors, wherein the light source is a semiconductor laser having a wavelength bandwidth of 0.78 ?m; the wavelength filter module has a longer wavelength side band pass filter for transmitting the Stokes light and a shorter wavelength side band pass filter for transmitting the anti-Stokes light; and the longer wavelength side band pass filter and the shorter wavelength side band pass filter do not allow the light having the wavelength band of the semiconductor laser to be transmitted.