Patents by Inventor Hidetaka Kemmotsu

Hidetaka Kemmotsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7277001
    Abstract: A coil-embedded dust core of the present invention is provided with a molded coil component including a coil main body having a structure in which a flat type conductor wire is wound edgewise, one end side terminal portion disposed by being lead in the thickness direction of the coil main body, the other end side terminal portion, one end side leading electrode portion disposed by extending the one end side terminal portion, and the other end side leading electrode portion disposed by extending the other end side terminal portion; and a dust core composed of a soft magnetic alloy powder disposed covering the coil main body, the one end side terminal portion, and the other end side terminal portion of the molded coil component.
    Type: Grant
    Filed: August 16, 2005
    Date of Patent: October 2, 2007
    Assignee: Alps Electric Co., Ltd.
    Inventors: Takao Mizushima, Yutaka Naito, Kazuo Aoki, Hidetaka Kemmotsu, Satoshi Watabe
  • Publication number: 20060038651
    Abstract: A coil-embedded dust core of the present invention is provided with a molded coil component including a coil main body having a structure in which a flat type conductor wire is wound edgewise, one end side terminal portion disposed by being lead in the thickness direction of the coil main body, the other end side terminal portion, one end side leading electrode portion disposed by extending the one end side terminal portion, and the other end side leading electrode portion disposed by extending the other end side terminal portion; and a dust core composed of a soft magnetic alloy powder disposed covering the coil main body, the one end side terminal portion, and the other end side terminal portion of the molded coil component.
    Type: Application
    Filed: August 16, 2005
    Publication date: February 23, 2006
    Inventors: Takao Mizushima, Yutaka Naito, Kazuo Aoki, Hidetaka Kemmotsu, Satoshi Watabe