Patents by Inventor Hidetaka Miyama

Hidetaka Miyama has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5482586
    Abstract: Two aluminum-copper foils, each composed of a layer of copper and a layer of aluminum, are held back to back with the aluminum surfaces against each other, thereby providing an outer layer material (20) for a multilayer printing wiring board. To manufacture a multilayer printed wiring board, an outer layer material (20), a prepreg (2), an inner layer laminate (1), a prepreg (3), and an outer layer material (21) are successively stacked or built up in the order named. The aluminum surface of the outer layer material (20) replaces the mirror finished steel plate and dummy plate which have heretofore been employed. Since the aluminum surfaces can easily be separated from each other, they perform the function of conventional parting films.
    Type: Grant
    Filed: October 29, 1993
    Date of Patent: January 9, 1996
    Assignee: Fanuc Ltd.
    Inventors: Katsuhiko Fujikake, Hidetaka Miyama