Patents by Inventor Hidetaka Nakano

Hidetaka Nakano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5078243
    Abstract: A one-way clutch of the unitary bearing type comprises a bearing portion in which one of an inner race and an outer race is axially extended relative to the other of the inner race and the outer race, and a one-way clutch portion fitted to the extended portion and using the extended portion in common as its own inner race or outer race. The one-way clutch portion includes a plurality of wedge elements and a cage for retaining the wedge elements. A first engagement member protruding from a portion of the cage is engaged with a first receiving portion provided in the inner race or the outer race of the one-way clutch portion, and a second engagement member protruding from the cage is engaged with a second receiving portion provided in the inner race or the outer race of the bearing portion.
    Type: Grant
    Filed: June 26, 1990
    Date of Patent: January 7, 1992
    Assignee: NSK-Warner K.K.
    Inventors: Kenichi Kanai, Hidetaka Nakano
  • Patent number: 4688870
    Abstract: A socket for an electronic device having leads projecting laterally therefrom comprises a socket substrate having grooves formed on one surface thereof for accommodating the leads therein and also having contacts which are plate members punched out of a strap of plate and bent in a substantially L-shape with a fold in the widthwise direction and each composed of a first plate strip and a second plate strip with the fold as a boundary, the first plate strip having one surface laid along and supported on the bottom of the groove to thereby serve as a rigid contact, the second plate strip being implanted from the bottom of the groove in the socket substrate to project downwardly from the lower surface of the socket substrate and serve as a male terminal, and a cover being superposed on and fixed with fastening means to the socket substrate and having resilient pressure strips each resiliently clamping, in cooperation with the other surface of the first plate strip, the lead of the electronic device accommodated
    Type: Grant
    Filed: September 30, 1986
    Date of Patent: August 25, 1987
    Assignee: Yamaichi Electric Mfg. Co., Ltd.
    Inventors: Yoshinori Egawa, Hidetaka Nakano
  • Patent number: 4641904
    Abstract: In a flat cable connecting system comprising pinching a multiple core flat cable between a connector cover and a connector substrate having contacts to cause the contacts to pierce through an insulator of the multiple core flat cable and, in conjunction therewith, to catch hold of and electrically connect conductors within the insulator of the multiple core flat cable, the improvement comprises forming in the insulator perforations for dividing the conductors into conductor segments extending in one direction and conductor segments extending in the other direction, and causing different signal contacts of the connector substrate to catch hold of and electrically connect the respective conductor segments at their terminals on the perforation sides, thereby forming different signal lines with the perforations as boundaries.
    Type: Grant
    Filed: June 12, 1984
    Date of Patent: February 10, 1987
    Assignee: Yamaichi Electric Mfg. Co., Ltd.
    Inventors: Motoki Kosugi, Hidetaka Nakano
  • Patent number: 4515425
    Abstract: An IC socket with IC package pressing means comprises a socket substrate, an IC package pressing plate having one end thereof pivotally link-connected to one end of the socket substrate, and an operative lever having one end thereof pivotally link-connected to the other end of the IC package pressing plate and provided with engaging claw pieces which collide against the other end of the socket substrate, lead the IC package pressing plate and the operative lever to their respective laid-down positions relative to the socket substrate and engage with the aforementioned other end of the socket substrate.
    Type: Grant
    Filed: February 28, 1984
    Date of Patent: May 7, 1985
    Assignee: Yamaichi Electric Mfg. Co., Ltd.
    Inventor: Hidetaka Nakano