Patents by Inventor Hidetaka Ochi

Hidetaka Ochi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9314895
    Abstract: A grinding apparatus for grinding a wafer stored in a cassette composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting waste water generated in grinding the wafer by operating the grinding unit.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: April 19, 2016
    Assignee: Disco Corporation
    Inventors: Takashi Mori, Shinichi Namioka, Masaaki Nagashima, Hidetaka Ochi, Naoto Takata, Masaaki Suzuki, Hirotoshi Hoshikawa, Osamu Miura, Noriko Ito
  • Publication number: 20150158137
    Abstract: A grinding apparatus for grinding a wafer stored in a cassette is composed of a container for storing the wafer and a lid for enclosing the container. The grinding apparatus includes a cassette table for placing the cassette thereon, a lid removing unit for removing the lid from the cassette placed on the cassette table and leaving only the container on the cassette table, a chuck table for holding the wafer under suction, a chuck table moving unit for moving the chuck table to a grinding area, a grinding unit provided in the grinding area, the grinding unit having a grinding wheel for grinding the wafer held on the chuck table, a grinding water supplying unit for supplying a grinding water to abrasive members of the grinding wheel, and a waste water collecting unit for collecting a waste water generated in grinding the wafer by operating the grinding unit.
    Type: Application
    Filed: December 4, 2014
    Publication date: June 11, 2015
    Inventors: Takashi Mori, Shinichi Namioka, Masaaki Nagashima, Hidetaka Ochi, Naoto Takata, Masaaki Suzuki, Hirotoshi Hoshikawa, Osamu Miura, Noriko Ito