Abstract: A photosensitive composition comprising, (A) an oligomer or polymer containing at least one carboxylic acid group in the molecule and having a molecular weight of 200?000 or less; (B) at least one photoinitiator compound of formula I ?wherein R1 is linear or branched C1–C12alkyl; R2 is linear or branched C1–C4alkyl; R3 and R4 independently of one another are linear or branched C1–C8alkyl; and (C) a monomeric, oligomeric or polymeric compound having at least one olefinic double bond, is especially suitable for preparting photoresists, in particular color filters.

Abstract: The invention relates to a process for preparing a dry film resist by forming a photocurable resin composition onto a support film with a thickness of 1 to 50 ?m and optionally laminate a protective film onto the photocurable composition layer to obtain a dry film resist; whereby the photocurable resin is formed from a homogeneous mixture comprising (a) from 20–90 wt % of an alkaline soluble binder oligomer or polymer; (b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a); (c) from 0.01 to 20% by weight of one or more photoinitiators; (d) from 0 to 20% by weight of additives and/or assistants; and (e) from 0.

Abstract: Compounds of the formulae I, II and III wherein R1 is for example hydrogen, C3–C8cycloalkyl, C1–C12alkyl, phenyl unsubstituted or substituted; R2 and R2? for example are hydrogen, C1–C20alkyl, C3–C8cycloalkyl or phenyl, unsubstituted or substituted, or are Ar1 is for example phenyl, optionally substituted by e.g. Ar2 is for example phenylene, optionally substituted e.g. by —(CO)R7, (D), (E) or (F); Ar3 is for example phenyl; M1, M2 and M3 are, for example, C1–C20alkylene; M4 is for example direct bond, —O—, —S—, —Y—(C1–C10alkylene)-Y?—, optionally substituted; Y and Y? are for example a direct bond or —O—; R7 is for example hydrogen, C1–C20alkyl or phenyl, optionally substituted; R8, R9, R8? and R9? are for example hydrogen or C1–C12alkyl, exhibit an unexpectedly good performance in photopolymerization reactions.

Abstract: Compounds of the formulae (I), (II), (III) and (IV), wherein Ch1 is e.g. the formula (V) or (VI); Ch2 is the formula (VII) or (VIII); Het1 is for example furyl, thienyl, pyrrolyl, pyridyl, benzothienyl, quinolyl or bithienyl; each of which is optionally substituted; Het2 and Het2? e.g. are furylene, thienylene, pyrrolylene, benzothienylene, quinolylene, furylenecarbonyl, thienylenecarbonyl, benzothienylenecarbonyl or bithienylenecarbonyl; each of which is optionally substituted; A1, and Ar1? i.a. are phenyl, naphthyl, benzoyl or naphthoyl, each of which is optionally substituted; Ar2 is for example phenylene, optionally substituted; M i.a. is C1-C20alkylene; R1 is for example C1-C12alkyl or phenyl; R2 and R2? for example are hydrogen or C1-C20 alkyl; exhibit an unexpectedly good performance in photopolymerization reactions.

Abstract: The present invention relates to a photosensitive resin composition comprising a) as a component (A) a green colorant of the formula (I) in which the rings A, B, C and D are substituted by hydroxy or by moiety wherein R, is hydrogen or C1-C4.-Alkyl, R2 is hydrogen or C1-C4-Alkyl, n is 0, 1, 2 or 3 and the ring E is unsubstituted or substituted by C1-C6alkyl, C1-C6alkoxy, hydroxy, NHCOR3, NHSO2, R4 or SO2NHR5, wherein R3, is C1-C4,-Alkyl or phenyl, R4, is C1-C4-Alkyl or phenyl and R5 is C1-C4-Alkyl or phenyl, b) as a component (B) an alkali soluble oligomer or polymer (reactive or unreactive), c) as a component (C) a polymerizable monomer, d) as a component (D) a photoinitiator, e) as a component (E) an epoxy compound, and also, if desired, f) as a component (F) further additives, used as solder resist, etching resist or plating resist in the manufacture of printed circuit boards.

Abstract: The invention relates to a process for preparing a dry film resist by forming a photocurable resin composition onto a support film with a thickness of 1 to 50 ?m and optionally laminate a protective film onto the photocursable composition layer to obtain a dry film resist; whereby the photocurable resin is formed from a homogeneous mixture comprising (a) from 20-90 wt % of an alkaline soluble binder oligomer or polymer; (b) from 5 to 60 wt % of one or more photopolymerizable monomers which are compatible with the oligomers and polymers of component (a); (c) from 0.01 to 20% by weight of one or more photoinitiators; (d) from 0 to 20% by weight of additives and/or assistants; and (e) from 0.

Abstract: Compounds of the formulae I, II, III, IV and V wherein R1 i.a. is C4-C9cycloalkanoyl, C1-C12alkanoyl, C4-C6alkenoyl, or benzoyl; R2 is for example phenyl, C1-C20alkyl, C3-C8cycloalkyl, C2-C20alkanoyl, or benzoyl; Ar1 is R4S-phenyl or NR5R6-phenyl, each of which optionally is substituted; or Ar1 i.a. is optionally substituted; or Ar1 is naphthyl or anthracyl each of which is unsubstituted or substituted; or Ar1 is benzoyl, naphthalenecarbonyl, phenanthrenecarbonyl, anthracenecarbonyl or pyrenecarbonyl, each of which is unsubstituted or substituted, or Ar1 is 3,4,5-trimethoxyphenyl, phenoxyphenyl or biphenyl; Ar2 i.a.

Abstract: Compounds of the formulae I, II, III, IV and V wherein R1 i.a. is C4-C9cycloalkanoyl, C1-C12alkanoyl, C4-C6alkenoyl, or benzoyl; R2 is for example phenyl, C1-C20alkyl, C3-C8cycloalkyl, C2-C20alkanoyl, or benzoyl; Ar1 is R4S-phenyl or NR5R6-phenyl, each of which optionally is substituted; or Ar1 i.a. is optionally substituted; or Ar1 is naphthyl or anthracyl each of which is unsubstituted or substituted; or Ar1 is benzoyl, naphthalenecarbonyl, phenanthrenecarbonyl, anthracenecarbonyl or pyrenecarbonyl, each of which is unsubstituted or substituted, or Ar1 is 3,4,5-trimethoxyphenyl, phenoxyphenyl or biphenyl; Ar2 i.a.

Abstract: A photosensitive composition comprising, (A) an oligomer or polymer containing at least one carboxylic acid group in the molecule and having a molecular weight of 200′ooo or less; (B) at least one photoinitiator compound of formula I, R1, is lenear or banched C1-C12alkyl; R2 is linear or branched C1-C4alkyl; R3 and R4 independently of one another are linear or branched C1-C8alkyl; and (C) a monomeric, oligoneric or polymeric compound having at least one olefinic double bond, is especially suitable for preparting photoresists, in particular color filters.

Abstract: Compounds of the formulae I, II and III 1

Abstract: Oximeester compounds of the formulae I, II, III and IV wherein R1 is phenyl, C1-C20alkyl or C2-C20alkyl optionally interrupted by —O—, C2-C20alkanoyl or benzoyl, or R1 is C2-C12alkoxycarbonyl or phenoxycarbonyl; R1′ is C2-C12alkoxycarbonyl, or R1′ is phenoxycarbonyl, or R1′ is —CONR10R11 or CN; R2 is C2-C12alkanoyl, C4-C6alkenoyl, benzoyl, C2-C6alkoxycarbonyl or phenoxycarbonyl; R3, R4, R5, R6 and R7 are hydrogen, halogen, C1-C12alkyl, cyclopentyl, cyclohexyl, phenyl, benzyl, benzoyl, C2-C12alkanoyl, C2-C12alkoxycarbonyl, phenoxycarbonyl or a group OR8, SR9, SOR9, SO2R9 or NR10R11; R4′, R5′ and R6′ are hydrogen, halogen, C1-C12alkyl, cyclopentyl, cyclohexyl, phenyl, benzyl, benzoyl, C2-C12-alkanoyl, C2-C12alkoxycarbonyl, phenoxycarbonyl, or are a group OR8, SR9, SOR9, SO2R9, NR10R11; provided that at least one of R3, R4, R5, R6, R7, R′4, R′5 and R′6 is OR8, SR9 or NR10R11; R8, R9, R10 and R11 are for example hydrogen, C

Abstract: Compositions comprising (A) an oligomer or polymer containing at least one carboxylic acid group in the molecule; (B) at least one compound of formulas (I, II, III, IV, V or VI), wherein R1 inter alia is phenyl or alkyl; R2 is for example C2-C12alkonoyl which is unsubstituted or substituted or is benzoyl; R3, R4, R5, R6 and R7 independently of one another are for instance hydrogen, C1-C12alkyl, cyclohexyl or phenyl which is unsubstituted or substituted, or are benzyl, benzoyl, C2-C12alkanoyl or phenoxycarbonyl; R8 is for example hydrogen or C1-C12alkyl or a group (B); M is for example C1-C12alkylene, cyclohexylene or phenylene; M1 inter alia is a direct bond or C1-C12alkylenoxy; and Ar is a 5- or 6-membered aromatic heterocyclic ring; (C) a photopolymerizable reactive or unreactive diluent; and (D) as a thermosetting component an epoxy compound containing at least two epoxy groups in one molecule; are highly suitable as resists which are alkaline developable.

Abstract: Photosensitive compositions comprising

Abstract: Compounds of the formulae I, II, III, IV and V 1

Abstract: Compounds of formula I, II or III ##STR1## X is a divalent radical; Y is C.sub.1 -C.sub.6 aklylene, cyclohexylene or a direct bond;Ar.sub.1 is an aromatic radical as defined in claim 1,R.sub.1 and R.sub.2 are each independently the other, inter alia, a radical of formula ##STR2## in which p is zero or 1, or a radical of formula ##STR3## R.sub.3 is, inter alia, hydrogen, C.sub.1 -C.sub.12 alkyl, C.sub.5 -C.sub.12 cycloalkyl or phenyl-C.sub.1 -C.sub.3 alkyl;R.sub.4 is, inter alia, C.sub.1 -C.sub.12 cycloalkyl, phenyl-C.sub.1 -C.sub.3 alkyl or phenyl;or an acid addition salt of a compound of formula I, II or III;are useful as photosensitive base catalysts in base crosslinking compositions.

Abstract: Compounds of the formulae I, II, III and IV ##STR1## wherein Ar for example is a phenyl, biphenyl or benzoylphenyl group, which is unsubstituted or substituted; Ar.sub.1, for example, has the same meanings as Ar; Ar.sub.2 is inter alia phenyl; X may be a direct bond; Y hydrogen, etc.; R.sub.1 and R.sub.2 for example C.sub.1 -C.sub.8 alkyl; R.sub.3 inter alia hydrogen or C.sub.1 -C.sub.12 alkyl; R.sub.4 is inter alia C.sub.1 -C.sub.12 alkyl; or R.sub.3 and R.sub.4 together are C.sub.3 -C.sub.7 alkylene; R.sub.5 is for example C.sub.1 -C.sub.6 alkylene; and Z is a divalent radical; provided that at least one of the radicals Ar, Ar.sub.1, Ar.sub.2, Ar.sub.3, R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5 or Y is substituted by 1 to 5 SH groups, or provided that Y contains at least one --SS-- group, are photoinitiators for the polymerization of ethylenically unsaturated compounds.