Patents by Inventor Hidetaka Ootsuka

Hidetaka Ootsuka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Substrate device with a transmission line connected to a connector pad and method of manufacture
    Patent number: 8258888
    Abstract: A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: September 4, 2012
    Assignee: NEC Corporation
    Inventor: Hidetaka Ootsuka
  • CAPACITOR MOUNTING METHOD AND PRINTED CIRCUIT BOARD
    Publication number: 20110024174
    Abstract: Provided is a capacitor mounting method for mounting a capacitor in close proximity to an LSI, which includes mounting the capacitor on top of the LSI with solder balls (bumps) placed therebetween, the LSI mounted on top of a printed circuit board with solder balls (bumps) placed therebetween, in a stacked fashion.
    Type: Application
    Filed: June 16, 2010
    Publication date: February 3, 2011
    Inventor: Hidetaka Ootsuka
  • Substrate device and its manufacturing method
    Publication number: 20100103636
    Abstract: A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other.
    Type: Application
    Filed: October 26, 2009
    Publication date: April 29, 2010
    Applicant: NEC CORPORATION
    Inventor: Hidetaka Ootsuka