Patents by Inventor Hidetaka Ozaki

Hidetaka Ozaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4971726
    Abstract: An electroconductive resin composition comprising (i) 100 parts by weight of thermoplastic resins and/or thermosetting resins and (ii) 15 to 150 parts by weight of (a) carbon black having a DPB oil absorption amount of 400 ml/100 g or more and (b) expanded graphite having an average particle size of 40 .mu.m or more, wherein the expanded graphite content is 40 to 90% by weight of the total amount of the carbon black and the expanded graphite.
    Type: Grant
    Filed: June 29, 1988
    Date of Patent: November 20, 1990
    Assignee: Lion Corporation
    Inventors: Seiji Maeno, Hidetaka Ozaki, Yasuo Takamizu
  • Patent number: 4830779
    Abstract: An electrically conductive resin composition comprising:(i) a resin;(ii) a metallic powder;(iii) a diphosphonic acid derivative; and(iv) a hydroxyl-containing compound; wherein the weight ratio of the compound (i)/the component (ii) is 30/70 to 85/15 and the amounts of the components (iii) and (iv) are 0.5 parts by weight or more and 0.08 parts by weight, respectively, based on 100 parts by weight of the components (i) and (ii).
    Type: Grant
    Filed: December 17, 1987
    Date of Patent: May 16, 1989
    Assignee: Lion Corporation
    Inventors: Seiji Maeno, Hidetaka Ozaki, Hisashi Yamada
  • Patent number: 4747966
    Abstract: An electrically conductive thermoplastic resin and coating composition comprising a diphosphonic acid derivative having the formula: ##STR1## wherein R represents an alkyl or aryl group and M.sup.1 to M.sup.4 independently represent hydrogen or a cation.The electrically conductive thermoplastic resin composition has excellent electrical conductivity and retains the electrical conductivity for extended periods without using expensive noble metals. Furthermore, the electrically conductive coating composition provides an excellent electrical conductivity and shielding property retention without using expensive noble metals.
    Type: Grant
    Filed: September 30, 1986
    Date of Patent: May 31, 1988
    Assignee: Lion Corporation
    Inventors: Seiji Maeno, Hidetaka Ozaki, Hisashi Yamada, Osamu Ito