Patents by Inventor Hidetaka Satou

Hidetaka Satou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 5811218
    Abstract: An N-aryl-.alpha.-amino acid (I), which is a novel compound, is effective as a photoinitiator. The photoinitiator composition including this photoinitiator is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation. Further, a photoinitiator composition (A) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and/or an azabenzalcyclohexanone (III), or a photoinitiator composition (B) comprising an N-aryl-.alpha.-amino acid (I) or (I'), a 3-substituted coumarin (II) and a titanocene (IV), or a photoinitiator composition (C) comprising a 3-substituted coumarin (II), a titanocene (IV) and an oxime ester (V), is effective for improving photosensitive properties of photosensitive materials containing poly(amic acid) and an addition polymerizable compound used for pattern formation.
    Type: Grant
    Filed: July 17, 1995
    Date of Patent: September 22, 1998
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Makoto Kaji, Yasunori Kojima, Shigeki Katogi, Masataka Nunomura, Hideo Hagiwara, Dai Kawasaki, Mitsumasa Kojima, Hiroshi Suzuki, Hidetaka Satou
  • Patent number: 5350811
    Abstract: An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.
    Type: Grant
    Filed: June 17, 1993
    Date of Patent: September 27, 1994
    Assignee: Hitachi Chemical Co. Ltd.
    Inventors: Nobuo Ichimura, Mitsuo Yamazaki, Kohei Fujita, Hidetaka Satou, Yasuo Miyamoto, Masao Kawasumi, Tohru Kikuchi
  • Patent number: 5272247
    Abstract: The present invention provides a polyimide having all of small dielectric constant, small thermal expansion coefficient, high heat resistance, high glass transition temperature and high mechanical properties, a precursor of the polyimide, and processes for producing them. A polyimide precursor whose molecular chain comprises repeating units represented by the following general formula (1) and repeating units represented by the following general formula (2): ##STR1## wherein R.sup.1 is at least one kind of tetravalent organic group selected from the group consisting of ##STR2## R.sup.2 is at least one kind of divalent organic group having a linear structure which is selected from the group consisting of ##STR3## m is an integer of 1 to 4, and R.sup.3 is a divalent organic group having a non-linear structure which contains at least two aromatic rings.
    Type: Grant
    Filed: October 21, 1991
    Date of Patent: December 21, 1993
    Assignee: Hitachi, Ltd.
    Inventors: Hideo Sotokawa, Fusaji Shoji, Fumio Kataoka, Hidetaka Satou
  • Patent number: 5258139
    Abstract: An adhesive composition comprising (a) an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubustituted disiloxane dianhydride with an alcohol or alcohol derivative, followed by reaction with an epoxy compound having two or more epoxy groups, or an epoxy resin obtained by reacting a 1,3-bis(dicarboxyphenyl)-1,1,3,3-tetrasubstituted disiloxane with an epoxy compound having two or more epoxy groups and (b) a curing agent is suitable for bonding semiconductor chips to a copper frame with a small warpage of the chips.
    Type: Grant
    Filed: April 19, 1991
    Date of Patent: November 2, 1993
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Nobuo Ichimura, Mitsuo Yamazaki, Kohei Fujita, Hidetaka Satou, Yasuo Miyamoto, Masao Kawasumi, Tohru Kikuchi
  • Patent number: 5115089
    Abstract: Disclosed herein are processes for the preparation of polyimide-isoindroquinazolinediones and precursor thereof. These polymers are useful as heat-resistant electric insulation materials, surface coating films for electronic instrument parts and especially suitable for manufacturing a photoresist. The above precursor is produced by reacting a an alkylenebistrimellitate dianhydride, a diaminoamide compound and the other amine. The precursor is readily dehydrated and ring-closed to produce polyimide-isoindroquinazolinedione, which is often conveniently conducted by producing a varnish of the precursor, applying it onto adequate substrates such as silicon wafers, glass plates, metal plates, etc. and then subjecting the coated film to dehydration. The resulting films have excellent physical properties such as good adherence, high tensile strength, low elasticity, etc.
    Type: Grant
    Filed: September 16, 1988
    Date of Patent: May 19, 1992
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Masatoshi Yoshida, Katsuji Shibata, Mitsumasa Kojima, Hidetaka Satou, Toshihiko Kato, Yasuo Miyadera, Masami Yusa
  • Patent number: 4847358
    Abstract: There are disclosed a process for producing a polyamide acid having at least one siloxane bond, which comprises carrying out the reaction of:(a) a tetracarboxylic dianhydride having at least one siloxane bond of the formula: ##STR1## wherein R represents a monovalent hydrocarbon group and m is an integer of 1 or more;(b) a diamine; and(c) a diaminoamide compound of the formula (II): ##STR2## wherein Ar represents an aromatic residue, Y represents SO.sub.2 or CO, and one amino group and Y--YNH.sub.
    Type: Grant
    Filed: August 18, 1987
    Date of Patent: July 11, 1989
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Mitsumasa Kojima, Takayuki Saito, Toul Kikuchi, Shun-ichiro Uchimura, Hidetaka Satou, Daisuke Makino
  • Patent number: 4735492
    Abstract: A liquid crystal display device containing a liquid crystal orientation controlling film made from a fluorine-containing polyimide-isoindoloquinazolinedione is high in a tilt angle and excellent in viewing properties.
    Type: Grant
    Filed: October 14, 1986
    Date of Patent: April 5, 1988
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Hiroyoshi Sekine, Hidetaka Satou, Daisuke Makino