Abstract: A radio-frequency module includes a mounting substrate and first and second power amplifiers. The first and second power amplifiers are each mounted on one main surface of the mounting substrate. The first power amplifier includes a first input terminal and a first outer periphery. The first outer periphery includes a first edge section. The second power amplifier includes a second input terminal and a second outer periphery. The second outer periphery includes a second edge section. The second edge section opposes the first edge section in a first direction. The first input terminal is disposed in the first edge section of the first power amplifier. The second input terminal is disposed in the second edge section of the second power amplifier. The first and second input terminals do not overlap each other in the first direction.

Abstract: Deterioration of characteristics is reduced. A radio-frequency module includes a first power amplifier circuit, a second power amplifier circuit, and a substrate. The first power amplifier circuit includes a first amplifier component and a first transformer. The second power amplifier circuit includes a second amplifier component and a second transformer. The radio-frequency module further includes a long bump disposed on one main surface of the substrate. The first amplifier component is disposed on the one main surface of the substrate with the long bump interposed between the first amplifier component and the one main surface of the substrate. The long bump is located between the first transformer and the second transformer when viewed in plan in a thickness direction of the substrate.

Abstract: A radio-frequency module includes a mounting substrate, a power amplifier, a low-noise amplifier, at least one first transmission filter, and at least one first reception filter. The mounting substrate has a first main surface and a second main surface. The power amplifier is disposed on a side where the first main surface of the mounting substrate is located. The low-noise amplifier is disposed on a side where the second main surface of the mounting substrate is located. The first transmission filter allows a TDD transmission signal to pass therethrough. The first reception filter allows a TDD reception signal to pass therethrough. The first transmission filter is disposed on the side where the first main surface of the mounting substrate is located. The first reception filter is disposed on the side where the second main surface of the mounting substrate is located.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying element; a second amplifying element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying element, another end of the primary coil is connected to an output terminal of the second amplifying element, an end of the secondary coil is connected to an output terminal of the power amplifier, the first amplifying element and the second amplifying element are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.

Abstract: A radio-frequency module includes a mounting substrate, a power amplifier, a low-noise amplifier, at least one first transmission filter, and at least one first reception filter. The mounting substrate has a first main surface and a second main surface. The power amplifier is disposed on a side where the first main surface of the mounting substrate is located. The low-noise amplifier is disposed on a side where the second main surface of the mounting substrate is located. The first transmission filter allows a TDD transmission signal to pass therethrough. The first reception filter allows a TDD reception signal to pass therethrough. The first transmission filter is disposed on the side where the first main surface of the mounting substrate is located. The first reception filter is disposed on the side where the second main surface of the mounting substrate is located.

Abstract: A radio frequency module includes: a duplexer for a first communication band; a first power amplifier and a first low-noise amplifier connected to the duplexer; a second power amplifier and a second low-noise amplifier for a second communication band; and a switch that switches a connection of an antenna connection terminal between the second power amplifier and the second low-noise amplifier, wherein the first power amplifier and the second power amplifier are disposed on a first principal surface of a module substrate, the first low-noise amplifier and the second low-noise amplifier are incorporated in a semiconductor IC disposed on a second principal surface of the module substrate, and in a plan view of the module substrate, the distance between the first power amplifier and the semiconductor IC is greater than the distance between the second power amplifier and the semiconductor IC.

Abstract: A radio-frequency module includes a mounting substrate and first and second power amplifiers. The first and second power amplifiers are each mounted on one main surface of the mounting substrate. The first power amplifier includes a first input terminal and a first outer periphery. The first outer periphery includes a first edge section. The second power amplifier includes a second input terminal and a second outer periphery. The second outer periphery includes a second edge section. The second edge section opposes the first edge section in a first direction. The first input terminal is disposed in the first edge section of the first power amplifier. The second input terminal is disposed in the second edge section of the second power amplifier. The first and second input terminals do not overlap each other in the first direction.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; a first circuit component; and a power amplifier (PA) control circuit configured to control the power amplifier. The power amplifier includes: an input terminal; an output terminal; first and second amplifying elements disposed parallel to the input terminal; and an output transformer connected between the output terminal and output terminals of the first and second amplifying elements. The PA control circuit is disposed on the second principal surface, and the first and second amplifying elements are both disposed on the first principal surface.

Abstract: A radio frequency module includes: a module board that includes a first principal surface and a second principal surface on opposite sides of the module board; a power amplifier; and a first circuit component. The power amplifier includes: a first amplifying element; a second amplifying element; and an output transformer that includes a primary coil and a secondary coil. An end of the primary coil is connected to an output terminal of the first amplifying element, another end of the primary coil is connected to an output terminal of the second amplifying element, an end of the secondary coil is connected to an output terminal of the power amplifier, the first amplifying element and the second amplifying element are disposed on the first principal surface, and the first circuit component is disposed on the second principal surface.

Abstract: A radio frequency module includes: a duplexer for a first communication band; a first power amplifier and a first low-noise amplifier connected to the duplexer; a second power amplifier and a second low-noise amplifier for a second communication band; and a switch that switches a connection of an antenna connection terminal between the second power amplifier and the second low-noise amplifier, wherein the first power amplifier and the second power amplifier are disposed on a first principal surface of a module substrate, the first low-noise amplifier and the second low-noise amplifier are incorporated in a semiconductor IC disposed on a second principal surface of the module substrate, and in a plan view of the module substrate, the distance between the first power amplifier and the semiconductor IC is greater than the distance between the second power amplifier and the semiconductor IC.

Abstract: A transmit-and-receive module includes a power amplifier, a low-noise amplifier, first and second phase shifter circuits, and a correction circuit. The power amplifier amplifies power of first and second transmit signals. The low-noise amplifier amplifies first and second received signals without increasing noise. The first and second phase shifter circuits adjust impedance for the first received signal and that for the second received signal. The correction circuit supplies a canceling signal to an output node of the second phase shifter circuit. The canceling signal is used for canceling the first transmit signal passing through a receive filter.

Abstract: A transmit-and-receive module includes a power amplifier, a low-noise amplifier, first and second phase shifter circuits, and a correction circuit. The power amplifier amplifies power of first and second transmit signals. The low-noise amplifier amplifies first and second received signals without increasing noise. The first and second phase shifter circuits adjust impedance for the first received signal and that for the second received signal. The correction circuit supplies a canceling signal to an output node of the second phase shifter circuit. The canceling signal is used for canceling the first transmit signal passing through a receive filter.

Abstract: A transmit-and-receive module includes a power amplifier, a low-noise amplifier, first and second phase shifter circuits, and a correction circuit. The power amplifier amplifies power of first and second transmit signals. The low-noise amplifier amplifies first and second received signals without increasing noise. The first and second phase shifter circuits adjust impedance for the first received signal and that for the second received signal. The correction circuit supplies a canceling signal to an output node of the second phase shifter circuit. The canceling signal is used for canceling the first transmit signal passing through a receive filter.

Abstract: A transmit-and-receive module includes a power amplifier, a low-noise amplifier, first and second phase shifter circuits, and a correction circuit. The power amplifier amplifies power of first and second transmit signals. The low-noise amplifier amplifies first and second received signals without increasing noise. The first and second phase shifter circuits adjust impedance for the first received signal and that for the second received signal. The correction circuit supplies a canceling signal to an output node of the second phase shifter circuit. The canceling signal is used for canceling the first transmit signal passing through a receive filter.

Abstract: A method for the surface treatment of rubber, a process for production of a rubber article, and a rubber composition wherein a structure derived from a fluorine compound containing a fluoroalkyl at both ends of its molecule are joined to a polymer main chain of crosslinked rubber in the vicinity of the surface of a rubber base (molding). The method involves causing the fluorine compound and a silane coupling agent to exist in the vicinity of the surface of a rubber base, and heat-treating the rubber base. The production process comprises compounding and mixing raw rubber and a silane coupling agent to obtaining a molding of crosslinked rubber and heating the molding. The rubber composition contains raw rubber, a crosslinking agent, the fluorine compound and a silane coupling agent.

Abstract: Disclosed herein are a method for surface treatment of rubber and a process for production of a rubber article, by which a structure derived from a fluorine compound having groups containing a fluoroalkyl group at both ends of its molecule can be surely and efficiently joined to a polymer main chain of crosslinked rubber in the vicinity of the surface of a rubber base (molding). A novel rubber composition containing a specific rubber compound is also disclosed.

Abstract: A computer reads a voice speech recognition program from a first recording medium, and reads voice data from a second recording medium, and causes a CPU in the computer to recognize speech represented by the read voice data according to the speech recognition program, convert the result of speech recognition into text data, and display the converted text data on a display unit. A check mark button used by a speaker designates a portion of voice data, which is input through a microphone, corresponding to an unnecessary word or the like. The portion of the voice data in which a check mark is inscribed is not regarded as an object of speech recognition. Only the other portion of voice data in which the check mark is not inscribed is regarded as an object of speech recognition, and speech recognition is thus carried out. Furthermore, the sound level of a voice portion of voice data is rated. The gain of the voice data is adjusted according to the rated level.

Abstract: The present invention relates to what causes a computer to read a voice recognition program from a first recording medium, and read voice data from a second recording medium, and causes a CPU in the computer to recognize voice represented by the read voice data according to the voice recognition program, convert the result of voice recognition into text data, and display the converted text data on a display unit.

Abstract: A voice signal coding apparatus includes: a voice status detector detecting whether an input signal divided at predetermined frame intervals is a voice or a non-voice signal; a linear predictive analyzer outputting a linear predictive parameter associated with the input signal; a voice sound source predicting circuit; a non-voice sound source predicting circuit including a random signal generator; and a switch controller selecting either the voice or non-voice sound source predicting circuit from the detection result of the voice status detector, wherein the random signal gain is set in accordance with a value obtained by suppressing by a predetermined factor the gain obtained when a non-voice input signal is coded by the voice sound predicting circuit.