Patents by Inventor Hideto Aoki

Hideto Aoki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250056765
    Abstract: A cooling device includes a container, a heat receiver to receive heat from a cooling target and evaporate a refrigerant inside the container, a condenser disposed away from the heat receiver, and to condense the gas-phase refrigerant, a liquid transporter to couple the condenser and the heat receiver, and transport the liquid-phase refrigerant to the heat receiver from the condenser, a first transporter to couple the heat receiver and the condenser, and include a first transport-space inside the first transporter, in which the gas-phase refrigerant is transported to the condenser from the heat receiver, and a second transporter provided in pairs over two sides in a direction orthogonal to a moving-direction of the refrigerant in the first transporter, and to couple the heat receiver and the condenser, and include a second transport-space inside the second transporter, in which the gas-phase refrigerant is transported to the condenser from the heat receiver.
    Type: Application
    Filed: July 24, 2024
    Publication date: February 13, 2025
    Applicant: Fujitsu Limited
    Inventors: Hideo Kubo, Toru Kobayashi, Nobumitsu Aoki, Kenji Sasabe, Keita Hirai, Hiromasa Miyata, Hideto Fukushima, Masahide Kodama, Atsushi Endo, Takashi Urai
  • Patent number: 6835344
    Abstract: A recess of a thermoplastic resin container is formed by urging a part of a thermoplastic resin sheet into a cavity of a mold after heating the part of the thermoplastic resin sheet, so that a bottom portion and side walls of the recess are formed, wherein a bottom of the cavity has a convex shape area protruding in a depth direction away from the base portion formed on another part of the thermoplastic resin on the mold.
    Type: Grant
    Filed: December 5, 2001
    Date of Patent: December 28, 2004
    Assignees: Sumitomo Bakelite, Co., Ltd., Sumicarrier Singapore Pte., Ltd.
    Inventors: Tung Teck Hong, Hideto Aoki
  • Patent number: 6729474
    Abstract: There is disclosed an electronic parts carrier tape in which a nesting phenomenon, in which superposed embossed portions are fitted together after winding the carrier tape on a reel, is less liable to occur. The electronic parts carrier tape includes a flexible, tape-like member having electronic part-storing embossed portions arranged at predetermined intervals in a longitudinal direction of the tape-like member. At least one rib is formed on and projects outwardly from an outer surface of a peripheral wall of each of the embossed portions. An outer dimension (X) of a bottom of the embossed portion, as seen in a cross-section of the embossed portion through the rib, is larger than a dimension (Y) of an opening in a top of the embossed portion.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: May 4, 2004
    Assignees: Sumitomo Bakelite Co., Ltd., Sumicarrier Singapore Pte., Ltd.
    Inventors: Tung Teck Hong, Hideto Aoki
  • Patent number: 6688472
    Abstract: A container for receiving an electric device in a recess. The container includes a pair of projections for restraining a movement of the electric device in a first direction perpendicular to a second direction and directed from a top opening area of the recess toward a bottom area of the recess. The pair of projections have respective support surfaces facing to each other in the first direction. A distance between the support surfaces of the pair in the first direction decreases in the second direction in such a manner that each of the support surfaces contacts simultaneously the electric device to prevent the electric device from moving in the first direction.
    Type: Grant
    Filed: January 3, 2002
    Date of Patent: February 10, 2004
    Assignees: Sumitomo Bakelite Company Limited, Sumicarrier Singapore Pte. Ltd.
    Inventors: Tung Teck Hong, Hideto Aoki
  • Publication number: 20020092794
    Abstract: A container for receiving an electric device in a recess thereof has a pair of projections for restraining a movement of the electric device in a first direction perpendicular to a second direction directed from a top opening area of a recess toward a bottom area of the recess,
    Type: Application
    Filed: January 3, 2002
    Publication date: July 18, 2002
    Inventors: Tung Teck Hong, Hideto Aoki
  • Publication number: 20020074695
    Abstract: A recess of a thermoplastic resin container is formed by urging a part of a thermoplastic resin sheet into a cavity of a mold after heating the part of the thermoplastic resin sheet, so that a bottom portion and side walls of the recess are formed, wherein a bottom of the cavity has a convex shape area protruding in a depth direction away from the base portion formed on another part of the thermoplastic resin on the mold.
    Type: Application
    Filed: December 5, 2001
    Publication date: June 20, 2002
    Inventors: Tung Teck Hong, Hideto Aoki
  • Publication number: 20020017478
    Abstract: There is disclosed an electronic parts carrier tape in which a nesting phenomenon, in which superposed embossed portions are fitted together after winding the carrier tape on a reel, is less liable to occur. The electronic parts carrier tape includes a flexible, tape-like member having electronic part-storing embossed portions arranged at predetermined intervals in a longitudinal direction of the tape-like member. At least one rib is formed on and projects outwardly from an outer surface of a peripheral wall of each of the embossed portions. An outer dimension (X) of a bottom of the embossed portion, as seen in a cross-section of the embossed portion through the rib, is larger than a dimension (Y) of an opening in a top of the embossed portion.
    Type: Application
    Filed: June 18, 2001
    Publication date: February 14, 2002
    Inventors: Tung Teck Hong, Hideto Aoki
  • Patent number: 4403155
    Abstract: An improved wiring system is provided in which a connector box having a plurality of terminals, electrical circuitry, and bus bars is incorporated. Since each bus bar provides forked conductive paths between the circuitry and the terminals, the terminals of the connector box and outside connectors can be connected by way of wires in a one-to-one correspondence. This simplified wiring mode greatly reduces manual labor in the manufacture of wire harnesses. Moreover, if a plurality of connector boxes of such structure as above are provided, they can be arranged in the vicinity of any of the electrical equipment of the vehicle due to their compact structure, thus minimizing the arrangement of power line wires in the car body.
    Type: Grant
    Filed: January 25, 1982
    Date of Patent: September 6, 1983
    Assignee: Yazaki Corporation
    Inventors: Hideto Aoki, Tomoyuki Hirano, Mitsugu Watanabe, Toshiyuki Kamano, Mitsunori Tsunoda, Toshikazu Akiyama, Mitsuyasu Kanehiro, Mitsuji Kubota, Masayuki Sato