Patents by Inventor Hideto ITOH
Hideto ITOH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11967493Abstract: It is difficult for a Cr—Si-based sintered body composed of chromium silicide (CrSi2) and silicon (Si) to have high strength. Provided is a Cr—Si-based sintered body including Cr (chromium) and silicon (Si), in which the crystal structure attributed by X-ray diffraction is composed of chromium silicide (CrSi2) and silicon (Si), a CrSi2 phase is present at 60 wt % or more in a bulk, a density of the sintered body is 95% or more, and an average grain size of the CrSi2 phase is 60 ?m or less.Type: GrantFiled: November 18, 2019Date of Patent: April 23, 2024Assignee: TOSOH CORPORATIONInventors: Hiroyuki Hara, Hideto Kuramochi, Kenichi Itoh
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Patent number: 9406420Abstract: A coil component 1 is provided with coil conductors 10a and 10b and a magnetic metal powder containing resin 22 (22a and 22b) covering the coil conductors 10a and 10b. The magnetic metal powder containing resin 22 includes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 ?m or more and 100 ?m or less. The third average grain diameter is 2 ?m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.Type: GrantFiled: September 4, 2013Date of Patent: August 2, 2016Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Kyohei Tonoyama, Makoto Morita, Tomokazu Ito, Hideto Itoh, Yoshihiro Maeda, Manabu Ohta, Yuuya Kaname, Takahiro Kawahara
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Patent number: 9349522Abstract: A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.Type: GrantFiled: August 20, 2015Date of Patent: May 24, 2016Assignee: TDK CORPORATIONInventors: Hitoshi Ohkubo, Tomokazu Ito, Hideto Itoh, Yoshihiro Maeda, Manabu Ohta, Yuuya Kaname, Takahiro Kawahara, Takashi Nakagawa
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Publication number: 20150357115Abstract: A coil component includes a substrate, a planar spiral conductor formed on a top surface of the substrate, a lead conductor connected to an outer peripheral end of the planar spiral conductor, a dummy lead conductor formed on the top surface of the substrate between an outermost turn of the planar spiral conductor and an end of the substrate and free from an electrical connection with another conductor within the same plane, external electrodes and arranged in parallel with the top surface of the substrate, and a bump electrode formed on a surface of the lead conductor and connects the lead conductor with the external electrode. The external terminals have a larger area than the bump electrodes for securing a bonding strength.Type: ApplicationFiled: August 20, 2015Publication date: December 10, 2015Inventors: Hitoshi OHKUBO, Tomokazu ITO, Hideto ITOH, Yoshihiro MAEDA, Manabu OHTA, Yuuya KANAME, Takahiro KAWAHARA, Takashi NAKAGAWA
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Patent number: 9142343Abstract: A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.Type: GrantFiled: July 3, 2013Date of Patent: September 22, 2015Assignee: TDK CorporationInventors: Hitoshi Ohkubo, Tomokazu Ito, Hideto Itoh, Yoshihiro Maeda, Manabu Ohta, Yuuya Kaname, Takahiro Kawahara
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Publication number: 20140077914Abstract: A coil component 1 is provided with coil conductors 10a and 10b and a magnetic metal powder containing resin 22 (22a and 22b) covering the coil conductors 10a and 10b. The magnetic metal powder containing resin 22 includes first metal powder having a first average grain diameter, second metal powder having a second average grain diameter that is smaller than the first average grain diameter, and third metal powder having a third average grain diameter that is smaller than the second average grain diameter. The first average grain diameter is 15 ?m or more and 100 ?m or less. The third average grain diameter is 2 ?m or less. The first metal powder mainly contains Permalloy and the second and third metal powders mainly contain carbonyl iron.Type: ApplicationFiled: September 4, 2013Publication date: March 20, 2014Applicant: TDK CorporationInventors: Hitoshi Ohkubo, Kyohei Tonoyama, Makoto Morita, Tomokazu Ito, Hideto Itoh, Yoshihiro Maeda, Manabu Ohta, Yuuya Kaname, Takahiro Kawahara
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Publication number: 20140009254Abstract: A coil component 1 includes a substrate 2, a planar spiral conductor 10a formed on a top surface 2t of the substrate 2, a lead conductor 11a connected to an outer peripheral end of the planar spiral conductor 10a, a dummy lead conductor 15a formed on the top surface of the substrate 2 and between an outermost turn of the planar spiral conductor 10a and an end 2X2 of the substrate 2 and free from an electrical connection with another conductor within the same plane, external electrodes 26a and 26b arranged in parallel with the top surface of the substrate 2, and a bump electrode 25a formed on a surface of the lead conductor 11a and connects the lead conductor 11a with the external electrode 26a. The external terminals 26a and 26b have a larger area than the bump electrodes 15a and 15b for securing a bonding strength.Type: ApplicationFiled: July 3, 2013Publication date: January 9, 2014Inventors: Hitoshi OHKUBO, Tomokazu ITO, Hideto ITOH, Yoshihiro MAEDA, Manabu OHTA, Yuuya KANAME, Takahiro KAWAHARA, Takashi NAKAGAWA