Patents by Inventor Hideto Kamiaka

Hideto Kamiaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ceramic substrate and producing process thereof, and a suction carrier for wafers using a ceramic wafer-chucking substrate
    Patent number: 5834106
    Abstract: A ceramic substrate for a hard disc, a thin film chip capacitor, and hybrid ICs, and a suction carrier for a substrate is constituted by using a titanium oxide or aluminum oxide substrate having an extremely small number of pores having diameters of 3 .mu.m or more on the substrate surface.The substrate is produced by baking highly purified titanium oxide fine powder or highly purified aluminum oxide fine powder in the air, an inert atmosphere or a reducing atmosphere (at 1,100.degree. C. to 1,300.degree. C. for the former and at 1,200.degree. to 1,400.degree. C. for the latter) and HIP treating the baked material.
    Type: Grant
    Filed: November 28, 1994
    Date of Patent: November 10, 1998
    Assignee: Nihon Cement Co., Ltd.
    Inventors: Hideto Kamiaka, Yukio Kishi