Abstract: To provide an oxide sintered body for a sputtering target, which is capable of adding specific elements to from an n-type semiconductor layer to a p-type semiconductor layer surface of a compound thin-film solar cell. An oxide sintered body which contains zinc (Zn) and at least one type of element (X) (excluding a case where magnesium is added alone) that has an ionization potential Ip of 4.5 eV?Ip?8.0 eV and an atomic radius d of 1.20 ??d?2.50 ? and which has a composition ratio (atomic ratio) of 0.0001?X/(Zn+X)?0.20 and a sintered density of at least 95%.

Abstract: A sintered composite oxide 2 composed mainly of zinc, aluminum, titanium and oxygen, the atomic ratio of the elements satisfying the following equations (1) to (3), the sintered composite oxide 2 comprising particles having a hexagonal wurtzite structure containing zinc oxide as the major component and having a mean particle size of no greater than 20 ?m, and particles having a ZnTiO3-like structure and/or Zn2Ti3O8-like structure containing aluminum and titanium and having a mean particle size of no greater than 5 ?m, and containing no particles with a spinel oxide structure of zinc aluminate with zinc and aluminum in solid solution, and a manufacturing method for the same. (Al+Ti)/(Zn+Al+Ti)=0.004-0.055??(1) Al/(Zn+Al+Ti)=0.002-0.025??(2) Ti/(Zn+Al+Ti)=0.002-0.048??(3) [In the equations, Al, Ti and Zn represent the contents (atomic percents) of aluminum, titanium and zinc, respectively.

Abstract: To provide a composite oxide sintered body from which an oxide transparent conductive film having lower light absorption properties in a wide wavelength region and having a low resistance can be obtained, and an oxide transparent conductive film. A composite oxide sintered body containing indium, zirconium, hafnium and oxygen, wherein the atomic ratio of the elements constituting the sintered body satisfies the following formulae, where In, Zr and Hf are respectively contents of indium, zirconium and hafnium: Zr/(In+Zr+Hf)=0.05 to 4.5 at % Hf/(In+Zr+Hf)=0.0002 to 0.

Abstract: A transparent conductive zinc oxide based film according to the present invention contains Ti, Al and Zn in such a proportion that satisfies the following formulae (1), (2) and (3) in terms of atomic ratio, and has a plurality of surface textures different in size on a surface, wherein a center-line average surface roughness Ra of the surface of the transparent conductive film is 30 nm to 200 nm, and an average value of widths of the surface textures is 100 nm to 10 ?m. 0.001?Ti/(Zn+Al+Ti)?0.079.??(1) 0.001?Al/(Zn+Al+Ti)?0.079??(2) 0.010?(Ti+Al)/(Zn+Al+Ti)?0.

Abstract: The present invention provides a complex oxide sintered body 10 wherein Zr/(In+Zr+Y) is 0.05 to 4.5 at % and Y/(In+Zr+Y) is 0.005 to 0.5 at % in an atomic ratio when indium, zirconium, and yttrium are designated by In, Zr, and Y, respectively. Moreover, the present invention provides a sputtering target including the complex oxide sintered body 10 and a transparent conductive oxide film obtained by sputtering the sputtering target.

Abstract: A sintered complex oxide comprising metal oxide particles (a) having a hexagonal lamellar structure and containing zinc oxide and indium, and metal oxide particles (b) having a spinel structure and containing a metal element M (where M is aluminum and/or gallium), wherein the mean value of the long diameter of the metal oxide particles (a) is no greater than 10 ?m, and at least 20% of the metal oxide particles (a) have an aspect ratio (long diameter/short diameter) of 2 or greater, based on the number of particles.

Abstract: The invention provides an oxide sintered compact 2 composed of a crystal phase which consists of a bixbite-type oxide phase and a perovskite-type oxide phase, or a bixbite-type oxide phase, the crystal phase having indium, tin, strontium and oxygen as the constituent elements, and the indium, the tin and the strontium contents satisfying formulas (1) and (2) in terms of atomic ratio, as well as a sputtering target. There are further provided an oxide transparent conductive film formed using the sputtering target, and a solar cell. Sn/(In+Sn+Sr)=0.01-0.11??(1) Sr/(In+Sn+Sr)=0.0005-0.004??(2) [In formulas (1) and (2), In, Sn and Sr represent indium, tin and strontium contents (atomic percent), respectively.

Abstract: There is provided a zinc oxide sintered compact with a zirconium content of 10 to 1000 ppm, and a sputtering target containing the zinc oxide sintered compact. There is also provided a zinc oxide thin-film having a zirconium content of 10 to 2000 ppm and a resistivity of 10 ?·cm or greater.

Abstract: A sintered composite oxide 2 composed mainly of zinc, aluminum, titanium and oxygen, the atomic ratio of the elements satisfying the following equations (1) to (3), the sintered composite oxide 2 comprising particles having a hexagonal wurtzite structure containing zinc oxide as the major component and having a mean particle size of no greater than 20 ?m, and particles having a ZnTiO3-like structure and/or Zn2Ti3O8-like structure containing aluminum and titanium and having a mean particle size of no greater than 5 ?m, and containing no particles with a spinel oxide structure of zinc aluminate with zinc and aluminum in solid solution, and a manufacturing method for the same. (Al+Ti)/(Zn+Al+Ti)=0.004-0.055??(1) Al/(Zn+Al+Ti)=0.002-0.025??(2) Ti/(Zn+Al+Ti)=0.002-0.048??(3) [In the equations, Al, Ti and Zn represent the contents (atomic percents) of aluminum, titanium and zinc, respectively.

Abstract: A transparent conductive zinc oxide based film according to the present invention contains Ti, Al and Zn in such a proportion that satisfies the following formulae (1), (2) and (3) in terms of atomic ratio, and has a plurality of surface textures different in size on a surface, wherein a center-line average surface roughness Ra of the surface of the transparent conductive film is 30 nm to 200 nm, and an average value of widths of the surface textures is 100 nm to 10 ?m. 0.001?Ti/(Zn+Al+Ti)?0.079.??(1) 0.001?Al/(Zn+Al+Ti)?0.079??(2) 0.010?(Ti+Al)/(Zn+Al+Ti)?0.

Abstract: A sintered complex oxide comprising metal oxide particles (a) having a hexagonal lamellar structure and containing zinc oxide and indium, and metal oxide particles (b) having a spinel structure and containing a metal element M (where M is aluminum and/or gallium), wherein the mean value of the long diameter of the metal oxide particles (a) is no greater than 10 ?m, and at least 20% of the metal oxide particles (a) have an aspect ratio (long diameter/short diameter) of 2 or greater, based on the number of particles.

Abstract: An abrasive molding composed of a mass of inorganic particles, said mass having pores intervening among the inorganic particles, which molding has abrasive area to be placed in frictional contact with an article to be abraded, and non-abrasive area on a abrading surface of the abrasive molding. The abrasive area has exposed pores having a diameter of not larger than 1 &mgr;m, the total area of said exposed pores having a diameter of not larger than 1 &mgr;m occupying below 15% of the total area of abrasive area, and the non-abrasive area occupies 20% to 60% of the sum of the abrasive area and the non-abrasive area.

Abstract: An abrasive molding comprising at least 90% by weight, based on the abrasive molding, of an inorganic material having a stock hardness of 50-400 kg/mm2, and said abrasive molding having a relative density of 20-70% and an average particle diameter of 0.001-50 &mgr;m. The abrasive molding preferably has pores having a pore size distribution such that the integrated pore volume of pores having a diameter of 0.01-1 &mgr;m is at least 20% of the integrated total pore volume of the entire pores, and the integrated pore volume of pores having a diameter of 1-360 &mgr;m is in the range of 10% to 70% of the integrated total pore volume of the entire pores. The abrasive molding is suitable for polishing a material having a Vickers hardness not larger than 300 kg/mm2.

Abstract: An abrasive molding composed of a mass of inorganic particles, said mass having pores intervening among the inorganic particles, which molding has abrasive area to be placed in frictional contact with an article to be abraded, and non-abrasive area on a abrading surface of the abrasive molding. The abrasive area has exposed pores having a diameter of not larger than 1 &mgr;m, the total area of said exposed pores having a diameter of not larger than 1 &mgr;m occupying below 15% of the total area of abrasive area, and the non-abrasive area occupies 20% to 60% of the sum of the abrasive area and the non-abrasive area.

Abstract: An abrasive molding predominantly comprised of manganese oxide is described, which has a bulk density of 0.4 to 4.0 g/cm3, a BET specific surface area of 0.2 to 250 m2/g and an average particle diameter of 0.005 to 10 &mgr;m. The abrasive molding has a multiplicity of minute pores, preferably with a pore diameter distribution such that the integrated pore volume of minute pores having a pore diameter of at least 1 &mgr;m is at least 20%, the integrated pore volume of minute pores having a pore diameter of 10 to 100 &mgr;m is at least 15%, and the integrated pore volume of minute pores having a pore diameter exceeding 100 &mgr;m is not larger than 5%, based on the total integrated pore volume of the minute pores of the abrasive molding. The porosity is preferably in the range of 30 to 95% by volume based on the apparent volume of the abrasive molding. The minute pores are preferably interconnecting minute pores which are open to the exterior, wherein a solid is contained which is soluble in a polishing liquid.

Abstract: An abrasive member made of a silica molding predominantly comprised of silica is described. The abrasive member has a bulk density of 0.2 to 1.5 g/cm3, a BET specific surface area of 10 to 400 m2/g, an average particle diameter of 0.001 to 0.5 &mgr;m, and a multiplicity of interconnecting minute pores which are open to the exterior. A solid soluble in a polishing liquid is made present within the minute pores of the silica molding. The abrasive member is fixed or fitted to a supporting auxiliary to be assembled into an abrasive disc. The abrasive disc is used for polishing a material to be polished, by rubbing the material to be polished therewith while at least one of the abrasive disc and the material to be polished is moved and while a polishing liquid is applied to the abrasive disc.

Abstract: An abrasive molding comprising at least 90% by weight, based on the abrasive molding, of an inorganic material having a stock hardness of 50-400 kg/mm2, and said abrasive molding having a relative density of 20-70% and an average particle diameter of 0.001-50 &mgr;m. The abrasive molding preferably has pores having a pore size distribution such that the integrated pore volume of pores having a diameter of 0.01-1 &mgr;m is at least 20% of the integrated total pore volume of the entire pores, and the integrated pore volume of pores having a diameter of 1-360 &mgr;m is in the range of 10% to 70% of the integrated total pore volume of the entire pores. The abrasive molding is suitable for polishing a material having a Vickers hardness not larger than 300 kg/mm2.

Abstract: A molded abrasive product which is made mainly of a zirconia component and which has a bulk density of from 0.5 to 5.2 g/cm3, a BET specific surface area of from 0.1 to 100 m2/g and an average particle size of from 0.005 to 50 &mgr;m.

Abstract: An abrasive shaped article composed of at least 90% by weight, based on the weight of the abrasive shaped article, of silica and having a bulk density of 0.2 g/cm3 to 1.5 g/cm3, a BET specific surface area of 10 m2/g to 400 m2/g and an average particle diameter of 0.001 &mgr;m to 0.5 &mgr;m. An abrasive disc having fitted thereto at least one of the abrasive shaped article is advantageously used for polishing a material such as substrate. Preferably at least two kinds of abrasive shaped articles are fitted to the supporting auxiliary, at least one kind of which has a bulk density of 0.7 g/cm3 to 1.5 g/cm3 and at least one kind of which has a bulk density of at least 0.2 g/cm3 but smaller than 0.7 g/cm3.

Abstract: An abrasive shaped article composed of at least 90% by weight, based on the weight of the abrasive shaped article, of silica and having a bulk density of 0.2 g/cm.sup.3 to 1.5 g/cm.sup.3, a BET specific surface area of 10 m.sup.2 /g to 400 m.sup.2 /g and an average particle diameter of 0.001 .mu.m to 0.5 .mu.m. An abrasive disc having fitted thereto at least one of the abrasive shaped article is advantageously used for polishing a material such as substrate. Preferably at least two kinds of abrasive shaped articles are fitted to the supporting auxiliary, at least one kind of which has a bulk density of 0.7 g/cm.sup.3 to 1.5 g/cm.sup.3 and at least one kind of which has a bulk density of at least 0.2 g/cm.sup.3 but smaller than 0.7 g/cm.sup.3.