Patents by Inventor Hideto Misawa

Hideto Misawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4738890
    Abstract: A resin-impregnated base of which total quantity of resin absence regions is restricted to be below a predetermined value, whereby a metal-foil coated laminate of the resin-impregnated bases is made obtainable continuously through a hot-compression molding under a low pressure, while restraining in particular void generation to maintain the dimensional change rate of the laminate to be minimum.
    Type: Grant
    Filed: October 18, 1985
    Date of Patent: April 19, 1988
    Assignee: Matsushita Electric Works, Ltd.
    Inventors: Yasuo Tohrin, Tokio Yoshimitsu, Hideto Misawa, Motoyuki Akamatsu