Patents by Inventor Hideto Nakazawa

Hideto Nakazawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing radiating plate and semiconductor apparatus using the same
    Patent number: 7445965
    Abstract: A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate 14, supplying the In to the radiating plate 14, heating and melting the In and hermetically adhering the In 18 to the radiating plate, thereby obtaining an In integral type radiating plate.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: November 4, 2008
    Assignee: Shinko Electric Industries Co., Ltd.
    Inventors: Masatoshi Akagawa, Masao Nakazawa, Hideto Nakazawa
  • Method of mounting an electronic part
    Patent number: 7100279
    Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.
    Type: Grant
    Filed: April 21, 2004
    Date of Patent: September 5, 2006
    Assignees: Shinko Electric Industries Co., Ltd., Oki Electric Industry Co., Ltd., Sanyo Electric Co., Ltd., Sharp Kabushiki Kaisha, Sony Corporation, Kabushiki Kaisha Toshiba, NEC Corporation, Hitachi, Ltd., Fujitsu Limited, Matsushita Electric Industrial Co., Ltd., Mitsubishi Denki Kabushiki Kaisha, Rohm Co., LTD
    Inventors: Tadatomo Suga, Toshihiro Itoh, Hideto Nakazawa, Masatoshi Akagawa
  • Method of manufacturing radiating plate and semiconductor apparatus using the same
    Publication number: 20050221536
    Abstract: A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate 14, supplying the In to the radiating plate 14, heating and melting the In and hermetically adhering the In 18 to the radiating plate, thereby obtaining an In integral type radiating plate.
    Type: Application
    Filed: March 31, 2005
    Publication date: October 6, 2005
    Applicant: Shinko Electric Industries Co., Ltd.
    Inventors: Masatoshi Akagawa, Masao Nakazawa, Hideto Nakazawa
  • Method of mounting an electronic part
    Publication number: 20040211060
    Abstract: A method of mounting an electronic part on a board, in which an electronic part and a mounting board on which the electronic part is to be mounted are placed in a vacuum or inert atmosphere, and the electronic part is mounted on the board by bringing the bonding members of the electronic part and the board into contact with each other at normal temperature to thereby mount the electronic part on the board, the method comprising forming the bonding members of at least one of the electronic part and the board out of a solder material, and bringing the bonding members of the electronic part and the board into contact with each other without preprocessing the bonding surfaces of the bonding members.
    Type: Application
    Filed: April 21, 2004
    Publication date: October 28, 2004
    Applicants: Tadatomo SUGA, SHINKO ELECTRIC INDUSTRIES CO., LTD, Oki Electric Industry Co., Ltd., SANYO ELECTRIC CO., LTD., SHARP KABUSHIKI KAISHA, SONY CORPORATION, KABUSHIKI KAISHA TOSHIBA, NEC CORPORATION, HITACHI, LTD., FUJITSU LIMITED, MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD., MITSUBISHI DENKI KABUSHIKI KAISHA, ROHM CO., LTD.
    Inventors: Tadatomo Suga, Toshihiro Itoh, Hideto Nakazawa, Masatoshi Akagawa