Patents by Inventor Hideto Nito
Hideto Nito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11099479Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, and which includes a polymeric compound having a structural unit represented by general formula (a0-1) (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Va0 represents a divalent hydrocarbon group; na0 represents an integer of 0 to 2; Ra00 represents an acid dissociable group represented by general formula (a0-r1-1); Ra01 and Ra02 represents a hydrocarbon group; Ra01 and Ra02 may be mutually bonded to form a ring; Ya0 represents a quaternary carbon atom; Ra031, Ra032 and Ra033 each independently represents a hydrocarbon group, provided that at least one of Ra031, Ra032 and Ra033 is a hydrocarbon group having a polar group).Type: GrantFiled: October 4, 2017Date of Patent: August 24, 2021Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Takashi Nagamine, Hideto Nito, Masafumi Fujisaki, Tatsuya Fujii, Yuki Fukumura, Takahiro Kojima, Issei Suzuki, Takuya Ikeda, KhanhTin Nguyen
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Publication number: 20200209741Abstract: A resist composition including a resin component (A1) which exhibits changed solubility in a developing solution under action of acid, the resin component (A1) including a structural unit (a0) represented by general formula (a0-1) shown below (wherein Ya01 and Ya02 each independently represents a single bond or an alkylene group of 1 to 3 carbon atoms, provided that the total number of carbon atoms of Ya01 and Ya02 is 3 or less; Ra01 and Ra02 each independently represents a hydrogen atom or an alkyl group of 1 to 4 carbon atoms, provided that the total number of carbon atoms of Ra01 and Ra02 is 2 to 6; A? represents an alkylene group of 1 to 5 carbon atoms).Type: ApplicationFiled: September 21, 2018Publication date: July 2, 2020Inventors: Junichi TSUCHIYA, Kotaro ENDO, Masafumi FUJISAKI, Hideto NITO
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Publication number: 20190219920Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, and which includes a polymeric compound having a structural unit represented by general formula (a0-1) (wherein R represents a hydrogen atom, an alkyl group of 1 to 5 carbon atoms or a halogenated alkyl group of 1 to 5 carbon atoms; Va0 represents a divalent hydrocarbon group; na0 represents an integer of 0 to 2; Ra00 represents an acid dissociable group represented by general formula (a0-r1-1); Ra01 and Ra02 represents a hydrocarbon group; Ra01 and Ra02 may be mutually bonded to form a ring; Ya0 represents a quaternary carbon atom; Ra031, Ra032 and Ra033 each independently represents a hydrocarbon group, provided that at least one of Ra031, Ra032 and Ra033 is a hydrocarbon group having a polar group).Type: ApplicationFiled: October 4, 2017Publication date: July 18, 2019Inventors: Takashi NAGAMINE, Hideto NITO, Masafumi FUJISAKI, Tatsuya FUJII, Yuki FUKUMURA, Takahiro KOJIMA, Issei SUZUKI, Takuya IKEDA, KhanhTin NGUYEN
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Patent number: 10180625Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid, and a compound (D1) represented by general formula (d1), wherein Z? represents an anion having an aromatic ring containing a hydroxybenzoic acid skeleton, provided that at least one hydrogen atom of the aromatic ring has been substituted with a halogen atom; m represents an integer of 1 or more; and Mm+ represents an organic cation having a valency of m.Type: GrantFiled: June 27, 2017Date of Patent: January 15, 2019Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Takashi Nagamine, Kotaro Endo, Hideto Nito
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Patent number: 9851637Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid, and a compound (D1) represented by general formula (d1), wherein Z? represents an anion having an aromatic ring containing a hydroxybenzoic acid skeleton, provided that at least one hydrogen atom of the aromatic ring has been substituted with a halogen atom; m represents an integer of 1 or more; and Mm+ represents an organic cation having a valency of m.Type: GrantFiled: October 4, 2016Date of Patent: December 26, 2017Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Takashi Nagamine, Kotaro Endo, Hideto Nito
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Publication number: 20170293223Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid, and a compound (D1) represented by general formula (d1), wherein Z? represents an anion having an aromatic ring containing a hydroxybenzoic acid skeleton, provided that at least one hydrogen atom of the aromatic ring has been substituted with a halogen atom; m represents an integer of 1 or more; and Mm+ represents an organic cation having a valency of m.Type: ApplicationFiled: June 27, 2017Publication date: October 12, 2017Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Takashi NAGAMINE, Kotaro ENDO, Hideto NITO
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Patent number: 9678423Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, and which includes a base component (A) which exhibits changed solubility in a developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including a compound (B0-1) represented by general formula (b0) shown below (in the formula, Yx01 represents a divalent linking group; n represents an integer of 1 to 3; and M?m+ represents an organic cation having a valency of m.Type: GrantFiled: March 16, 2016Date of Patent: June 13, 2017Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Takashi Nagamine, Hideto Nito, Daichi Takaki
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Publication number: 20170097564Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, the resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid, and a compound (D1) represented by general formula (d1), wherein Z? represents an anion having an aromatic ring containing a hydroxybenzoic acid skeleton, provided that at least one hydrogen atom of the aromatic ring has been substituted with a halogen atom; m represents an integer of 1 or more; and Mm+ represents an organic cation having a valency of m.Type: ApplicationFiled: October 4, 2016Publication date: April 6, 2017Applicant: TOKYO OHKA KOGYO CO., LTD.Inventors: Takashi NAGAMINE, Kotaro ENDO, Hideto NITO
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Patent number: 9494866Abstract: A method of forming a resist pattern, including forming a resist film by coating a resist composition including a base component (A) that exhibits increased solubility in an alkali developing solution, a photo-base generator component (C) that generates a base upon exposure, an acid supply component (Z) and a compound (F) containing at least one selected from the group consisting of a fluorine atom and a silicon atom and containing no acid decomposable group which exhibits increased polarity by the action of acid on a substrate; subjecting the resist film to exposure baking the exposed resist film; and subjecting the resist film to alkali development, thereby forming a negative-tone resist pattern.Type: GrantFiled: January 29, 2015Date of Patent: November 15, 2016Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Tsuyoshi Nakamura, Jiro Yokoya, Hiroaki Shimizu, Hideto Nito
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Publication number: 20160274458Abstract: A resist composition which generates acid upon exposure and exhibits changed solubility in a developing solution under action of acid, and which includes a base component (A) which exhibits changed solubility in a developing solution under action of acid and an acid-generator component (B) which generates acid upon exposure, the acid-generator component (B) including a compound (B0-1) represented by general formula (b0) shown below (in the formula, Yx01 represents a divalent linking group; n represents an integer of 1 to 3; and M?m+ represents an organic cation having a valency of m.Type: ApplicationFiled: March 16, 2016Publication date: September 22, 2016Inventors: Takashi NAGAMINE, Hideto NITO, Daichi TAKAKI
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Patent number: 9411224Abstract: A method of forming a resist pattern, including forming a resist film on a substrate using a resist composition comprising a base component that exhibits increased solubility in an alkali developing solution and a photo-base generator component; exposing the resist film; baking the exposed resist film, such that, at an exposed portion thereof, the base generated from the photo-base generator component upon the exposure and an acid provided to the resist film are neutralized, and at an unexposed portion of the resist film, the solubility of the base component in an alkali developing solution is increased by the acid provided to the resist film; and subjecting the resist film to alkali development, thereby forming a negative-tone resist pattern in which the unexposed portion of the resist film has been dissolved and removed.Type: GrantFiled: May 9, 2012Date of Patent: August 9, 2016Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Jiro Yokoya, Tsuyoshi Nakamura, Hiroaki Shimizu, Masaru Takeshita, Hideto Nito, Hirokuni Saito
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Patent number: 9405200Abstract: A method of forming a resist pattern, including: a step (1) in which a resist film is formed by coating a resist composition including a base component (A) that exhibits increased solubility in an alkali developing solution, a photo-base generator component (C) that generates a base upon exposure, an acid supply component (Z) and a compound (F) containing at least one selected from the group consisting of a fluorine atom and a silicon atom and containing no acid decomposable group which exhibits increased polarity by the action of acid on a substrate; a step (2) in which the resist film is subjected to exposure; a step (3) in which baking is conducted after the step (2); and a step (4) in which the resist film is subjected to an alkali development, thereby forming a negative-tone resist pattern, and a resist composition used in the step (1).Type: GrantFiled: September 21, 2012Date of Patent: August 2, 2016Assignee: TOYKO OHKA KOGYO CO., LTD.Inventors: Tsuyoshi Nakamura, Jiro Yokoya, Hiroaki Shimizu, Hideto Nito
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Patent number: 9377685Abstract: A resist composition used in a method of forming a resist pattern including applying a resist composition comprising a base component that exhibits increased solubility in an alkali developing solution and a photo-base generator component to a substrate to form a resist film; subjecting the resist film to exposure; baking after subjecting the resist film to exposure, wherein at an exposed portion of the resist film, the base generated from the photo-base generator component upon exposure and an acid provided to the resist film in advance are neutralized, and at an unexposed portion of the resist film, the solubility of the base component in an alkali developing solution is increased by the action of acid provided to the resist film in advance; and subjecting the resist film to alkali development, thereby forming a negative-tone resist pattern.Type: GrantFiled: September 21, 2012Date of Patent: June 28, 2016Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Hiroaki Shimizu, Tsuyoshi Nakamura, Jiro Yokoya, Hideto Nito
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Patent number: 9097969Abstract: A compound represented by general formula (b1) shown below (in the formula, Y1 represents a divalent linking group; W represents S, Se or I; R1 represents a hydrocarbon group; represents an alkyl group of 1 to 5 carbon atoms or an alkoxy group of 1 to 5 carbon atoms; when W represents I, m+n=2, and when W represents S or Se, m+n=3, provided that m?1 and n?0; p represents an integer of 0 to 5; and X? represents a counteranion.Type: GrantFiled: June 11, 2013Date of Patent: August 4, 2015Assignee: TOKYO OHKA KOGYO CO., LTD.Inventors: Yoshiyuki Utsumi, Hideto Nito
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Publication number: 20150147702Abstract: A method of forming a resist pattern, including forming a resist film by coating a resist composition including a base component (A) that exhibits increased solubility in an alkali developing solution, a photo-base generator component (C) that generates a base upon exposure, an acid supply component (Z) and a compound (F) containing at least one selected from the group consisting of a fluorine atom and a silicon atom and containing no acid decomposable group which exhibits increased polarity by the action of acid on a substrate; subjecting the resist film to exposure baking the exposed resist film; and subjecting the resist film to alkali development, thereby forming a negative-tone resist pattern.Type: ApplicationFiled: January 29, 2015Publication date: May 28, 2015Inventors: Tsuyoshi Nakamura, Jiro Yokoya, Hiroaki Shimizu, Hideto Nito
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Patent number: 9029070Abstract: There are provided a method of forming a resist pattern includes: a step (1) in which a resist composition containing a base component (A) that generates base upon exposure and exhibits increased solubility in an alkali developing solution by the action of acid is applied to a substrate to form a resist film; a step (2) in which the resist film 2 is subjected to exposure; a step (3) in which baking is conducted after the step (2); and a step (4) in which the resist film 2 is subjected to an alkali development, thereby forming a negative-tone resist pattern in which the unexposed portion 2b of the resist film 2 has been dissolved and removed, and the resist composition used in the step (1).Type: GrantFiled: November 2, 2012Date of Patent: May 12, 2015Assignee: Tokyo Ohka Kogyo Co., LtdInventors: Hiroaki Shimizu, Tsuyoshi Nakamura, Jiro Yokoya, Hideto Nito
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Patent number: 9023585Abstract: A resist composition which generates a base upon exposure and exhibits increased solubility in an alkali developing solution under the action of acid, and the resist composition including: a base component (A) that exhibits increased solubility in an alkali developing solution under the action of acid; an acidic compound component (G1) including a nitrogen-containing cation having a pKa value of 7 or less and a counteranion; and a buffer component (K) including a nitrogen-containing cation and a counteranion being a conjugate base for the acid having a pKa value of 0 to 5.Type: GrantFiled: June 20, 2013Date of Patent: May 5, 2015Assignee: Tokyo Ohka Kogyo Co., LtdInventors: Tsuyoshi Nakamura, Jiro Yokoya, Hideto Nito, Hiroaki Shimizu
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Patent number: 9005872Abstract: A resist composition including a base component (A) which exhibits changed solubility in a developing solution under action of acid, a basic-compound component (C) and an acid-generator component (B) which generates acid upon exposure, the component (B) including a compound represented by formula (b1), and the component (C) including at least one compound represented by formulas (c1) to (c3) (wherein Z1 represents a ring skeleton-containing hydrocarbon group, Q1 represents a divalent linking group containing oxygen, Y1 represents a fluorinated alkylene group, M+ represents an organic cation, R1 represents a fluorinated alkyl group or a hydrocarbon group, L1+ and L2+ represents a sulfonium or an iodonium, Z2 represents a hydrogen atom or a hydrocarbon group, Y2 represents a single bond or a divalent linking group containing no fluorine, R2 represents an organic group, Y3 represents an alkylene group or an arylene group; and Rf represents a fluorine-containing hydrocarbon group).Type: GrantFiled: February 16, 2012Date of Patent: April 14, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Hiroaki Shimizu, Sho Abe, Hideto Nito
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Patent number: 8968990Abstract: A method of forming a resist pattern, including: step (1) in which a resist composition including a base component, a photobase generator component and an acid supply component is applied to a substrate to form a resist film; step (2) in which the resist film is subjected to exposure without being subjected to prebaking; step (3) in which baking is conducted after step (2), such that, at an exposed portion of the resist film, the base generated from the photobase generator component upon the exposure and an acid derived from the acid supply component are neutralized, and at an unexposed portion of the resist film, the solubility of the base component in an alkali developing solution is increased by the action of the acid derived from the acid supply component; and step (4) in which the resist film is subjected to an alkali development, thereby forming a negative-tone resist pattern.Type: GrantFiled: September 13, 2012Date of Patent: March 3, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Jiro Yokoya, Tsuyoshi Nakamura, Hiroaki Shimizu, Hideto Nito
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Patent number: 8956800Abstract: A method of forming a resist pattern, including: step (1) in which a resist composition containing a base component (A) that exhibits increased solubility in an alkali developing solution and a compound represented by general formula (C1) is applied to a substrate to form a resist film, step (2) in which the resist film is subjected to exposure, step (3) in which baking is conducted after step (2), and step (4) in which the resist film is subjected to an alkali development, thereby forming a negative-tone resist pattern; and the resist composition used in step (1): wherein R1 represents a group which forms an aromatic ring together with the two carbon atoms bonded to the R1 group; R2 represents a hydrogen atom or a hydrocarbon group; and R3 represents a hydrogen atom, a carboxy group or a hydrocarbon group of 1 to 15 carbon atoms.Type: GrantFiled: January 2, 2013Date of Patent: February 17, 2015Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Hiroaki Shimizu, Jiro Yokoya, Tsuyoshi Nakamura, Hideto Nito