Patents by Inventor Hideto Saito

Hideto Saito has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11626818
    Abstract: A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.
    Type: Grant
    Filed: April 26, 2021
    Date of Patent: April 11, 2023
    Assignee: TOKYO ELECTRON LIMITED
    Inventor: Hideto Saito
  • Publication number: 20220415693
    Abstract: A substrate support includes an electrostatic chuck formed of ceramics and holding a substrate by electrostatic attraction, a base supporting the electrostatic chuck, and a flow path through which a heat exchange medium flows. An upper surface of the flow path is formed of ceramics.
    Type: Application
    Filed: June 22, 2022
    Publication date: December 29, 2022
    Inventors: Hideto SAITO, Makoto KATO, Shin YAMAGUCHI, Takashi KANAZAWA, Ryoma MUTO
  • Publication number: 20210344288
    Abstract: A substrate processing apparatus includes a stage on which a substrate is placed, wherein the stage includes a first plate, a first temperature adjustment mechanism configured to control a temperature of the first plate, a second plate provided below the first plate, a second temperature adjustment mechanism configured to control a temperature of the second plate, and a fastening member configured to fasten the first plate and the second plate.
    Type: Application
    Filed: April 26, 2021
    Publication date: November 4, 2021
    Inventor: Hideto SAITO
  • Publication number: 20210207283
    Abstract: An anodized titanium material includes a titanium base material and an anodized titanium layer. The anodized titanium layer is provided on a surface of the titanium base material. The anodized titanium layer includes a porous first anodized titanium layer. The anodized titanium layer has a withstand voltage at 25° C. of 500 V or more, a Vickers hardness of 200 or more, a film thickness of 20 ?m or more and less than 80 ?m, an arithmetic average roughness Ra of a surface of less than 1.6 ?m, and a maximum height roughness Rz of the surface is less than 6.3 ?m. In both of a section perpendicular to a thickness direction of the first anodized titanium oxide layer and the surface, no pore sections having a shape capable of including a circle having a diameter of 0.5 ?m or more are observed.
    Type: Application
    Filed: February 8, 2021
    Publication date: July 8, 2021
    Applicants: Yamaguchi Prefectural Industrial Technology Institute, Shimonoseki Mekki Co., Ltd., Tokyo Electron Limited
    Inventors: Takehiko MURANAKA, Kouji NIIMI, Yuuta UENO, Hikaru KIKUCHI, Hideto SAITO, Nobuyuki NAGAYAMA
  • Publication number: 20210143044
    Abstract: A plasma processing apparatus includes: a vacuumable processing container; a lower electrode provided inside the processing container and for placing a substrate thereon; an edge ring arranged to surround a periphery of the substrate; an electrostatic chuck provided on the lower electrode to attract the substrate and the edge ring; a heat-transfer-gas supply part for supplying a heat transfer gas between the electrostatic chuck and the edge ring through one or more first through-holes respectively formed in the lower electrode and the electrostatic chuck; and a heat-transfer-gas exhaust part for exhausting the heat transfer gas between the electrostatic chuck and the edge ring through one or more second through-holes respectively formed in the lower electrode and the electrostatic chuck. Electrostatic chuck openings of the second through-holes are formed radially inward of those of the first through-holes between the electrostatic chuck and the edge ring.
    Type: Application
    Filed: November 3, 2020
    Publication date: May 13, 2021
    Inventors: Shinsuke OKA, Kenya IWASAKI, Hideto SAITO
  • Patent number: 9253866
    Abstract: A gas lock device may include a chamber having a passage section and a connection hole that connects a surface to the passage section, an optical element that is attached to the chamber and seals the passage section, a gas supply apparatus, and a pipe that is attached at one end to the gas supply apparatus and attached at the other end to the chamber, and may define a flow channel communicating with the connection hole.
    Type: Grant
    Filed: February 4, 2014
    Date of Patent: February 2, 2016
    Assignee: Gigaphoton Inc.
    Inventors: Hiroshi Someya, Hideto Saito
  • Publication number: 20140216576
    Abstract: A gas lock device may include a chamber having a passage section and a connection hole that connects a surface to the passage section, an optical element that is attached to the chamber and seals the passage section, a gas supply apparatus, and a pipe that is attached at one end to the gas supply apparatus and attached at the other end to the chamber, and may define a flow channel communicating with the connection hole.
    Type: Application
    Filed: February 4, 2014
    Publication date: August 7, 2014
    Applicant: GIGAPHOTON INC.
    Inventors: Hiroshi SOMEYA, Hideto SAITO
  • Patent number: 6570703
    Abstract: An optical amplifying apparatus of the present invention comprises a correction part for correcting a predetermined fixed value of an output optical level by a correction amount according to an optical power of amplified spontaneous emission (ASE). The correction amount is, for example, computed by predetermined formulas. According to the present invention, when a WDM optical signal is optically amplified, the output is fixedly amplified for each channel by the correction amount which is a value obtained with the ASE levels taken into consideration, so that a fluctuation in the level of the average optical power of the channels is suppressed even if an optical signal is dropped/added therefrom/thereto during repeated transmissions.
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: May 27, 2003
    Assignee: Fujitsu Limited
    Inventors: Makoto Murakami, Motoyoshi Sekiya, Hideto Saito, Hiroaki Tomofuji, Takeshi Sakamoto, Kazuo Yamane
  • Publication number: 20020039226
    Abstract: An optical amplifying apparatus of the present invention comprises a correction part for correcting a predetermined fixed value of an output optical level by a correction amount according to an optical power of amplified spontaneous emission (ASE). The correction amount is, for example, computed by predetermined formulas. According to the present invention, when a WDM optical signal is optically amplified, the output is fixedly amplified for each channel by the correction amount which is a value obtained with the ASE levels taken into consideration, so that a fluctuation in the level of the average optical power of the channels is suppressed even if an optical signal is dropped/added therefrom/thereto during repeated transmissions.
    Type: Application
    Filed: October 3, 2001
    Publication date: April 4, 2002
    Applicant: FUJITSU LIMITED
    Inventors: Makoto Murakami, Motoyoshi Sekiya, Hideto Saito, Hiroaki Tomofuji, Takeshi Sakamoto, Kazuo Yamane
  • Patent number: 6330776
    Abstract: In the structure for reinforcing a concrete member and the reinforcing method of the present invention, a reinforcing sheet is arranged and joined to a various kinds of concrete member, such as column, beam, wall, floor, and the like, by applying the reinforcing sheet to the surface of the concrete member and attaching to the fixing anchors joined to the concrete member or the other concrete member surrounding the concrete member. The fixing anchor comprises a large amount of reinforcing fiber, and is obtained by bundling a part of the reinforcing fiber. The unbundled portion of the fixing anchor is spread along the surface of the concrete member. The reinforcing sheet is over-lapped to the unbundled portion using resin adhesives. In addition, reinforcing fibers, such as carbon fiber, aramid fiber, glass fiber, and the like are preferably used as the material comprising the fixing anchor and reinforcing sheet. Thereby, the reinforcing member can be joined via the fixing anchor to the concrete members.
    Type: Grant
    Filed: March 2, 2000
    Date of Patent: December 18, 2001
    Assignee: Nippon Steel Corporation
    Inventors: Yasuo Jinno, Hideto Saito, Hideo Tsukagoshi, Jun′ichi Iketani, Tadao Fujita, Minoru Sawaide, Yasuo Inada, Yoshihiko Shimizu