Abstract: A process for producing a metal plating film, comprising providing a base element with convex curved surface, depositing a metal plating film on the base element surface and detaching the metal plating film from the base element. The base element surface on which the metal plating film is deposited is convex curved, so that the metal plating film of convex sectional configuration is formed on the base element surface. Internal stress (tensile stress) occurs within the thus formed metal plating film, so that when the metal plating film is detached from the base element and transferred on a dielectric sheet, the metal plating film is transfigured toward planarization. Therefore, on transfer recipient materials, such as the dielectric sheet, having a metal plating film transferred thereonto, deformation and damaging of such a metal plating film can be effectively prevented to thereby contribute to an improvement of production efficiency.

Abstract: A multilayer electronic component of the present invention includes dielectric layers (7) and internal electrode layers (5) that are alternatively laminated. The internal electrode layers (5) are exposed alternatively to opposite sides in a laminating direction. The multilayer electronic component has at both ends thereof external electrodes (3) connected to the internal electrode layers (5), and the thickness of a connected end of the internal electrode layers (5) with the external electrodes (3) is greater than the thickness of a non-connecting end. Therefore, even if the internal electrode layers (5) are thinned, the multilayer electronic component is excellent in electrical connection property between the internal electrode layer (5) and the external electrodes (5), thereby obtaining high electrostatic capacity.

Abstract: A multilayer electronic component of the present invention includes dielectric layers (7) and internal electrode layers (5) that are alternatively laminated. The internal electrode layers (5) are exposed alternatively to opposite sides in a laminating direction. The multilayer electronic component has at both ends thereof external electrodes (3) connected to the internal electrode layers (5), and the thickness of a connected end of the internal electrode layers (5) with the external electrodes (3) is greater than the thickness of a non-connecting end. Therefore, even if the internal electrode layers (5) are thinned, the multilayer electronic component is excellent in electrical connection property between the internal electrode layer (5) and the external electrodes (5), thereby obtaining high electrostatic capacity.