Patents by Inventor Hideto SHIMOYOSHI

Hideto SHIMOYOSHI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WIDE BANDGAP WAFER BACKSIDE CAPPED BY A DETECTION FACILITATING LAYER
    Publication number: 20210407799
    Abstract: In one general aspect, an apparatus can include a wide bandgap wafer having a backside and a frontside. The apparatus can include a detection facilitating layer capped on the backside of the wide bandgap wafer, the detection facilitating layer having a thickness less than a thickness of the wide bandgap wafer.
    Type: Application
    Filed: September 28, 2020
    Publication date: December 30, 2021
    Applicant: SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    Inventors: Tetsuya YOSHIDA, Takumi HOSOYA, Hideto SHIMOYOSHI, Kazuhiro YAMAZAKI