Patents by Inventor Hideto Tanaka
Hideto Tanaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096615Abstract: Described herein is a technique capable of acquiring, monitoring, and recording the progress of the reaction between a substrate and a reactive gas contained in a process gas in a process chamber during the processing of the substrate. According to the technique, there is provided a substrate processing apparatus including: a process chamber accommodating a substrate; a process gas supply system configured to supply a process gas into the process chamber via a process gas supply pipe; an exhaust pipe configured to exhaust an inner atmosphere of the process chamber; a first gas concentration sensor configured to detect a first concentration of a reactive gas contained in the process gas in the process gas supply pipe; and a second gas concentration sensor configured to detect a second concentration of the reactive gas contained in an exhaust gas in the exhaust pipe.Type: ApplicationFiled: December 1, 2023Publication date: March 21, 2024Applicant: Kokusai Electric CorporationInventors: Akinori TANAKA, Hideto TATENO, Sadayoshi HORII
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Patent number: 11564365Abstract: The object of the present invention is to provide a spinach line with the novel feature of solid petioles at harvest time. As a result of developing many progeny lines having petioles in which the hollow portion is relatively small over many years, a spinach line having solid petioles at harvest time was constructed.Type: GrantFiled: September 3, 2020Date of Patent: January 31, 2023Assignee: SAKATA SEED CORPORATIONInventor: Hideto Tanaka
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Publication number: 20220041056Abstract: An on-vehicle interface apparatus includes a touch screen and an I/F controller. The I/F controller stores a first message and a second message having a lower urgency level in association with respective events. The I/F controller displays operation switches including operation switches regarding traveling of a vehicle irrespectively of the events on the touch screen, and, in response to occurrence of an event, displays a corresponding message on the touch screen. The I/F controller, in response to detection of a touch operation on a display region of the first message during display of the first message, outputs to the vehicle controller a signal that instructs execution of the driving control corresponding to the first message.Type: ApplicationFiled: August 2, 2021Publication date: February 10, 2022Inventors: Yuchi Yamanouchi, Hideto Tanaka, Masaharu Kinoshita, Daisuke Naitou, Kei Kawasaki, Takuto Munekata, Takao Shinohara
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Publication number: 20200396932Abstract: The object of the present invention is to provide a spinach line with the novel feature of solid petioles at harvest time. As a result of developing many progeny lines having petioles in which the hollow portion is relatively small over many years, a spinach line having solid petioles at harvest time was constructed.Type: ApplicationFiled: September 3, 2020Publication date: December 24, 2020Inventor: Hideto TANAKA
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Publication number: 20180022126Abstract: The print object holding tool has a holder that holds a print object at two opposing parts thereof, a horizontal axis rotary mechanism that rotates the print object held by the holder about an axis of rotation horizontally situated; and a vertical axis rotary mechanism that rotates the print object held by the holder about an axis of rotation vertically situated.Type: ApplicationFiled: July 12, 2017Publication date: January 25, 2018Applicant: MIMAKI ENGINEERING CO., LTD.Inventors: Eiji Miyashita, Hiroyoshi Takano, Hideto Tanaka
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Publication number: 20170105382Abstract: The object of the present invention is to provide a spinach line with the novel feature of solid petioles at harvest time. As a result of developing many progeny lines having petioles in which the hollow portion is relatively small over many years, a spinach line having solid petioles at harvest time was constructed.Type: ApplicationFiled: October 14, 2016Publication date: April 20, 2017Inventor: HIDETO TANAKA
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Patent number: 8783820Abstract: A printer is provided to improve the conveying accuracy of a Y-bar, thus improving printed image quality. The printer includes the Y-bar that extends in a first direction above a flatbed on which a medium is mounted, holds an ink droplet ejecting head unit so that the head unit is movable in the first direction, and is held so as to be movable with respect to the flatbed in a second direction perpendicular to the first direction. The printer includes a drive mechanism that conveys the Y-bar in the second direction, a drive control device that carries out a drive control of the drive mechanism, and a measuring device that directly measures an amount of movement of the Y-bar with respect to the flatbed. The drive control device corrects controlled variables of the drive mechanism based on the amount of movement of the Y-bar measured by the measuring device.Type: GrantFiled: May 27, 2010Date of Patent: July 22, 2014Assignee: Mimaki Engineering Co., Ltd.Inventors: Masanori Itoh, Tadashi Kishida, Yoshito Yamaguchi, Hideto Tanaka
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Publication number: 20120182336Abstract: A printer is provided to improve the conveying accuracy of a Y-bar, thus improving printed image quality. The printer includes the Y-bar that extends in a first direction above a flatbed on which a medium is mounted, holds an ink droplet ejecting head unit so that the head unit is movable in the first direction, and is held so as to be movable with respect to the flatbed in a second direction perpendicular to the first direction. The printer includes a drive mechanism that conveys the Y-bar in the second direction, a drive control device that carries out a drive control of the drive mechanism, and a measuring device that directly measures an amount of movement of the Y-bar with respect to the flatbed. The drive control device corrects controlled variables of the drive mechanism based on the amount of movement of the Y-bar measured by the measuring device.Type: ApplicationFiled: May 27, 2010Publication date: July 19, 2012Applicant: MIMAKI ENGINEERING CO., LTD.Inventors: Masanori Itoh, Tadashi Kishida, Yoshito Yamaguchi, Hideto Tanaka
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Publication number: 20100151359Abstract: A separator 10 includes a separator body 11 and a collector 12. The separator body 11 prevents mixed flow of fuel gas and oxidizer gas. The collector 12 is formed from a metal lath MR in which the angle between the direction of formation of strand portions (through-hole formation portions) for forming through holes in a meshy, step-like arrangement and the direction of formation of bond portions (connection portions) for connecting the strand portions to one another is about 60 degrees. By virtue of this, the thickness of the collector 12 can be increased through reduction in pitch P. Thus, a good gas supply performance is ensured through reduction in pressure loss of introduced gas, and water generated in an MEA 30 can be well drained by capillary action which arises in the through holes.Type: ApplicationFiled: August 25, 2008Publication date: June 17, 2010Applicants: TOYOTA SHATAI KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Hideto Tanaka, Kazunari Moteki
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Publication number: 20100055530Abstract: Each of collectors 22 of an electrode structure 20, which partially constitutes a polymer electrolyte fuel cell, is formed from a metal lath MR having a large number of through-holes. A stopping portion 22a in which the through-holes are reduced in diameter is formed at a peripheral end portion of the collector 22. The peripheral end portion of the collector 22 is folded; subsequently, the folded peripheral end portion is pressed, thereby forming the stopping portion 22a. A resin seal portion 23 for sealing introduced fuel gas and oxidizer gas is formed integrally with the stopping portions 22a by insert molding which is performed such that an injected molten resin encloses the stopping portions 22a. The resin seal portion 23 formed integrally with the stopping portions 22a can reliably prevent inflow of the molten resin toward central portions of the collectors 22.Type: ApplicationFiled: February 28, 2008Publication date: March 4, 2010Applicants: TOYOTA SHATAI KABUSHIKI KAISHA, TOYOTA JIDOSHA KABUSHIKI KAISHAInventors: Kousuke Kawajiri, Hideto Tanaka, Tomoyuki Takamura, Yoshinori Shinozaki, Kazutaka Iizuka, Mikio Wada, Chisato Kato, Nobuo Kanai
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Publication number: 20100020129Abstract: A printer includes a first drive sub-assembly and a second drive sub-assembly detachably provided on the first drive sub-assembly. The first drive sub-assembly includes a bed configured to support a material to be printed, a first engaging member, and a front-rear direction moving mechanism provided on one side of the bed and configured to move the first engaging member along a front-rear direction. The second drive sub-assembly includes a guide bar having a longitudinal direction substantially perpendicular to the front-rear direction, a right-left direction moving mechanism configured to move a printer head along the longitudinal direction of the guide bar, and a second engaging member engaging with the first engaging member to move the guide bar along the front-rear direction.Type: ApplicationFiled: October 7, 2009Publication date: January 28, 2010Applicant: MIMAKI ENGINEERING CO., LTD.Inventors: Hideto Tanaka, Takashi Kiuchi, Shigeru Kato
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Patent number: 7618117Abstract: A printer includes a first drive sub-assembly and a second drive sub-assembly detachably provided on the first drive sub-assembly. The first drive sub-assembly includes a bed configured to support a material to be printed, a first engaging member, and a front-rear direction moving mechanism provided on one side of the bed and configured to move the first engaging member along a front-rear direction. The second drive sub-assembly includes a guide bar having a longitudinal direction substantially perpendicular to the front-rear direction, a right-left direction moving mechanism configured to move a printer head along the longitudinal direction of the guide bar, and a second engaging member engaging with the first engaging member to move the guide bar along the front-rear direction.Type: GrantFiled: June 21, 2006Date of Patent: November 17, 2009Assignee: Mimaki Engineering Co., Ltd.Inventors: Hideto Tanaka, Takashi Kiuchi, Shigeru Kato
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Publication number: 20070229589Abstract: A printer includes a first drive sub-assembly and a second drive sub-assembly detachably provided on the first drive sub-assembly. The first drive sub-assembly includes a bed configured to support a material to be printed, a first engaging member, and a front-rear direction moving mechanism provided on one side of the bed and configured to move the first engaging member along a front-rear direction. The second drive sub-assembly includes a guide bar having a longitudinal direction substantially perpendicular to the front-rear direction, a right-left direction moving mechanism configured to move a printer head along the longitudinal direction of the guide bar, and a second engaging member engaging with the first engaging member to move the guide bar along the front-rear direction.Type: ApplicationFiled: June 21, 2006Publication date: October 4, 2007Applicant: Mimaki Engineering Co., Ltd.Inventors: Hideto Tanaka, Takashi Kiuchi, Shigeru Kato
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Patent number: 7259044Abstract: In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.Type: GrantFiled: December 23, 2004Date of Patent: August 21, 2007Assignee: Shinko Electric Industries Co., Ltd.Inventors: Tetsuichiro Kasahara, Hideto Tanaka
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Patent number: 7178233Abstract: A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.Type: GrantFiled: December 4, 2003Date of Patent: February 20, 2007Assignees: Mitsui Mining & Smelting Co., Ltd., Suzuki Co., Ltd.Inventors: Toshiyuki Nakamura, Hideto Tanaka, Akira Ichiryu, Motonobu Takahashi, Masahito Ishii, Daisuke Arai
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Publication number: 20050101055Abstract: In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.Type: ApplicationFiled: December 23, 2004Publication date: May 12, 2005Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.Inventors: Tetsuichiro Kasahara, Hideto Tanaka
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Patent number: 6875630Abstract: In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the die-pad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.Type: GrantFiled: October 24, 2002Date of Patent: April 5, 2005Assignee: Shinko Electric Industries Co., Ltd.Inventors: Tetsuichiro Kasahara, Hideto Tanaka
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Publication number: 20040111882Abstract: A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.Type: ApplicationFiled: December 4, 2003Publication date: June 17, 2004Inventors: Toshiyuki Nakamura, Hideto Tanaka, Akira Ichiryu, Motonobu Takahashi, Masahito Ishii, Daisuke Arai
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Patent number: 6623812Abstract: A reflector is disclosed which enables bright image display with a wide angle of view and can be efficiently fabricated by a a simplified process. The reflector includes a resin layer having at its surface microscopic projections and depressions and formed by application of a coating composition containing a binder resin and crosslinked resin particles.Type: GrantFiled: February 22, 2000Date of Patent: September 23, 2003Assignee: Sharp Kabushiki KaishaInventors: Hideto Tanaka, Hiromasa Minamino, Hirokazu Kaji, Masashi Ohata, Mamoru Seio
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Publication number: 20030082854Abstract: In a method of manufacturing a lead frame for use in a leadless package such as a quad flat non-leaded package (QFN), a base frame is first formed which includes a region for resin-molding a plurality of semiconductor elements to be mounted on one surface of the base frame, the region being partitioned into land shapes, and in which a die-pad portion and lead portions around the diepad portion are defined severally for the individual semiconductor elements to be mounted in each of the partitioned regions for resin-molding. Next, an adhesive tape is attached to the other surface of the base frame, and subsequently a cut portion is provided at a portion corresponding to a region between two adjacent partitioned regions for resin-molding, of the adhesive tape.Type: ApplicationFiled: October 24, 2002Publication date: May 1, 2003Inventors: Tetsuichiro Kasahara, Hideto Tanaka